Thermosetting resin composition as well as prepreg and laminated plate manufactured by using thermosetting resin composition

A technology of resin composition and prepreg, which is applied in the field of thermosetting resin composition, prepreg and laminate, can solve the problems of insufficient heat resistance, difficulty in taking into account heat resistance, low dielectric constant, etc., and achieve low dielectric loss tangent, Effect of increasing glass transition temperature, excellent heat resistance and toughness

Active Publication Date: 2014-08-20
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the epoxy resins cured by these active ester resins all have the problem of insufficient heat resistance, and it is difficult to balance heat resistance with low dielectric constant and low dielectric loss tangent, so they cannot meet the requirements of practical application of materials

Method used

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  • Thermosetting resin composition as well as prepreg and laminated plate manufactured by using thermosetting resin composition
  • Thermosetting resin composition as well as prepreg and laminated plate manufactured by using thermosetting resin composition
  • Thermosetting resin composition as well as prepreg and laminated plate manufactured by using thermosetting resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment and

[0034] Embodiment and comparative example:

[0035] Examples 1-3 are the synthesis of active ester resins of the present invention, comparative example 1 is the synthesis of common phenolic active ester resins, examples 4-6 and comparative examples 2-5 are the preparation and physical property evaluation of thermosetting resin compositions. Unless otherwise specified below, "parts" represent "parts by weight", and "%" represent "% by weight".

Embodiment 1

[0037] Drop into N-(4-hydroxyphenyl)maleimide (40g, 0.21mol), phenol (160g, 1.70mol) and oxalic acid (10g) in the flask that thermometer, condensing tube, stirrer are installed, mix and stir After uniformity, place in a constant temperature water bath at 70°C; then, add formaldehyde solution (125 mL, phenol / aldehyde ratio: 1 / 0.8) dropwise to the flask over 0.5 hours under stirring. After the formaldehyde was added, the temperature was maintained at 70° C. and stirred for 15 hours. Next, the reaction product was dissolved and diluted with 400 mL of acetone, and then the reaction product was precipitated with 40% methanol aqueous solution. Repeat the above dissolution-precipitation operation 3 to 5 times, filter, separate and dry to obtain pure nitrogen-containing multifunctional phenolic compound.

[0038]Take 130 g of the multifunctional phenolic compound prepared by the above method and 500 g of methyl isobutyl ketone solvent and put them in a flask to mix and dissolve fully...

Embodiment 2

[0043] Drop into N-(4-hydroxyphenyl)maleimide (80g, 0.42mol), phenol (120g, 1.28mol) and oxalic acid (10g) in the flask that thermometer, fractionator, condenser, stirrer are installed After mixing and stirring evenly, place in a constant temperature water bath at 70°C. Then, under stirring, a formaldehyde solution (110 mL, 37% aqueous formaldehyde solution, phenol / aldehyde ratio of 1 / 0.8) was added dropwise to the flask over 0.5 hours. After the formaldehyde was added, the temperature was maintained at 60° C. and the stirring condition was maintained for 15 hours. Next, the reaction product was dissolved and diluted with 500 mL of acetone, and then the reaction product was precipitated with 40% methanol aqueous solution. Repeat the above dissolution-precipitation operation 3 to 5 times, filter, separate and dry to obtain pure nitrogen-containing multifunctional phenolic compound.

[0044] Take 142g of the multifunctional phenolic compound prepared by the above method and 60...

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PUM

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Abstract

The invention discloses a thermosetting resin composition comprising the following components in parts by solid weight: (a) 20-50 parts of active ester resin, (b) 10-60 parts of epoxy resin, and (c) 20-60 parts of allyl modified bismaleimide resin. A laminated plate manufactured by using the thermosetting resin composition disclosed by the invention has excellent heat resistance and toughness, can be used for significantly improving the glass-transition temperature of an epoxy resin composition after curing, has excellent low dielectric constants and low dielectric loss tangent, achieves significant effects, and has positive practical significance.

Description

technical field [0001] The invention relates to a thermosetting resin composition, and a prepreg and a laminate made of the resin composition, belonging to the technical field of electronic materials. Background technique [0002] In recent years, with the continuous advancement of high-speed and high-frequency technologies for information processing and information transmission, higher and higher requirements have been put forward for printed circuit substrate materials in terms of dielectric properties. To put it simply, printed circuit substrate materials need to have lower dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, expect to provide a kind of thermosetting resin composition, the printed circuit board material that uses this thermosetting resin composition to make can show sufficiently low low dielectric constant and low dielectric constant ...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L63/00C08G59/40B32B27/04B32B15/092
CPCB32B15/14B32B2260/021B32B2260/046B32B2307/306B32B2457/08C08G59/4042C08L63/00C08L2201/02C08L2201/08C08L2203/20C08L61/14C08K3/36
Inventor 何继亮马建崔春梅易强沈磊
Owner SHENGYI TECH SUZHOU
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