Cerate composite additive and solidification liquid for copper foil surface solidification treatment and application method of cerate composite additive and solidification liquid

A composite additive and surface curing technology, which is applied in the field of cerium salt composite additives and curing liquid for copper foil surface curing treatment, can solve the problems of side corrosion, pollution of the environment, and decreased bonding force between copper foil and insulating substrate.

Active Publication Date: 2014-01-15
JIANGSU MINGFENG ELECTRONIC MATERIALS CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The ordinary galvanizing process can only solve the problem of heat resistance, but does not completely solve the problem of corrosion resistance of the copper foil; when the galvanized copper foil is etched, side erosion will occur, resulting in the bonding force between the copper foil and the insulating substrate In severe cases, the copper foil may even fall off from the insulating substrate. This is one of the main performance gaps between domestic electrolytic copper foil and foreign high-end products.
In addition, because the cyanide zinc plating

Method used

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  • Cerate composite additive and solidification liquid for copper foil surface solidification treatment and application method of cerate composite additive and solidification liquid
  • Cerate composite additive and solidification liquid for copper foil surface solidification treatment and application method of cerate composite additive and solidification liquid
  • Cerate composite additive and solidification liquid for copper foil surface solidification treatment and application method of cerate composite additive and solidification liquid

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Embodiment Construction

[0020] The present invention will be described in detail below in conjunction with specific embodiments.

[0021] The overall process flow of copper foil surface treatment is as follows:

[0022] Raw foil → degreasing → washing with water → removing oxide film → washing with water → roughening → washing with water → curing → washing with water → passivation → washing with water → hot air drying → coating with silane coupling agent. The additive of the present invention is used in the surface curing treatment of copper foil Process.

[0023] Preparation of curing fluid

[0024] Recipe 1: First add 500ml of deionized water to a 1 liter electroplating tank, and then add 130g accurately weighed zinc sulfate heptahydrate, 35g nickel sulfate, 45g sodium sulfate, 30-50g ammonium sulfate, and 0.4-0.7 cerium sulfate. g, 8-15mL of ammonia (20%), adjust the pH to 3-4, and finally dilute the volume to 1L with deionized water to make the required solidification liquid.

[0025] Recipe 2: First add...

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Abstract

The invention discloses a cerate composite additive and a solidification liquid for copper foil surface solidification treatment, and an application method of the cerate composite additive and the solidification liquid. The additive is characterized by comprising cerium sulfate, ammonium sulfate and ammonium hydroxide, wherein the addition amount of cerium sulfate in each liter of the solidification liquid is 0.1-1.0g, the addition amount of ammonium sulfate is 10-60g, and the addition amount of ammonium hydroxide is 5-20mL with the concentration of 20%. According to the additive, the characteristic absorption function of rare earth ions is utilized, a cladding layer grains are refined, the surface is smooth, the inoxidizability and the corrosion resistance of a copper coil are improved, and conditions are provided for continuous development of the industry. The composite additive also has the characteristics of low cost and conduction easiness, the conventional process is convenient and feasible to transform, no extra processes are needed to be added, and any great process route transformation is not needed.

Description

Technical field [0001] The invention relates to the curing treatment of the surface of copper foil, in particular to a cerium salt composite additive for curing the surface of the copper foil, a curing liquid and an application method thereof. Background technique [0002] At present, the copper foil surface treatment process adopted by various copper foil manufacturers at home and abroad can generally be summarized as: original foil—pretreatment—roughening treatment—curing (heat resistant barrier) treatment—antioxidation treatment— -Surface treatment. [0003] Among them, curing treatment is the process of plating a thin layer of single metal, binary or multiple alloy on the surface of copper foil. According to customer requirements, the types of main salt and additives of the plating solution can be adjusted to obtain different colors (cured nickel (black), cured zinc) The solidified layer of nickel alloy (gray white) and solidified copper (light red)) is solidified by different...

Claims

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Application Information

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IPC IPC(8): C25D3/56
Inventor 唐云志王艳谭育慧张萌
Owner JIANGSU MINGFENG ELECTRONIC MATERIALS CO LTD
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