Patterned composite ceramic layer printed wiring substrate for optical and electronic devices

A technology of composite ceramics and electronic devices, applied in the field of electronics, can solve problems such as difficult heat transfer, electrical conduction short circuit, etc., and achieve the effects of solving heat dissipation problems, good electrical isolation and thermal isolation, and high withstand voltage breakdown performance.

Active Publication Date: 2016-04-20
浙江云隐科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the multiple optical and / or electronic devices are coupled to a ceramic component with a single interface, it will cause difficulty in heat transfer between the coupled optical and / or electronic devices, and may cause electrical conduction short circuit

Method used

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  • Patterned composite ceramic layer printed wiring substrate for optical and electronic devices
  • Patterned composite ceramic layer printed wiring substrate for optical and electronic devices
  • Patterned composite ceramic layer printed wiring substrate for optical and electronic devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] as attached figure 1 As shown, the patterned composite ceramic layer printed circuit board for optical and electronic devices described in this embodiment includes an aluminum or aluminum alloy substrate 10 on which a pressure-resistant and high-thermal-conduction substrate is formed. and the composite ceramic layer 30 is selectively etched through a mask to form a plurality of isolation bases 50; and a metal circuit layer (not shown in the figure) is formed on the isolation bases. The step of the composite pressure-resistant ceramic layer adopts the following process, and its reaction system is AlCl 3 -H 2 O-NH 3 -O 2 -H 2 , the reaction temperature is 420-450°C, the working pressure is 1200Pa, where AlCl 3 The flow rate is 50ml / min, H 2 The flow rate of O is 10-20ml / min, O 2 The flow rate is 15-20ml / min, NH 3 The flow rate is 25-30ml / min, H 2 The flow rate is 500ml / min, and the film thickness is 200μm. The breakdown voltage of the structure obtained by this ...

Embodiment 2

[0027] as attached figure 2 As shown, the patterned composite ceramic layer printed circuit board for optical and electronic devices described in this embodiment includes an aluminum or aluminum alloy substrate 10 on which a pressure-resistant and high-thermal-conduction substrate is formed. A composite ceramic layer 30; an aluminum transition layer 20 is provided between the aluminum or aluminum alloy substrate 10 and the composite ceramic layer 30, and the composite ceramic layer 30 is selectively etched through a mask to form a plurality of isolation bases 50; And a metal circuit layer (not shown in the figure) is formed on the isolation base. Wherein, the step of the aluminum transition layer adopts the following process: vacuumize to 5.0×10 - 4 Pa, into the vacuum coating chamber with a purity of 99.99% Ar, a flow rate of 20sccm, and keep the working vacuum in the vacuum coating chamber at 50Pa, turn on a pair of intermediate frequency sputtering power supplies with al...

Embodiment 3

[0029] as attached image 3 As shown, the patterned composite ceramic layer printed circuit board for optical and electronic devices described in this embodiment includes a copper or copper alloy substrate 10, and a pressure-resistant and high thermal conductivity substrate is formed on the copper or copper alloy substrate 10. There is an active brazing layer 40 between the copper or copper alloy substrate 10 and the composite ceramic layer 30, and the composite ceramic layer 30 is selectively etched through a mask to form a plurality of isolation bases 50 ; and a metal circuit layer (not shown in the figure) is formed on the isolation base. The composite ceramic layer is composed of beryllium oxide and aluminum oxide. The composite ceramic layer is made by powder sintering method, the sintering temperature is 1850-2000° C., and the thickness of the composite ceramic layer is 200 μm. The composite ceramic layer is bonded to the surface of the copper or copper alloy substrate ...

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Abstract

The invention relates to a patterned composite ceramic layer printed circuit substrate for optical and electronic devices. The patterned composite ceramic layer printed circuit substrate comprises a metal substrate, wherein a composite ceramic layer that is voltage-withstanding and is high in thermal conductivity; multiple isolation bases are formed by selective etching performed on the composite ceramic layer through a mask; and a metal circuit layer is formed on every isolation base. The patterned composite ceramic layer printed circuit substrate for optical and electronic devices has a metal substrate in a relatively large size, can accommodate multiple optical and / or electronic devices, and is provided with good electrical isolation and thermal isolation between the multiple optical and / or electronic devices.

Description

technical field [0001] The invention belongs to the field of electronic technology, and more specifically, the invention relates to a patterned composite ceramic layer printed circuit substrate for optical and electronic devices. Background technique [0002] Devices used in optics and / or electronics, such as integrated circuits or laser diodes, require the use of thermally conductive materials for heat transfer. For this purpose, a metallic base body is used, for example a copper base body, and an electrical isolation is often required between the optical and / or electronic components and the metal base body. And some ceramic materials have higher heat transfer efficiency and are electrically insulating. For this purpose, highly thermally conductive ceramic materials are frequently used as intermediate materials for providing electrical isolation while still maintaining thermal conductivity between the optical and / or electronic components and the metal base body. In order ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/03H05K1/05
Inventor 高鞠
Owner 浙江云隐科技有限公司
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