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Preparation method of water-soluble polystyrene-silicon dioxide core-shell type composite particle

A technology of polystyrene particles and silicon dioxide, applied in chemical instruments and methods, other chemical processes, polishing compositions containing abrasives, etc., can solve the problems of high cost of reagents, unsuitability for large-scale production, long reaction time, etc. , to achieve the effect of reducing production cost, reducing production risk and shortening reaction time

Active Publication Date: 2014-01-08
SHANGHAI XINANNA ELECTRONICS TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Most current PS-SiO 2 The preparation of core-shell composite particles requires an alcohol system or a water-alcohol mixed system to better disperse the organic phase. However, most of the polishing fluids used in the market use water as a solvent, and the existing preparation methods are not in line with this; In addition, SiO in existing preparation methods 2 Most of the shells are obtained by TEOS hydrolysis method, the reaction time is long, the reagent cost is high; and it is dangerous, not suitable for industrial large-scale production

Method used

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  • Preparation method of water-soluble polystyrene-silicon dioxide core-shell type composite particle
  • Preparation method of water-soluble polystyrene-silicon dioxide core-shell type composite particle
  • Preparation method of water-soluble polystyrene-silicon dioxide core-shell type composite particle

Examples

Experimental program
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Effect test

Embodiment 1

[0035] Preparation of polystyrene-silica core-shell composite particles:

[0036](1) Add 1 gram of cationic polystyrene particles (average particle size 140nm) to every 50ml, 0.4wt% aqueous solution of poly-4-styrene sulfonate (PSS), after ultrasonic dispersion and adsorption for 20min, centrifuge, separate, Washing removes unadsorbed surfactant; Then add water to make an aqueous solution of polystyrene particles modified by PSS surface, wherein the concentration of polystyrene particles modified by PSS surface is 1wt%;

[0037] (2) Prepare an aqueous solution of trimethylchlorosilane (TMCS) and silicic acid, and adjust the pH value to 10 with potassium hydroxide aqueous solution with a concentration of 6wt% (if excessive potassium hydroxide aqueous solution is added during the adjustment process, nitric acid aqueous solution or hydrochloric acid can be used) The aqueous solution is reversed to ensure that the pH value is 10), and the alkaline aqueous solution of silicic acid ...

Embodiment 2

[0042] Preparation of polystyrene-silica core-shell composite particles:

[0043] (1) Add 1 gram of cationic polystyrene particles (average particle size 140nm) to every 50ml of 0.4wt% PSS aqueous solution, after ultrasonic dispersion and adsorption for 20min, remove unadsorbed surfactant by centrifugation, separation and washing; then add water Make the aqueous solution of the polystyrene particle through PSS surface modification, wherein the concentration of the polystyrene particle through PSS surface modification is 1wt%;

[0044] (2) Prepare an aqueous solution of TMCS and silicic acid, and adjust the pH value to 10 with a potassium hydroxide aqueous solution with a concentration of 6wt%, to obtain an alkaline aqueous solution of silicic acid treated with TMCS, wherein the concentration of silicic acid (in terms of SiO 2 Calculated) is 4wt%, the concentration of linker TMCS is 0.2wt%;

[0045] (3) Take 100 mL of the aqueous solution of PSS surface-modified polystyrene pa...

Embodiment 3

[0049] Preparation of polystyrene-silica core-shell composite particles:

[0050] (1) Add 1 gram of cationic polystyrene particles (average particle size 140nm) to every 50ml of 0.4wt% PSS aqueous solution, after ultrasonic dispersion and adsorption for 20min, remove unadsorbed surfactant by centrifugation, separation and washing; then add water Make the aqueous solution of the polystyrene particle through PSS surface modification, wherein the concentration of the polystyrene particle through PSS surface modification is 1wt%;

[0051] (2) Prepare an aqueous solution of TMCS and silicic acid, and adjust the pH value to 10 with a potassium hydroxide aqueous solution with a concentration of 6wt%, to obtain an alkaline aqueous solution of silicic acid treated with TMCS, wherein the concentration of silicic acid (in terms of SiO 2 Calculated) is 4wt%, the concentration of linker TMCS is 0.2wt%;

[0052] (3) Take 100 mL of the aqueous solution of PSS surface-modified polystyrene pa...

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Abstract

The invention relates to a preparation method of a water-soluble polystyrene-silicon dioxide core-shell type composite particle. The preparation method comprises the following steps: (1), preparing a polystyrene particle water solution of which the surface is modified by a surfactant; (2), preparing the water solution of a coupling agent and silicic acid, regulating the pH (potential of hydrogen) by a pH regulating agent, so as to obtain an alkaline silicic acid water solution treated by the coupling agent; (3), regulating the polystyrene particle water solution of which the surface is modified by the surfactant, prepared in the step (1), to be alkaline, under a mechanical stirring heating condition, dropwise adding the alkaline silicic acid water solution treated by the coupling agent, prepared in the step (2), and carrying out a polymerization reaction; and (4), stopping heating after the reaction, keeping on stirring, cooling to a normal temperature, thus obtaining the polystyrene-silicon dioxide core-shell type composite particle; and the preparation method has the characteristics of being low in cost and easy for production.

Description

technical field [0001] The invention relates to a preparation method of water-soluble polystyrene-silicon dioxide core-shell composite particles, which belongs to the field of chemical mechanical polishing liquid. Background technique [0002] VLSI has become an important symbol to measure a country's level of science and technology and industrial development, and it is also a field where the world's major industrial countries are most competitive. Chemical mechanical polishing (CMP) is one of the key technologies in the VLSI manufacturing process. In CMP polishing fluid, abrasive is an important factor affecting the quality of the polished surface. For the polishing of copper and some low-k materials, due to their low mechanical strength and Mohs hardness, traditional abrasives (such as silicon oxide, aluminum oxide, cerium oxide, etc.) can easily cause serious mechanical damage, which greatly improves the material Surface roughness. In order to reduce the scratches and ...

Claims

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Application Information

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IPC IPC(8): C08G83/00C09K3/14C09G1/02
Inventor 邢星王良咏刘卫丽宋志棠谢华清
Owner SHANGHAI XINANNA ELECTRONICS TECH
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