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Production processes of packaging adhesive film with ultra-low ionic mobility and photovoltaic component

A technology of ion mobility and encapsulation film, which is applied in the field of photovoltaic power generation accessories to achieve the effects of improving blending compatibility, improving poor mechanical properties and fast response

Inactive Publication Date: 2013-10-09
CHANGZHOU UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The present invention proposes a new production process for packaging adhesive films with low ion mobility in view of the defects of existing packaging materials in the PID test

Method used

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  • Production processes of packaging adhesive film with ultra-low ionic mobility and photovoltaic component
  • Production processes of packaging adhesive film with ultra-low ionic mobility and photovoltaic component
  • Production processes of packaging adhesive film with ultra-low ionic mobility and photovoltaic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Adhesive layer: in terms of mass fraction, in 90 parts of ethylene-vinyl acetate copolymer, 5 parts of polyvinyl butyral mixed resin, add 5 parts of polypropylene glycol diglycidyl ether, 0.05 parts of 2-hydroxy-4-n- Octyloxybenzophenone, 0.05 part bis-2,2,6,6-tetramethylpiperidinol sebacate, 0.03 part β-(3,5-di-tert-butyl-4-hydroxyphenyl ) n-octadecyl propionate, 0.03 part of pentaerythritol distearyl diphosphite, 0.4 part of vinylethoxysilane, 0.4 part of tert-butyl peroxide 3,5,5-trimethylhexanoate.

[0045] Isolation layer: In terms of mass fraction, in 90 parts of dimethyl polysiloxane and 10 parts of ethylene-methyl acrylate copolymer mixed resin, add 0.5 parts of pentaerythritol distearyl diphosphite, 0.4 parts of peroxide 3 , tert-butyl 5,5-trimethylhexanoate.

[0046] The adhesive layer composition and the ion isolation layer composition are respectively mixed, melt-extruded, and cast into a film, and then the two films are stacked according to a thickness rat...

Embodiment 2

[0048] Adhesive layer: In terms of mass fraction, add 15 parts of phenyl glycidyl ether, 0.05 parts of 2-(2'-hydroxy- 3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole, 0.05 part of 2,4-dihydroxybenzophenone, 0.05 part of poly[1-(2'-hydroxyethyl base)-2,2,6,6-tetramethyl-4-hydroxypiperidine succinate], 0.05 part poly{[6-[(1,1,3,3-tetramethylbutyl)amino ]]-1,3,5-triazine-2,4-[(2,2,6,6,-tetramethyl-piperidinyl)imino]-1,6-hexylenediene[(2, 2,6,6-Tetramethyl-4-piperidinyl)imino]}, 0.05 part of triphenyl phosphite, 0.05 part of tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl ) propionate] pentaerythritol ester, 5 parts of γ-methacryloxypropyltrimethoxysilane, 10 parts of 1,1-(t-butyldiperoxy)-3,3,5-trimethylcyclohexyl alkyl.

[0049] Isolation layer: In terms of mass fraction, add 0.1 part of tetrakis[β-(3,5-di-tert-butyl- 4-Hydroxyphenyl)propionate]pentaerythritol ester, 5 parts of 1,1-(t-butyldiperoxy)-3,3,5-trimethylcyclohexane. Perform the same operation as in Example 1 t...

Embodiment 3

[0051] Adhesive layer: In terms of mass fraction, in 70 parts of ethylene-vinyl acetate copolymer and 5 parts of polyvinyl butyral mixed resin, add 10 parts of allyl glycidyl ether, 0.1 part of 2-(2'-hydroxy -3',5'-dipentylphenyl)benzotriazole, 0.1 parts of 2-hydroxy-4-n-octyloxybenzophenone, 5 parts of bis(2,2,6,6-tetramethyl -4-piperidinyl) sebacate, 0.05 parts n-octadecyl β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate, 5 parts pentaerythritol distearyl diphosphite Alcohol esters, 0.2 parts γ-aminopropyltriethoxysilane, 0.1 parts vinylethoxysilane, 5 parts tert-butyl peroxy-2-ethylhexyl carbonate .

[0052] Isolation layer: In terms of mass fraction, add 5 parts of tetrakis[β-(3,5-di-tert-butyl 4-hydroxyphenyl) propionate] pentaerythritol ester, 5 parts Peroxidation -2-Ethylhexyl tert-butyl carbonate . Perform the same operation as in Example 1 to obtain a 0.6 mm thick encapsulation film E-3 (the thickness ratio of the adhesive layer to the isolation layer is 1:3) a...

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Abstract

The invention relates to a solar cell packaging adhesive film having low ionic mobility and belongs to the technical field of photovoltaic power generation fittings. The solar cell packaging adhesive film with low ionic mobility is formed by compounding a bonding layer adhesive film with an ion isolation layer in a certain proportion; the thickness proportion of the bonding layer to the ion isolation layer is (1:1)-(1:5); the thickness of the packaging adhesive film is 0.5-0.8 mm. According to the invention, the ion isolation layer is innovatively introduced; on one hand, the isolation layer has high insulativity of polyolefin elastomers, such as POE (Polyolefin Elastomer) and EPDM (Ethylene-Propylene-Diene Monomer); on the other hand, because of a hydrogen bond in a siloxane structure, the blending compatibility of the packaging adhesive film with other high-molecular polymers is greatly increased; meanwhile polymer linear polysiloxane is modified by using an ethylene-acrylate polymer; the poor mechanical property phenomenon of polysiloxane can be greatly improved.

Description

technical field [0001] The invention relates to a novel ultra-low ion mobility encapsulation adhesive film and a production process of a photovoltaic module thereof, belonging to the technical field of photovoltaic power generation accessories. Background technique [0002] Photovoltaic power generation technology is an important component of new energy development in the 21st century. After half a century of development, photovoltaic power generation is developing in the direction of large-scale and integrated, in order to improve the power generation efficiency of large-scale photovoltaic array power stations. However, in practical applications, it is found that with the increase of the number of series modules, the power generation efficiency of the battery modules at the output end of the photovoltaic array decreases rapidly. This phenomenon is called the potential induced degradation phenomenon, or PID (Potential Induced Degradation) for short. The reason for this pheno...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J123/08C09J129/14C09J4/02C08L83/04C08L83/07C08L23/08
Inventor 方永勤许亮吕新宇赵刚
Owner CHANGZHOU UNIV
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