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Preparation method of epoxy resin board

An epoxy resin board and epoxy resin technology, applied in the field of epoxy resin board, can solve the problems of high temperature resistance, poor corrosion resistance, poor production base material, etc., and achieve not easy deformation, simple preparation process, high strength and The effect of high hardness

Active Publication Date: 2016-08-17
ANHUI HUASHENG TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous advancement of economy and technology, there are more and more various laboratories; various supporting platforms, that is, table tops, are needed in the complete set of equipment in the laboratory; High temperature, poor corrosion resistance, can not meet the requirements of some special conditions; therefore, for the table top synthesized by polymer composite materials, it is not only resistant to high temperature, but also resistant to acid and alkali, and has excellent corrosion resistance. The market prospect of this material is broad.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] The preparation method of a kind of epoxy resin plate proposed in this embodiment comprises the following steps: Weigh the following raw materials by weight: 5.5 parts of bisphenol F type epoxy resin, 4 parts of bisphenol A type epoxy resin, E-51 4.6 parts of epoxy resin, 13.3 parts of isophthalic unsaturated polyester resin, 2.5 parts of N-(3,4-dichlorophenyl)-N', N'-dimethylurea, 1.2 parts of imidazole microcapsule accelerator , 62 parts of filler, 2.8 parts of trimellitic anhydride, and 1.8 parts of methyltetrahydrophthalic anhydride; the filler includes by weight: 39 parts of high-purity quartz powder, 16 parts of aluminum hydroxide powder and 14 parts of marble powder, high-purity quartz powder Purity is SiO 2 99.5%, Fe 2 o 2 It is 0.005%, and the impurity of aluminum hydroxide powder is 0.03%; Bisphenol F type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin, isophthalic unsaturated polyester resin, N-( 3,4-dichlorophenyl)-N',N'-dimethylurea and micr...

Embodiment 2

[0015] The preparation method of a kind of epoxy resin plate proposed in this embodiment comprises the following steps: Weigh the following raw materials by weight: 3.4 parts of bisphenol F epoxy resin, 5 parts of bisphenol A epoxy resin, E-51 5.8 parts of epoxy resin, 12.5 parts of isophthalic unsaturated polyester resin, 3.9 parts of N-(3,4-dichlorophenyl)-N', N'-dimethylurea, 1.4 parts of TMTD microcapsule accelerator , 68 parts of filler, 1.1 parts of trimellitic anhydride, 2.5 parts of methyltetrahydrophthalic anhydride; the filler includes by weight: 40 parts of high-purity quartz powder, 13 parts of aluminum hydroxide powder and 8 parts of marble powder, high-purity quartz powder Purity is SiO 2 99.7%, Fe 2 o 2 It is 0.0024%, and the impurity of aluminum hydroxide powder is 0.45%; Bisphenol F type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin, isophthalic unsaturated polyester resin, N-( 3,4-dichlorophenyl)-N',N'-dimethylurea and microcapsule accelerato...

Embodiment 3

[0017] The preparation method of a kind of epoxy resin plate proposed in this embodiment comprises the following steps: Weigh the following raw materials by weight: 4.8 parts of bisphenol F type epoxy resin, 3 parts of bisphenol A type epoxy resin, E-51 6.7 parts of epoxy resin, 11.7 parts of isophthalic unsaturated polyester resin, 2.8 parts of N-(3,4-dichlorophenyl)-N',N'-dimethylurea, complexed with boron trifluoride amine 0.5 parts of microcapsule accelerator, 75 parts of filler, 1.5 parts of trimellitic anhydride, and 2.8 parts of methyltetrahydrophthalic anhydride; the filler includes by weight: 43 parts of high-purity quartz powder, 18 parts of aluminum hydroxide powder and 12 parts of Marble powder, high purity quartz powder purity is SiO 2 99.9%, Fe 2 o 2It is 0.0041%, and the impurity of aluminum hydroxide powder is 0.09%; Bisphenol F type epoxy resin, bisphenol A type epoxy resin, E-51 epoxy resin, isophthalic unsaturated polyester resin, N-( 3,4-dichlorophenyl)-...

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PUM

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Abstract

The invention discloses a preparation method for an epoxy resin board. The preparation method comprises the following steps: weighing a bisphenol F type epoxy resin, a bisphenol A type epoxy resin, an epoxy resin E-51, an isophthalic unsaturated polyester resin, N-(3,4-dichlorophenyl)N',N'-dimethyl urea, a microcapsule accelerant, a filling agent and a curing agent and subjecting the bisphenol F type epoxy resin, the bisphenol A type epoxy resin, the epoxy resin E-51, the isophthalic unsaturated polyester resin N-(3,4-dichlorophenyl)N',N'-dimethyl urea and the microcapsule accelerant to complex formulation and then to uniform mixing under stirring; adding the filling agent and the curing agent, carrying out uniform mixing under stirring, placing an obtained mixture on a flat mold, placing the flat mold on a vibration table for vibration, carrying out heating to 190 to 205 DEG C, then carrying out curing and heat insulation for 10 to 12 h and finally, carrying out room temperature curing for 5 to 8 d so as to obtain an epoxy resin board material; and cutting, polishing and sanding the epoxy resin board material so as to obtain the epoxy resin board. According to the invention, the epoxy resin board has the advantages of high temperature resistance, corrosion resistance, resistance to strong acid and alkali, high strength and hardness, uneasy deformation, simple preparation process and applicability to all kinds of laboratory platforms.

Description

technical field [0001] The invention relates to the technical field of epoxy resin boards, in particular to a preparation method of epoxy resin boards. Background technique [0002] With the continuous advancement of economy and technology, there are more and more various laboratories; various supporting platforms, that is, table tops, are needed in the complete set of equipment in the laboratory; High temperature, poor corrosion resistance, can not meet the requirements of some special conditions; therefore, for the table top synthesized by polymer composite materials, it is not only resistant to high temperature, but also resistant to acid and alkali, and has excellent corrosion resistance. The market prospect of this material is broad. . Contents of the invention [0003] The invention proposes a method for preparing an epoxy resin board, which is high temperature resistant, corrosion resistant, strong acid and alkali resistant, high in strength and hardness, not easil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/02C08L63/00C08L67/06C08K13/02C08K3/36C08K3/22C08K3/34C08K5/21C08G59/42
Inventor 盛义良
Owner ANHUI HUASHENG TECH HLDG
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