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Conductive structure cementing material and preparation method thereof

A technology of conductive structure and bonding material, applied in conductive adhesives, textiles and papermaking, fiber processing, etc., can solve the deterioration of structural bonding process and construction characteristics, the failure of high-performance structural bonding technology, reduce bonding The mechanical properties of the agent materials can be improved to achieve the effect of improving the difficulty of preparation technology, reducing the relative cost and easy engineering scale-up.

Active Publication Date: 2014-07-23
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

First, these metal particles generally do not contribute much to the structural properties (i.e., cohesive mechanical properties) and characteristic bonding properties (interfacial adhesion properties) of the bond material, so adding a large amount of metal particles reduces the bond material Second, adding a large amount of metal particles leads to an increase in the viscosity of the binder material, deteriorating the process and construction characteristics of structural bonding; third, a large amount of filling metal particles increases the cost of materials; fourth, for some weight In sensitive occasions such as aerospace, the presence of a large number of metal particles increases the quality of the adhesive joint, although this increase is not too large in absolute value
Due to the above problems, the current conductive adhesive materials are generally limited to some specific varieties and some specific applications, they are expensive, and usually have no chance with high-performance structural bonding technology

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] (1-1) Dispersing silver nanowires in ethanol or isopropanol or acetone or ethylene glycol or water to form a dispersion with a concentration of 5 mg / mL or 10 mg / mL;

[0030] (1-2) A surface density of 16g / m 2 or 8g / m 2 The nylon plain weave hollow fabric with a fiber diameter of 35 μm and an apparent thickness of 70 μm that constitutes the reinforced fabric is immersed in the dispersion of silver nanowires obtained in the above step (1-1) with a content of 5 mg / mL or 10 mg / mL, Pull out the liquid surface and dry or dry; turn it upside down and dip again, and determine the number of dips according to the loading capacity requirements, and finally obtain a conductive nylon fabric uniformly loaded with silver nanowires.

[0031] (1-3) Spread the conductive nylon fabric obtained from the above (1-2) with 3 layers, and the surface density is 240g / m 2 The epoxy resin film, grade SY-14 (product of Beijing Aeronautical Materials Research Institute), is compounded according to...

Embodiment 2

[0040] (2-1) Disperse the silver nanowires in ethanol to form a 5 mg / mL dispersion, and disperse the carboxy-modified carbon nanotubes in water or acetone or DMF to form a 2 mg / mL or 10 mg / mL dispersion;

[0041] (2-2) The above-mentioned (2-1) dispersion solution of carboxyl-modified carbon nanotubes (CNT) with a solid content of 2 mg / mL or 10 mg / mL is attached to the Area density 9g / m 2 or 14g / m 2 On the polyetherimide fiber or polyimide fiber or polyphenylene sulfide fiber forged fabric with a fiber diameter of 40 μm and an apparent thickness of 90 μm constituting the reinforced fabric; after drying, the CNT-loaded non-woven fabric Immerse the spun cloth in the ethanol dispersion with a silver nanowire content of 5mg / mL, pull it out of the liquid surface and dry it to obtain conductive polyetherimide fibers or polyimide fibers with silver nanowires and carbon nanotubes. Or polyphenylene sulfide fiber forged fabric intermediate state material. Repeat the above 4 times to ...

Embodiment 3

[0045] (3-1) The fiber diameter is 25μm, the thickness is 75μm, and the surface density is 18g / m 2 The glass fiber or polyethersulfone nonwovens are cleaned and treated by immersion into SnCl 2 and hydrochloric acid mixed solution sensitization, SnCl in the solution used 2 The concentration of hydrochloric acid is 8g / L or 15g / L, the concentration of hydrochloric acid is 5mL concentrated HCl / 1L water or 10mL concentrated HCl / 1L water, and the sensitization time is 5 minutes, 10 minutes, or 25 minutes; take it out and wash it and perform activation treatment. The activation treatment is to immerse the non-woven fabric in 0.3g / L or 1.5g / L or 7g / L PdCl 2 and 15g / L or 25g / L boric acid mixed aqueous solution, soak for 3 minutes or 10 minutes or 17 minutes, then take it out, wash it with water, and then immerse it in 5g / L or 10g / L or 17g / L NaH 2 PO 2 Soak in aqueous solution for 30 minutes.

[0046] (3-2) Make silver nitrate into a 5g / L or 15g / L aqueous solution, add 2mol / L NaOH ...

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Abstract

The invention relates to a conductive high-performance structure cementing material and a preparation technology thereof. The structure cementing material is prepared by compounding a conductive enhanced textile and an adhesive film, wherein the conductive enhanced fabric is prepared by comprising the following steps: firstly, selecting, or designing and preparing a woven or non-woven two-dimensional high-porosity fabric from microscale fibers, wherein the material and structure of the fabric need to play enhancement and toughening roles; by taking the fabric as a carrier, loading nanoscale conductive components on the surface of the fabric, to form a three-dimensional (stereoscopic) conductive seepage network structure, or directly performing conductive metal chemical plating treatment, to obtain a high-conductivity enhanced fabric; and then pre-impregnating the conductive fabric to prepare the conductive adhesive material through the adhesive material. After being applied in a structure adhesion situation, the conductive adhesive material can realize the integration of enhancement, toughening and conductivity of an adhesive joint.

Description

technical field [0001] The invention belongs to the technical field of structural bonding, and relates to a conductive and high-performance structural bonding material and a preparation method thereof. Background technique [0002] Based on polymer binder materials, structural bonding technology has a wide range of applications in the fields of machinery manufacturing, aerospace, electrical electronics, and energy equipment, including bonding between metal materials and non-metallic materials. Bonding, especially the bonding between heterogeneous materials, etc., also includes bonding of some special structures such as bonding of honeycomb structures. The basic technical requirement for glued joints is that the glued joint is firm and reliable, that is, good mechanical properties of the connection. This mainly refers to the strength, toughness and durability of the joint. In some specific occasions, the mechanical performance of the joint is also required. Good at the same ...

Claims

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Application Information

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IPC IPC(8): C09J9/02D06M11/83
Inventor 益小苏郭妙才赵中杰乔海涛关永军
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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