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A kind of waterborne polyamide and its preparation method and application

A technology of polyamide and copolymerized polyamide, which is applied in the field of polyamide resin, can solve the problems of poor compatibility between sizing agent and matrix resin, affecting the mechanical properties of composite materials, and destroying the interfacial phase of composite materials, so as to achieve low cost of raw materials and low cost of equipment. Low requirements, the effect of improving the interface bonding strength

Inactive Publication Date: 2016-03-02
HUNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In the present invention, the general sizing agent for glass fiber / carbon fiber in the prior art is mainly epoxy resin and polyurethane. When used as a reinforcing material, it is easy to cause thermal decomposition when processed or used under high temperature conditions, causing damage to the interfacial phase of the composite material , especially when the glass fiber / carbon fiber reinforced polyamide resin, the compatibility between the sizing agent and the matrix resin is not good, resulting in a significant decrease in the interface strength, thereby affecting the mechanical properties of the composite material, based on the existence of the sizing agent in the prior art Defects, the third purpose is to provide an application of the water-based polyamide, the water-based polyamide has good water solubility, good film-forming performance, high heat resistance, and can be used as a sizing agent to effectively improve fiber sizing Comprehensive properties such as interfacial bonding between fiber and matrix resin, and water is used as a solvent, which is green and environmentally friendly

Method used

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  • A kind of waterborne polyamide and its preparation method and application
  • A kind of waterborne polyamide and its preparation method and application
  • A kind of waterborne polyamide and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Put 20 g of malic acid, 80 g of adipic acid, and 62.7 g of decanediamine into a vacuum oven, and dry at 60° C. for 12 hours. Put the dried raw material into a three-necked flask, add 150mL N,N-dimethylformamide and 50mL N-methylpyrrolidone into the flask as a solvent, prepolymerize at 80°C for 1 hour, raise the temperature to 110°C, add 12mL of Triphenyl phosphate, then add 20g of ethylenediamine weighed into 30mL pyridine, add the mixture dropwise into a three-necked flask, react for 0.5 hours, heat up to 125°C, react for 2 hours, cool, filter, and use Wash with methanol, filter two to three times and dry.

[0050] Put the above product into a flask filled with 800mL N,N-dimethylformamide, add 7.3g maleic anhydride and 3g 4-dimethylaminopyridine, stir and heat to 60°C and react for 2 hours, add precipitant butanone and Filter and wash several times to obtain carboxylated water-based polyamide resin.

[0051] 1. Dissolution performance test:

[0052] Take 2g of carbo...

Embodiment 2

[0058] Put 50 g of malic acid, 50 g of terephthalic acid, and 39.6 g of hexamethylenediamine into a vacuum oven, and dry at 60° C. for 12 hours. Put the dried raw material into a three-necked flask, add 150mL N, N-dimethylformamide and 50mL N-methylpyrrolidone into the flask as a solvent, prepolymerize at 70°C for 2 hours, raise the temperature to 110°C, add 12mL of Triphenyl phosphate, then add 20g of ethylenediamine weighed into 30mL of imidazole, add the mixture dropwise into a three-necked flask, react for 0.5 hours, raise the temperature to 135°C, react for 2 hours, cool, filter, and use Wash with methanol, filter two to three times and dry.

[0059] Put the above product into a flask filled with 600mL N,N-dimethylformamide, add 22.1g of phthalic anhydride and 3g of pyridine, stir and heat to 60°C, react for 2 hours, add precipitant butanone and filter, After washing for several times, the carboxylated water-based polyamide resin is obtained.

[0060] 1. Dissolution per...

Embodiment 3

[0067] Put 20 g of malic acid, 60 g of glutaric acid, and 39 g of 1,7-heptanediamine into a vacuum oven, and dry at 60° C. for 12 hours. Put the dried raw materials into a three-necked flask, add 150mL N,N-dimethylformamide and 50mL N-methylpyrrolidone into the flask as solvents, prepolymerize at 80°C for 1 hour, raise the temperature to 110°C, add 12mL of benzene phosphinic acid, then add 31g of diethylenetriamine into 30mL of pyridine, add the mixture dropwise into a three-necked flask, react for 0.5 hours, heat up to 125°C, react for 2 hours, cool, filter, Wash with methanol, filter two or three times and dry.

[0068] Put the above product into a flask containing 800mL N,N-dimethylformamide, add 8g maleic anhydride and 3g 4-dimethylaminopyridine, stir and heat to 60°C and react for 2 hours, add precipitant butanone and filter , Wash several times to obtain carboxylated water-based polyamide resin.

[0069] 1. Dissolution performance test:

[0070] Take 2g of carboxylate...

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Abstract

The invention discloses aqueous polyamide as well as a preparation method and an application thereof. The preparation method of the aqueous polyamide comprises steps of performing ternary polymerization on malic acid, binary acid and diamine and subsequently grafting carboxylic acid. The preparation method is simple, the raw materials are cheap, the prepared aqueous polyamide is excellent in filming property and high in thermal resistance, and effectively improves the comprehensive properties of boundary binding and the like of fibers and substrate resins when being used as a sizing agent.

Description

technical field [0001] The invention relates to a water-based polyamide resin and a preparation method and application thereof, belonging to the field of polyamide resins. Background technique [0002] Polyamide resins are generally polycondensed from dibasic acids and diamines. According to their solubility, they can be divided into solvent-type polyamides and non-solvent-type polyamides. Because of strong polar amide bonds and other groups, there are Hydrogen bonds, which have the characteristics of high-strength corrosion resistance, weather resistance, and solvent resistance, have been widely used in water-based inks, packaging materials, synthetic fibers, and coatings. [0003] All solvent-based polyamide resins are currently used. The early solvent-based polyamides are easily soluble in benzene and xylene, but the aromatic solution of this resin has a strong odor, pollutes the environment, and endangers the health of workers, which limits its further use. In recent ye...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G69/48D06M15/59C03C25/32C08J5/06C08J5/08C08L77/00D06M101/40
Inventor 李伟胡靖袁剑民欧阳婷
Owner HUNAN UNIV