Cerate composite additive and solidification liquid for copper foil surface solidification treatment and application method of cerate composite additive and solidification liquid

Abstract

The invention discloses a cerate composite additive and a solidification liquid for copper foil surface solidification treatment, and an application method of the cerate composite additive and the solidification liquid. The additive is characterized by comprising cerium sulfate, ammonium sulfate and ammonium hydroxide, wherein the addition amount of cerium sulfate in each liter of the solidification liquid is 0.1-1.0g, the addition amount of ammonium sulfate is 10-60g, and the addition amount of ammonium hydroxide is 5-20mL with the concentration of 20%. According to the additive, the characteristic absorption function of rare earth ions is utilized, a cladding layer grains are refined, the surface is smooth, the inoxidizability and the corrosion resistance of a copper coil are improved, and conditions are provided for continuous development of the industry. The composite additive also has the characteristics of low cost and conduction easiness, the conventional process is convenient and feasible to transform, no extra processes are needed to be added, and any great process route transformation is not needed.

Description

Technical field [0001] The invention relates to the curing treatment of the surface of copper foil, in particular to a cerium salt composite additive for curing the surface of the copper foil, a curing liquid and an application method thereof. Background technique [0002] At present, the copper foil surface treatment process adopted by various copper foil manufacturers at home and abroad can generally be summarized as: original foil—pretreatment—roughening treatment—curing (heat resistant barrier) treatment—antioxidation treatment— -Surface treatment. [0003] Among them, curing treatment is the process of plating a thin layer of single metal, binary or multiple alloy on the surface of copper foil. According to customer requirements, the types of main salt and additives of the plating solution can be adjusted to obtain different colors (cured nickel (black), cured zinc) The solidified layer of nickel alloy (gray white) and solidified copper (light red)) is solidified by different...

AI Technical Summary

Problems solved by technology

The ordinary galvanizing process can only solve the problem of heat resistance, but does not completely solve the problem of corrosion resistance of the copper foil; when the galvanized copper foil is etched, side erosion will occur, resulting in the bonding force between the copper foil and the insulating substrate In severe cases, the copper foil may even fall off from the insulating substrate. This is one of the main performance gaps between domestic electrolytic copper foil and foreign high-end products.

In addition, because the cyanide zinc plating solution has good dispersion ability and deep plating ability, it has been widely used in industry since the beginning of the 20th century, but the plating solution is highly toxic, seriously pollutes the environment, and the recovery of the plating solution and wastewater treatment are difficult and costly. High, with the strengthening of people's awareness of environmental protection, electroplating is gradually developing in the direction of cyanide-free, so it is of great significance to study the surface treatment process of electrolytic copper foil

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