Manufactured method of transistor based on graphene field effect
A technology of field-effect transistors and graphene, which is applied in the direction of transistors, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of unsatisfactory test results of graphene field-effect transistors and expensive processing methods, so as to save production costs,  The effect of low power consumption and small mass
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[0016] The present invention relates to graphene modification and a graphene-based compressive strain p-type field effect transistor manufacturing method, and the structure schematic diagram of the field effect transistor is as follows figure 1 shown, with a block doping concentration of 10 16 / cm 3 The n-type silicon wafer is used as the substrate, that is, the n-Si substrate, and the n-Si substrate is used as the back gate, and the back gate field effect transistor is prepared by a bottom-up processing method.
[0017] see figure 2 , figure 1 The fabrication steps of the graphene-based compressively strained P-type field effect transistor shown are as follows:
[0018] ① When the doping concentration is 10 16 / cm 3 Growth of 300 nm SiO by thermal dry oxidation on the surface of n-Si substrate 2 , control the temperature at 1000°C-1050°C for 20 minutes, such as figure 2 b.
[0019] ② To prevent SiO 2 If there are pollutants on the surface, first clean the SiO2 su...
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