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A method for additively preparing high-adhesion and high-conductivity circuits

A high-conductivity, high-adhesion technology, which is applied in the direction of improving the metal adhesion of insulating substrates, forming conductive patterns, and secondary processing of printed circuits, can solve the problems that the electrical properties cannot meet the requirements and the adhesion of the lines is reduced. Achieve excellent adhesion, protect the environment, and simplify the process

Inactive Publication Date: 2016-08-10
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Wires with high electrical performance need long-term electroless plating, and long-term electroless plating will greatly reduce the adhesion of the line; if the electroless plating time is reduced to ensure adhesion, the electrical performance cannot meet the requirements

Method used

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  • A method for additively preparing high-adhesion and high-conductivity circuits
  • A method for additively preparing high-adhesion and high-conductivity circuits

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] (1) Preparation of functional ink: Mix 0.1 bisphenol A epoxy resin, 0.1 conductive carbon black, 0.05 chitosan, 0.45 methyl ethyl ketone, and 0.3 ethyl acetate, stir at 300 rpm for 24 hours, Control the stirring temperature not to exceed 10°C to prevent the epoxy resin from curing.

[0033] (2) The base material is commercially available PET with a thickness of 0.05 μm, which needs to be soaked in 0.5% sodium stearate solution for 30 minutes before use, washed and dried for use.

[0034] (3) Laser printing circuit mask on PET substrate.

[0035] (4) Immerse the substrate after printing the mask in the functional ink for 1min, so that the ink can evenly infiltrate the surface. Take it out and place it in an oven at 70°C for 2h.

[0036] (5) Put the dried substrate in ethyl acetate, and cooperate with ultrasound to dissolve the line mask, and the functional ink on the mask will also fall off together. Wash and dry after taking out.

[0037] (6) Place in 0.02mol / L sodi...

Embodiment 2

[0043] (1) Preparation of functional ink: Mix 0.05 polyvinyl butyral, 0.05 bisphenol A epoxy resin, 0.1 fumed silica, 0.1 polyacrylic acid, and 0.7 ethanol, and stir at 500 rpm 24h, control the stirring temperature not to exceed 10°C to prevent the epoxy resin from curing.

[0044] (2) The base material is commercially available PI with a thickness of 0.05 μm. It needs to be soaked in 0.5% sodium stearate solution for 30 minutes before use, and then dried after cleaning.

[0045] (3) Screen-print the mask pattern on the PI substrate.

[0046] (4) Immerse the substrate after printing the mask in the functional ink for 1min, so that the ink can evenly infiltrate the surface. Take it out and place it in an oven at 70°C for 2h.

[0047] (5) Put the dried substrate in ethyl acetate, and cooperate with ultrasound to dissolve the line mask, and the functional ink on the mask will also fall off together. Wash and dry after taking out.

[0048] (6) Place in 0.05mol / L silver nitrate...

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Abstract

The invention provides a method of preparing a circuit with high adhesive force and high conductivity by using the additive process. The method comprises the following steps that a mask of a circuit diagram is prepared on base material in a printing or photoetching mode, and the area where the conducting circuit is located is exposed; ink or slurry having the ionic adsorption function coats the mask through the processes of spin coating, dip coating, spray coating and the like and forms an adsorption layer after being dried; the base material coated with the ink or the slurry is immersed in specific solvent, the diagram of the mask is dissolved away, and the adsorption layer with the circuit diagram is obtained; the base material is immersed in catalytic ion solution, adsorbs catalytic ions, and is cleaned after being taken out; finally, metallization of the circuit is conducted by placing the base material in chemical plating solution, and the conducting circuit with the required diagram is obtained. As for the method, corrosion of metal is not needed, materials are saved, meanwhile, pollution to the environment is lowered, the number of the production steps is reduced, and therefore production cost is lowered. By means of adjustment of the formula of the functional ink or the functional slurry, the obtained conducting circuit and the base material can be tightly combined, and electrical properties can also meet the requirements of a printed-circuit board.

Description

technical field [0001] The invention belongs to the field of printed electronics, and specifically relates to a method for preparing circuits with high adhesion and high conductivity by using an additive process. Background technique [0002] The manufacture of conductive lines in traditional printed circuit boards uses a photolithographic etching process. Specifically, a mask is prepared on a copper clad laminate by photolithography, and the copper layer is selectively etched under the protection of the mask to expose the required lines. Graphics, to get conductive lines. However, the photolithographic etching method has many disadvantages such as large waste of materials, heavy environmental protection pressure, many production processes, and high production costs. The emerging printed electronics process uses the printing process to quickly print functional ink or paste on organic or inorganic substrates to form various electronic components and electronic circuits. It h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/38H05K3/10
Inventor 杨振国常煜
Owner FUDAN UNIV
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