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Low-temperature curved high-strength plastic package glue and preparation method thereof

A high-strength, plastic-encapsulating adhesive technology, applied in adhesives, epoxy resin adhesives, electrical solid devices, etc., can solve the problems of unstable storage, insufficient glue strength, and generation of colloidal volatiles, and achieve a simple and environmentally friendly preparation method and good storage. Stability, improve the effect of explosion-proof function

Active Publication Date: 2014-02-05
ANTIAN XINBANG XIAMEN ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the curing temperature of the liquid epoxy resin plastic sealant used in the relay industry is basically higher than 110°C, the curing temperature is high and the curing speed is slow, and the low-cost relay plastic shell has poor temperature resistance, which easily leads to the performance degradation of the packaged product. And after curing, the glue has the problems of insufficient strength, low binding force, high volatility, poor control of glue oil, and unstable storage
[0005] In addition, most of the existing epoxy resin molding compounds contain silane coupling agents, which contain organic silicon, which will produce colloidal volatiles, affect the sensitivity of the internal contacts of the relay, and cause the relay to work abnormally

Method used

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  • Low-temperature curved high-strength plastic package glue and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A low-temperature curing high-strength plastic sealant of the present invention comprises the following components in parts by weight:

[0029] Bisphenol A type epoxy resin (NPEL-128E) 20 parts

[0030] Bisphenol F epoxy resin (NPEL-170) 36 parts

[0031] Nanoscale carbon black 0.2 parts

[0032] Latent hardener (FRX-1020) 15 parts

[0033] Defoamer (BYK-A555) 0.8 parts

[0034] Silica powder 10 parts

[0035] Talcum powder 8 parts

[0036] 8 parts zirconium silicate

[0037] Bisphenol A epoxy resin (NPEL-128E) has a viscosity of 12000-15000 cps and an epoxy equivalent of 184-190. Bisphenol F epoxy resin (NPEL-170) has a viscosity of 2000-5000 cps and an epoxy equivalent of 160-180. The defoamer (BYK-A555) is a silicone-free foam-breaking polymer solution. The particle size of talcum powder is 2500 mesh. The particle size of the zirconium silicate is 4 μm. The particle size of silica powder is 2500 mesh.

[0038] Bisphenol A epoxy resin (NPEL-128E) and bisphe...

Embodiment 2

[0044] A low-temperature curing high-strength plastic sealant of the present invention comprises the following components in parts by weight:

[0045] Bisphenol A type epoxy resin (NPEL-128E) 16 parts

[0046] Bisphenol F epoxy resin (NPEL-170) 42 parts

[0047] Nanoscale carbon black 0.5 parts

[0048] Latent hardener (FRX-1020) 30 parts

[0049] Defoamer (BYK-A555) 1 part

[0050] Silica powder 15 parts

[0051] Talc powder 5 parts

[0052] Zirconium silicate 10 parts

[0053] Bisphenol A epoxy resin (NPEL-128E) has a viscosity of 12000-15000 cps and an epoxy equivalent of 184-190. Bisphenol F epoxy resin (NPEL-170) has a viscosity of 2000-5000 cps and an epoxy equivalent of 160-180. The defoamer (BYK-A555) is a silicone-free foam-breaking polymer solution. The particle size of talcum powder is 2000 mesh. The particle size of the zirconium silicate is 3 μm. The particle size of silica powder is 2000 mesh.

[0054] The suppliers of the above-mentioned components ar...

Embodiment 3

[0060] A low-temperature curing high-strength plastic sealant of the present invention comprises the following components in parts by weight:

[0061] Bisphenol A type epoxy resin (NPEL-128E) 22 parts

[0062] Bisphenol F type epoxy resin (NPEL-170) 40 parts

[0063] Nano-scale carbon black 1 part

[0064] 2-heptadecyl imidazole 10 parts

[0065] Defoamer (BYK-A555) 0.1 parts

[0066] Silica powder 12 parts

[0067] Talc powder 10 parts

[0068] Zirconium silicate 5 parts

[0069] Bisphenol A epoxy resin (NPEL-128E) has a viscosity of 12000-15000 cps and an epoxy equivalent of 184-190. Bisphenol F epoxy resin (NPEL-170) has a viscosity of 2000-5000 cps and an epoxy equivalent of 160-180. The defoamer (BYK-A555) is a silicone-free foam-breaking polymer solution. The particle size of talcum powder is 3000 mesh. The particle size of the zirconium silicate is 5 μm. The particle size of silica powder is 3000 mesh.

[0070] The suppliers of the above-mentioned components ...

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Abstract

The invention discloses a low-temperature curved high-strength plastic package glue and a preparation method thereof. The low-temperature curved high-strength plastic package glue comprises the following components in parts by weight: 16-22 parts of bisphenol A epoxy resin, 35-42 parts of bisphenol F epoxy resin, 0.1-1 part of pigment, 10-30 parts of potential hardener, 0.1-1 part of deformer, 10-15 parts of silica powder, 5-10 parts of talcum powder and 5-10 parts of zirconium silicate. The low-temperature curved high-strength plastic package glue provided by the invention has the advantages of low temperature curing (about 80 DEG C), low volatility, high strength, no glue oil, excellent electrical properties and good airtightness, and also excellent storage stability.

Description

technical field [0001] The invention relates to a plastic sealant, in particular to a plastic sealant suitable for relay plastic packaging and a preparation method thereof. Background technique [0002] Packaging materials are the technical key to ensure the integration, modularization and miniaturization of electronic components. Whether it is a discrete device, or a semiconductor component such as a large-scale integrated circuit or a functional module, in order to avoid the interference of external dust, moisture, shock, vibration and chemical substances, etc., and to ensure the normal operation of the component, it is usually packaged or Insulation potting protection. [0003] A relay is a common electronic component. Liquid epoxy resin plastic sealant has the characteristics of insulation, high voltage resistance, high and low temperature resistance, high binding force, environmental protection and non-toxicity, etc. It is a commonly used relay plastic sealant. [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/04H01L23/29
Inventor 许炳仲
Owner ANTIAN XINBANG XIAMEN ELECTRONICS TECH
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