Method for preparing carbon material and polyimide compounded sandwich film

A polyimide and film preparation technology, which is applied in the field of sandwich film preparation, can solve the problems of increased loss, poor mechanical properties of composite materials, and high preparation costs, and achieve reduced dielectric loss, excellent heat resistance, and good film-forming performance Effect

Inactive Publication Date: 2015-07-08
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The existing high-temperature-resistant and high-dielectric materials are mainly ceramic materials. Although the dielectric constant of ceramic materials can be large, they have disadvantages such as high density, hard texture, high sintering temperature, high preparation cost, and environmental pollution.
Polymer-based dielectric materials have attracted widespread attention due to their light weight, good flexibility, environmental friendliness, and low cost. However, the polymer-based composite materials currently prepared mainly have the following shortcomings: The material is unstable at high temperature; 2) In order to increase the dielectric constant, a large amount of fillers (high dielectric ceramics or conductive fibers) are usually added, which will make the mechanical properties of the composite material poor; 3) The addition of fillers makes Composite material forms a conductive path and losses increase dramatically

Method used

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  • Method for preparing carbon material and polyimide compounded sandwich film
  • Method for preparing carbon material and polyimide compounded sandwich film
  • Method for preparing carbon material and polyimide compounded sandwich film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Add carbon fiber to N,N-dimethylacetamide that can dissolve polyamic acid to form a 5% (wt / wt) suspension, stir at room temperature for 5 hours, take out 10 ml, and add 0.5 g 4,4'-diaminodiphenyl ether and 0.509g pyromellitic dianhydride were stirred at room temperature for 12h to polymerize. Take another 20ml of N,N-dimethylacetamide, add 0.5g of 4,4'-diaminodiphenyl ether and 0.509g of pyromellitic dianhydride, and stir at room temperature for 12h to polymerize. Inject 10ml of polyamic acid solution into the substrate (the amount of solution can be added to adjust the thickness of the film), put it in a vacuum drying oven and heat it to 90°C for 2 hours to remove the solvent and form a polyamic acid film. Keep the vacuum and lower the temperature to 70°C, pour 10ml of carbon fiber and polyamic acid mixed solution on the polyamic acid film, heat to 90°C, and remove the solvent for 2 hours under vacuum to form the second layer of film. Keep the vacuum and lower the tem...

Embodiment 2

[0024] In Example 1, the 4,4′-diaminodiphenyl ether was changed to 9,9-bis[4-(4-aminophenoxy)phenyl]fluorene, and other conditions remained unchanged. The maximum dielectric constant of the obtained material is 45, the maximum dielectric loss is 0.015, and the 5% degradation temperature of the film is 540°C.

Embodiment 3

[0026] The amount of carbon fiber N,N-dimethylacetamide mixed solution added in Example 1 was increased to 5ml, and other conditions remained unchanged. The maximum dielectric constant of the obtained material is 20, the maximum dielectric loss is 0.005, and the 5% degradation temperature of the film is 571°C.

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Abstract

The invention discloses a method for preparing a carbon material and polyimide compounded sandwich film. The method comprises the following steps: adding the carbon material into a solvent capable of dissolving polyamide acid to prepare carbon material suspension; adding diamine and bianhydride into the solvent capable of dissolving the polyamide acid, and polymerizing to generate a polyamide acid solution; directly adding the diamine and bianhydride into the carbon material suspension, and polymerizing for 3-24 hours to obtain a mixed solution of the carbon material and polyamide acid, adding the mixed solution into the solvent capable of dissolving the polyamide acid, and regulating the solid mass concentration in the mixed solution of the carbon material and polyamide acid to be 5 percent; pouring the polyamide acid solution to a substrate, and forming a polyamide acid film; pouring the mixed solution of the carbon material and polyamide acid on the polyamide acid film, and forming a second film layer; and pouring the polyamide acid solution on the second film layer, removing the solvent and curing.

Description

technical field [0001] The invention relates to a method for preparing a composite sandwich film of carbon material and polyimide with properties such as high temperature resistance, high dielectric constant and low dielectric loss. Background technique [0002] Polyimide (referred to as PI) is a class of polymers whose repeating structural units are imide groups. The traditional polyimide material has high temperature resistance, corrosion resistance, low dielectric constant and low dielectric loss, and high insulation performance. It is one of the organic polymer materials with the best comprehensive performance, and it is also the heat resistance level in the industrial field Highest functional material. With the development of society, especially the development of capacitors, materials are required to have the characteristics of high temperature resistance, flexibility, high dielectric constant and low dielectric loss. Polyimide is a heat-resistant flexible polymer ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/06B32B27/20B32B27/28B32B37/02C08G73/10C08K3/04C08J5/18
Inventor 林保平陈亚芹王俊川来常伟杨洪张雪勤孙莹刘玉荣
Owner SOUTHEAST UNIV
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