A method for making shiitake mushroom cultivation material by using hickory production and processing waste
The technology of a shiitake mushroom cultivation material and a production method is applied in the field of production of shiitake mushroom cultivation materials, which can solve the problems of polluting the environment, difficult recycling of fruit shells, and increased production costs, and achieve the effects of good air permeability, strong water retention, and growth promotion
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0029] Mode 1: In this embodiment, the shiitake mushroom cultivation material includes the following components and mass proportions: 10% of hickory tree branch chips, 18% of cattail shell chips, 50% of fruit shell chips, 17% of bran, 3% of bean cake, superphosphate 1%, 1% gypsum powder, both are the quality of dry matter, and the sum of the proportioning is 100%.
[0030] Production Method:
[0031] ①Sunning: Expose the raw materials to the sun for 2 days before mixing, use ultraviolet light to kill some bacteria in the raw materials, and at the same time decompose and volatilize the antibacterial substances;
[0032] ② Pre-wet: firstly mix the hickory branch chips, cattail shell chips, and fruit shell chips evenly in a dry state, and then pre-wet with water (fully soaked);
[0033] ③ Stacking and fermentation: Pile the wet material into a trapezoidal pile with a height of 1.2m, a width of 3m, and a length of 5m. At the bottom of the pile, the air hole density is 1 / m 3 , a...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com