Preparation method of aluminum-based composite material with low thermal expansion coefficient

A technology of aluminum-based composite materials and low thermal expansion coefficient, which is applied in the field of in-situ reaction preparation/Al composite material preparation and low thermal expansion coefficient aluminum-based composite materials, can solve the problems of high cost and complicated process, Achieve uniform distribution, good wettability and low thermal expansion coefficient

Inactive Publication Date: 2013-09-25
镇江创智特种合金科技发展有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] Through the retrieval of existing patent technical literature, it is found that the current patents on high-silicon-aluminum-based composite materials for electronic packaging are mainly concentrated on composite materials reinforced with external particles; for example, Chinese Patent No. 200610011693. SiCp/Al electronic packaging material method"), this patented technology uniformly mixes SiC powder and Al powder or Al alloy powder at a volume ratio of 30-85:70-15, and

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  • Preparation method of aluminum-based composite material with low thermal expansion coefficient
  • Preparation method of aluminum-based composite material with low thermal expansion coefficient
  • Preparation method of aluminum-based composite material with low thermal expansion coefficient

Examples

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example 1

[0033] Example 1 Al-SiO 2 Phases of composite materials prepared by system in situ reaction

[0034] Al powder and SiO 2 The powder is mixed evenly according to the mass ratio of 2.3:1, and then the powder is put into the ball mill for ball milling. The uniform powder is pressed under a pressure of 30MPa. Before pressing, apply anhydrous alcohol to the inside of the mold and the upper side of the pressure rod, and release the mold after holding the pressure for 6 minutes; sinter the pressed sample in a window-type vacuum furnace. , the sintering temperature is 700°C, the sintering time is 7h, the furnace is cooled after sintering, and the sintered sample is annealed at 450°C for 2.5h; figure 1 Shown is the XRD pattern of the sample sintered at 700°C. It can be seen that the mechanism reaction at this temperature is Al+SiO 2 →Al 2 o 3 +Si has been completely reacted, and the in-situ reaction of the material produces Al 2 o 3 phase and Si phase, which confirms...

example 2

[0035] Example 2 In-situ 42wt.% (Al 2 O 3 +Si) / Al aluminum matrix composite

[0036] Al powder and SiO 2 The powder is mixed evenly according to the mass ratio of 2.7:1, and then the powder is put into the ball mill for ball milling. Press under a pressure of 30MPa. Before pressing, apply water-based sodium stearate on the inner side of the mold and on the pressure rod, and release the mold after holding the pressure for 6 minutes; sinter the pressed sample in a window-type vacuum furnace for sintering. The temperature is 800°C, the sintering time is 7h, and the furnace is cooled after sintering; the sintered sample is annealed at 400°C for 3h; figure 2 a shows the low-magnification SEM image of the prepared composite material, it can be seen that the Al generated in situ by the material 2 o 3 Particles, evenly distributed and dense; figure 2 b shows the high-magnification SEM image, and the in-situ generated Si phase and Al can be seen 2 o 3The interface be...

example 3

[0037] Example 3 In-situ 42wt.% (Al 2 O 3 +Si) / Al aluminum matrix composite

[0038] Al powder and SiO 2 The powder is mixed evenly according to the mass ratio of 2.7:1, and then the powder is put into the ball mill for ball milling. Press under a pressure of 60MPa. Before pressing, smear anhydrous alcohol on the inner side of the mold and on the pressure rod, and release the mold after holding the pressure for 5 minutes; sinter the pressed sample in a window-type vacuum furnace for sintering, and the sintering temperature is 1000°C, the sintering time is 6h, and the furnace is cooled after sintering; the sintered sample is annealed at 500°C for 2h; image 3 Shown are the SEM image and EDS energy spectrum analysis image of the prepared composite material, from image 3 In a, it can be seen that the matrix of the samples obtained at higher sintering temperature is relatively dense compared with the composite material prepared at medium temperature, and compared wit...

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Abstract

The invention relates to an aluminum-based composite material, particularly relating to a preparation method of an aluminum-based composite material with low-thermal expansion coefficient. In the invention, aluminum powder with the powder granularity of 200 meshes and amorphous silicon dioxide powder are mixed in a ball-milling pot. Stainless steel balls different in diameter are put into the pot according to a certain ball to powder ratio. The mixture is then subjected to ball milling for a period in a planetary ball mill rotating at a certain speed; the ball-milled powder is put into a steel mould, the internal side of which and a pressure lever are coated with anhydrous alcohol or a release agent. The powder is slightly compacted and the surface is scraped flat, and then the powder is compacted with a certain pressure; the compacted sample is heated to the sintering temperature in a certain temperature-rising speed in a vacuum furnace, preserved for a period and cooled in the furnace under a vacuum condition. The sintered sample is detected for microstructure and performance.

Description

technical field [0001] The present invention relates to an aluminum-based composite material, in particular to a method for preparing an aluminum-based composite material with a low thermal expansion coefficient, and in particular relates to the in-situ reaction preparation (Si+Al 2 o 3 ) / Al composite material preparation method. Background technique [0002] Aluminum matrix composites have the advantages of high specific strength, specific stiffness, low thermal expansion coefficient and good wear resistance, and have broad application prospects in aerospace, electronics, automobiles, optics, sports and other fields; especially as electronic packaging The high-silicon aluminum-based composite material of the material has the advantages of light weight, good thermal conductivity, low linear thermal expansion coefficient, etc., and can be matched with semiconductor materials. In the process of use, it will not cause premature failure due to thermal cracking, which has becom...

Claims

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Application Information

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IPC IPC(8): C22C1/05C22C21/00
Inventor 张松利张振坤赵玉涛陈刚张涛
Owner 镇江创智特种合金科技发展有限公司
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