Halogen-free flame-retardant prepolymer and prepreg and laminated board made from same
A prepreg and prepolymer technology, which is applied in the fields of integrated circuit packaging, electronic materials, high-frequency, high-speed and high-density interconnection, can solve the problems of failing to reach UL94V-0 level, high flame retardant effect, low phosphorus content, etc., and achieve Excellent moisture and heat resistance and heat resistance and low thermal expansion coefficient, excellent moisture and heat resistance and heat resistance, the effect of low thermal expansion coefficient
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Embodiment 1
[0027] Take 160g of bisphenol A dicyanate resin monomer, 20g of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (hereinafter referred to as DOPO), 10-(2,5-di Hydroxyphenyl)-10-hydrogen-9-oxa-10-phosphaphenanthrene-10-oxide (hereinafter referred to as DOPO-HQ) 18g and 10-(2,5-dicarboxypropyl)-9,10 - Put 2 g of dihydro-9-oxo-10-phosphaphenanthrene-10-oxide (hereinafter referred to as DDP) into the reaction bottle, slowly heat it to 140°C in an oil bath, and keep stirring for 6 hours , and cooled to room temperature after the reaction was complete.
Embodiment 2
[0029] Take 130g of tetramethylbisphenol F cyanate resin monomer, 40g of DOPO, 20g of DOPO-HQ and 10g of DDP into the reaction bottle, slowly heat to 130°C with an oil bath, and keep stirring for 12 hours. After the reaction is completed Cool to room temperature.
Embodiment 3
[0031] Take 150g of bisphenol A dicyanate resin monomer, 30g of DOPO, 14g of DOPO-HQ and 6g of DDP into the reaction bottle, slowly heat up to 120°C with an oil bath, and keep stirring for 12 hours. After the reaction is completed, cool to room temperature.
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