Laminated body, method for producing the same, printed wiring board, and composition for forming an underlayer
A manufacturing method and a technology for a laminate, which are applied in the manufacture of printed circuit precursors, printed circuits, printed circuits, etc., can solve the problems of poor high-frequency characteristics and complicated steps, and achieve the effects of excellent purification and adhesion.
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Embodiment 18
[0275] After heat-treating the laminate with the electroless-plated metal layer obtained in Example 4 at 150° C. / 15 minutes, on the surface of the metal layer of the laminate, a vacuum bonding machine (Meiji Seisakusho Co., Ltd.) Manufacture: MVLP-600), a dry resist film (manufactured by Hitachi Chemical Co., Ltd.; RY3315, film thickness 15 μm) was laminated at 70° C. and 0.2 MPa. Next, on the laminated body on which the dry resist film was laminated, a glass mask capable of forming the comb-shaped wiring specified in JPCA (Japan Printed Circuit Association)-ET01 (according to JPCA-BU01-2007) was adhered. The resist film was irradiated with light energy of 70mJ by using an exposure machine with a central wavelength of 405nm. Spray 1% Na on the exposed laminate with a spray pressure of 0.2MPa 2 CO 3 Aqueous solution for development. Then, the laminate is washed with water and dried to form a resist pattern for the semi-addition method on the metal layer.
[0276] Form a 10 ...
Embodiment 19～ Embodiment 27 and comparative example 3～ comparative example 4
[0292] According to Table 5 below, the composition for forming an underlayer was applied on a substrate by a spin coating method, and dried at 180° C. for 60 minutes. Thereby, an underlayer (thickness: 2.8 μm) was formed on the substrate.
[0293] Next, the substrate on which the underlayer was formed was placed in Alcup (Alcup) ACL (2-aminoethanol: 4.9% by mass, diethylenetriamine: 2.4% by mass, surfactant: 4.9% by mass, Uemura Industrial Co., Ltd.) 95 g and sodium hydroxide 5 g mixed liquid (pH value: 14) was immersed for 5 minutes, and then washed with water. Next, it was immersed in Alcup MAT-2 (manufactured by Uemura Industrial Co., Ltd.) as a Pd catalyst supply solution at 26°C for 5 minutes, and then at 37°C in Alcup as a reducing agent. (Alcup) MAB (manufactured by Uemura Industries Co., Ltd.) was immersed for 3 minutes, and then washed with water. Next, dip in Alcup (Alcup) MEL (manufactured by Uemura Industrial Co., Ltd.) as an activation treatment solution for 1 m...
Embodiment 28～ Embodiment 34
[0316] Using a rocking mill (rockingmill) RM-05 (SeiwaGiken (SeiwaGiken) Co., Ltd.), after inputting a sample amount of 60 g (using a 200 mL PP bottle), Under the conditions of 100 g of zirconia beads, 50 Hz, and 30 min, the samples charged according to the ratios in Table 6 below were dispersed to obtain silicon oxide dispersion liquid W1 to silicon oxide dispersion liquid W7.
[0317] In addition, "Aerosil (Aerosil) 200" in Table 6 was manufactured using the Aerosil company.
[0318] [Table 6]
[0319] Table 6
[0320] the solution
Metal oxide
Dispersant (surfactant)
W1
Aerosil 200 (50g)
none
Cyclopentanone (450g)
W2
Aerosil 200 (50g)
SOLSPERSE 18000 (20g)
Cyclopentanone (450g)
W3
Aerosil 200 (50g)
SOLSPERSE 21000 (20g)
Cyclopentanone (450g)
W4
Aerosil 200 (50g)
Sosperse (SOLSPERSE) 24000GR (20g)
Cyclopentanone (450g)
W5
Aerosil 200 (50g)
Sosperse (SOLS...
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