Curable resin composition for sealing optical semiconductor element and cured product thereof

A curable resin and optical semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electrical components, etc., can solve problems such as poor operability, inability to achieve vulcanization resistance, poor thermal cycle resistance, etc., and achieve excellent pot life Effect

Inactive Publication Date: 2014-05-07
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this regard, it can be dealt with by increasing the crosslinking density of the cured polysiloxane resin or adding aromatic organic groups such as phenyl in the molecule, but it will inevitably increase the hardness of the cured product, so the thermal cycle resistance is poor, and cracks are caused. (Cracking), adverse effects such as peeling from the substrate, and increase in aromatic organic groups, so there is concern about poor UV resistance
In addition, satisfactory sulfidation resistance cannot be achieved
[0004] In order to solve these problems, studies have been made on sealing materials using condensates of silicon compounds having epoxy groups and phenyl groups and epoxy resin curing agents, but they still cannot meet the requirements.
Furthermore, since the viscosity increase (pot life) after mixing these two liquids is fast, there is a problem that workability is poor

Method used

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  • Curable resin composition for sealing optical semiconductor element and cured product thereof
  • Curable resin composition for sealing optical semiconductor element and cured product thereof
  • Curable resin composition for sealing optical semiconductor element and cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0298] Hereinafter, the present invention will be described in more detail through synthesis examples and examples. In addition, this invention is not limited to these synthesis examples and Examples. In addition, each physical property value in the synthesis example was measured by the following method.

[0299] Weight average molecular weight: It measured by the GPC method under the following conditions, and calculated the weight average molecular weight in terms of polystyrene.

[0300] Various conditions of GPC

[0301] Manufacturer: Shimadzu Corporation

[0302] Chromatographic column: guard column SHODEX GPC LF-G LF-804 (3 pieces)

[0303] Flow rate: 1.0ml / min

[0304] Column temperature: 40°C

[0305] Solvent used: THF (tetrahydrofuran)

[0306] Detector: RI (Differential Refractive Index Detector)

[0307] Epoxy equivalent: measured by the method described in JIS K-7236.

[0308] Acid value: Measured by the method described in JIS K-2501.

[0309] Viscosity: M...

Synthetic example 1

[0310] Synthesis Example 1 (Synthesis example of polysiloxane-skeleton epoxy resin (B) producing silanol-terminated silicone oil (e) and epoxy group-containing silicon compound (f) through a two-stage production process)

[0311] (Manufacturing process 1)

[0312] 394 parts of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and polydimethyldiphenylsiloxane having a silanol group with a molecular weight of 1700 (measured by GPC) were put into the reaction vessel (with 0.18 mole of phenyl group per mole of methyl group), 475 parts, 4 parts of 0.5% KOH methanol solution, 36 parts of isopropanol, and the temperature was raised to 75°C. After heating up, the reaction was carried out under reflux for 10 hours.

[0313] (Manufacturing process 2)

[0314] After adding 656 parts of methanol, 172.8 parts of a 50% distilled water methanol solution was added dropwise over 60 minutes, and the reaction was continued for 10 hours under reflux.

[0315]After the reaction was completed, methan...

Synthetic example 2

[0316] Synthesis Example 2 (Synthesis example of polysiloxane-skeleton epoxy resin (B) that produces silanol-terminated silicone oil (e) and epoxy group-containing silicon compound (f) through a two-stage production process)

[0317] (Manufacturing process 1)

[0318] 444 parts of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and polydimethyldiphenylsiloxane having a silanol group with a molecular weight of 1700 (measured by GPC) were put into the reaction vessel (0.18 moles of phenyl groups per mole of methyl group) 400 parts, 3.6 parts of 0.5% KOH methanol solution, 32.4 parts of isopropanol, heated up to 75°C. After heating up, the reaction was carried out under reflux for 10 hours.

[0319] (Manufacturing process 2)

[0320] After adding 480 parts of methanol, 194.4 parts of a 50% distilled water methanol solution was added dropwise over 60 minutes, and the reaction was continued for 10 hours under reflux.

[0321] After the reaction was completed, methanol was recovered...

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Abstract

Provided is a resin composition that is extremely useful as a sealant for an optical semiconductor (such as an LED product) having excellent pot life and sulfur resistance. The curable resin composition for sealing an optical semiconductor comprises a curing catalyst having a melting point between 40 and 200 DEG C and an epoxy resin and/or epoxy resin curing agent. Preferably the epoxy resin curing agent is, for instance, polyvalent carboxylic acid resin (A)obtained by addition reaction of a dual end-type carbinol-modified silicone oil represented by formula (1), a polyhydric alcohol compound having two or more hydroxyl groups per molecule, and a compound having one carboxylic anhydride group per molecule. In formula (1), R1 is an alkylene group, and the like, R2 is an alkyl group, and the like, and m is an average value and is between 1 and 100. The formula (1) is defined in the specification.

Description

technical field [0001] The present invention relates to a curable resin composition suitable for encapsulation of optical semiconductor elements and a cured product thereof. Background technique [0002] As resins for sealing optical semiconductor elements such as LEDs (Light Emitting Diodes), liquid rings using bisphenol epoxy resins, alicyclic epoxy resins, etc. are used from the viewpoint of excellent mechanical strength and adhesive force. Oxygen resin composition (see Patent Document 1). In recent years, LEDs have been used in fields requiring high luminance, such as automotive headlights and lighting applications. Accordingly, UV resistance and heat resistance have been increasingly required especially for resins used to seal optical semiconductor elements. However, as described above, bisphenol-type epoxy resins, alicyclic epoxy resins, and the like are hardly said to have sufficient UV resistance and heat resistance, and may not be used in fields requiring high brig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/68C08G59/20C08G59/42H01L23/29H01L23/31H01L33/56
CPCC08G59/4269C08G59/681H01L23/296H01L33/56H01L2924/0002H01L2924/00
Inventor 宫川直房佐佐木智江设乐律子洼木健一川田义浩
Owner NIPPON KAYAKU CO LTD
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