High-voltage-resistant and high-energy-density capacitor and preparation method thereof

A technology with high energy storage density and capacitors, applied in the direction of multilayer capacitors, fixed capacitor electrodes, fixed capacitor dielectrics, etc., can solve the problems of poor semiconductor integration process compatibility, large capacitor volume, and low capacitor energy storage density, etc., to achieve optimal orientation. and the effects of electrical properties, high energy storage density, and high-efficiency preparation

Active Publication Date: 2013-07-24
欧阳俊
2 Cites 22 Cited by

AI-Extracted Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of low capacitor energy storage density, large capacitor volume, environmental friendliness requirem...
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Method used

[0055] Carry out dielectric thermogram and spectrum test to film capacitor, in the temperature r...
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Abstract

The invention relates to a high-voltage-resistant and high-energy-density capacitor and a preparation method thereof. The high-voltage-resistant and high-energy-density capacitor comprises a substrate, a bottom electrode, a dielectric layer and a top electrode, wherein Si or SiO2/Si is taken as the substrate; the bottom electrode is a metal film, a conductive oxide film or a combination of both; the dielectric layer consists of a BaTiO3 ferroelectric film; and the top electrode is a metal film point electrode. A metal target or/and conductive oxide target is adopted, and a single target is used for depositing a metal film or a conductive oxide film, or depositing the meal film and the conductive oxide film in sequence on the substrate in a radio-frequency or direct current magnetron sputtering way; a ceramic BaTiO3 target is adopted, and a BaTiO3 layer is deposited on the bottom electrode in a radio-frequency magnetron sputtering way; and a metal target is adopted, and the top electrode is deposited in a radio-frequency magnetron sputtering way. The film capacitor prepared with the method has the advantages of small size, high voltage resistance and breakdown field strength Eb of higher than 1000kV/cm; the practical discharging energy density is not less than 10J/cm<3>; and the loss is low, and the dielectric performance is kept stable when the frequency and temperature change.

Application Domain

Thin/thick film capacitorFixed capacitor electrodes +2

Technology Topic

Film capacitorRadio frequency +11

Image

  • High-voltage-resistant and high-energy-density capacitor and preparation method thereof
  • High-voltage-resistant and high-energy-density capacitor and preparation method thereof
  • High-voltage-resistant and high-energy-density capacitor and preparation method thereof

Examples

  • Experimental program(2)
  • Effect test(1)

Example Embodiment

[0035] Example 1
[0036] Heat the substrate to 200-500℃ through the heating wire, adjust the revolution motor so that the substrate is facing the Ti target, turn on the RF power of the Ti target, and adjust the power density of the Ti target to 2-5W/cm 2, a Ti metal film with a thickness of 20-100 nm was prepared as the transition layer between the electrode Pt and the Si matrix.
[0037] Adjust the revolution motor so that the substrate is in the position facing the Pt target, turn on the RF power supply of the Pt target, and adjust the power density of the Pt target to 2-5W/cm 2 , Pt metal films with a thickness of 80-500 nm were prepared.
[0038] Then, oxygen with a flow rate of 10-40sccm is introduced into the chamber, and the valve plate valve of the equipment is adjusted to keep the chamber pressure at 0.3-3pa. Adjust the revolution motor so that the substrate is facing the BaTiO 3 Target position, turn on BaTiO 3 Target RF power supply, tuned BaTiO 3 The power density of the target is 2.5-10W/cm 2 , to prepare BaTiO with a thickness of 200 nm-5 μm 3 The thin film serves as the dielectric layer of the thin film capacitor.
[0039] The top electrode was deposited by radio frequency magnetron sputtering using a gold foil target. The sputtering atmosphere is air, and the diameter of the top electrode is controlled at 20-500 μm.

Example Embodiment

[0040] Example 2
[0041] All films were prepared at medium and low temperature (≤500°C).
[0042] Using a single target to perform radio frequency magnetron coaxial sputtering in sequence, including the following steps:
[0043] (i) Matrix treatment:
[0044] Choose Si or SiO 2 /Si was used as the substrate of the film capacitor, which was ultrasonically cleaned with acetone and alcohol and dried by blowing. Heat it to 200-500°C.
[0045] (ii) Deposition of metal thin films on the substrate:
[0046] Using metal Ti target and Pt target, it is completed by radio frequency magnetron sputtering. The sputtering atmosphere is pure Ar, the gas flow is controlled at 20-100sccm, the gas pressure is 0.3-3Pa, and the target power density is 2-5W/cm 2 , the total film thickness is controlled at 100-600nm.
[0047] (iii) Deposition of conductive oxide films:
[0048] Using perovskite LaNiO 3 The target is completed by radio frequency magnetron sputtering. The sputtering atmosphere is Ar and O 2 , Ar gas flow is controlled at 20-100sccm, O 2 The flow rate is controlled at 10-40sccm, and the target power density is 2.5-10W/cm 2. LaNiO 3 The thickness of the buffer layer is controlled at 100-400nm.
[0049] (iv) Deposition of dielectric layer:
[0050] Using ceramic BaTiO 3 The target is completed by radio frequency magnetron sputtering. The sputtering atmosphere is Ar and O 2 , Ar gas flow is controlled at 20-100sccm, O 2 The flow is controlled at 10~40sccm, BaTiO 3 The power density of the target is 2.5-10W/cm 2 , BaTiO 3 The thickness of the dielectric layer is controlled at 200nm-5μm.
[0051] (v) Deposition of the top electrode on the dielectric layer.
[0052] Using gold foil targets or other metal targets, it is done by photolithography or mask sputtering. The steps of preparing the electrode by photolithography are as follows: apply glue on the surface of the film, perform photolithography on it with a mask, put the sample into the chamber for magnetron sputtering, and then remove the residual glue. The steps of preparing electrodes by sputtering with a mask plate are as follows: a mask plate with electrode shape and size is covered on the film, sputtering is performed directly by a sputtering apparatus, and the sputtering atmosphere is air. The diameter of the top electrode is controlled at 20-500 μm.

PUM

PropertyMeasurementUnit
Thickness100.0 ~ 1000.0nm
Thickness200.0nm
Diameter20.0 ~ 500.0µm

Description & Claims & Application Information

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