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Preparation method for environment-friendly epoxy molding composite material for encapsulating tantalum capacitor

A composite material, environmentally friendly technology, used in capacitor casings/packages, capacitor parts and other directions, to achieve the effect of increasing the glass transition temperature, reducing the coefficient of linear expansion, and improving moisture resistance

Active Publication Date: 2014-09-03
ZHEJIANG HENGYAO ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are few reports at home and abroad on environmentally friendly epoxy mold composite materials for tantalum capacitors, and there have been reports on non-environmentally friendly tantalum capacitor packaging polymer materials

Method used

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  • Preparation method for environment-friendly epoxy molding composite material for encapsulating tantalum capacitor
  • Preparation method for environment-friendly epoxy molding composite material for encapsulating tantalum capacitor
  • Preparation method for environment-friendly epoxy molding composite material for encapsulating tantalum capacitor

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Embodiment Construction

[0022] The present invention is further described by examples below.

[0023] The preparation method of the environment-friendly epoxy mold composite material for tantalum capacitor packaging provided by the invention comprises the following steps:

[0024] (1) Add water to the coupling agent, then dropwise add citric acid as a catalyst, and age at 80°C for 2 to 10 hours to obtain a coupling active monomer; use 0.3 to 0.6Mpa of air to couple the active monomer Spray into the stirring silica, and continue to stir for 10-60 minutes to obtain modified silica;

[0025] (2) Add epoxy resin, phenolic resin, flame retardant, curing accelerator, release agent and carbon black to the above-mentioned modified silica, at a temperature of 10-40°C at a rate of 500-1200r / min Stir for 30-60 minutes to obtain the mixture;

[0026] (3) The mixture is extruded through a twin-screw mixer, and then cooled to room temperature to obtain an environmentally friendly epoxy mold composite material. ...

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Abstract

The invention relates to preparation of an encapsulating material and aims at providing a preparation method for an environment-friendly epoxy molding composite material for encapsulating a tantalum capacitor. The method comprises the following steps: adding water in a coupling agent, then, dropwise adding nitric acid which is used as a catalyst, ageing at a constant temperature to obtain a coupling active monomer; spraying the coupling active monomer into stirring silicon dioxide by utilizing high-pressure air, and continuously stirring to obtain modified silicon dioxide; adding epoxy resin, phenolic resin, flame retardant, a curing promoter, a mould release agent and carbon black into the modified silicon dioxide, and stirring to obtain a material mixture; extruding the material mixture by virtue of a double-screw mixing mill, then cooling to the room temperature so as to obtain the environment-friendly epoxy molding composite material. The preparation method disclosed by the invention can be used for realizing goals of improving a glass transition temperature (improving heat resistance) and strengthening the welding resistance, goals of strengthening bonding strength, improving the humidity resistance, lowering a linear expansion coefficient and internal stress; moreover, the flame retardant effect is strengthened in a cooperative manner, and a novel environment-friendly flame-retardant material system is developed.

Description

technical field [0001] The invention relates to the preparation of packaging materials, in particular to a preparation method of an environment-friendly epoxy mold composite material for tantalum capacitor packaging. Background technique [0002] The technology of electronic components is constantly developing in the direction of thinning, miniaturization, high integration and three-dimensional. Tantalum capacitors are widely used in aerospace due to their significant advantages such as long life, high temperature resistance, high reliability, and excellent performance in filtering high-frequency harmonics, as well as wide operating temperature range and very high specific capacity, especially suitable for miniaturization. It has an irreplaceable position in the high-end electronic market in extreme conditions such as extreme conditions and in the electronic circuits of miniature electronic products (such as computers, mobile phones and digital cameras). [0003] At present...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L61/06C08K13/06C08K9/06C08K9/04C08K3/36C08K3/22C08K5/3492C08K3/04B29C47/92H01G9/08B29C48/92
CPCB29C47/92B29C48/40B29C48/92B29C2948/9259B29C2948/92704
Inventor 马和平
Owner ZHEJIANG HENGYAO ELECTRONICS MATERIAL
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