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A method of nickel-plating on the surface of electric discharge machining of electronic packaging aluminum-based composite materials

An aluminum-based composite material and electronic packaging technology, which is applied in the field of electroless nickel plating, can solve the problems of weak bonding between the coating and the substrate, increase processing procedures and costs, and achieve good surface quality of the coating, good bonding, and small influencing factors Effect

Active Publication Date: 2016-03-30
QIQIHAR XIANGKE NEW MATERIAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to solve the problem that the EDM surface of the electronic packaging aluminum matrix composite material needs to be ground and milled after the electric discharge machining of the existing electronic packaging aluminum matrix composite material, which increases the processing procedure and cost, and the plating layer and In order to solve the problem of weak bonding force of the substrate, a method for plating a nickel layer on the surface of the electric discharge machining of the aluminum matrix composite material for electronic packaging is provided

Method used

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  • A method of nickel-plating on the surface of electric discharge machining of electronic packaging aluminum-based composite materials
  • A method of nickel-plating on the surface of electric discharge machining of electronic packaging aluminum-based composite materials
  • A method of nickel-plating on the surface of electric discharge machining of electronic packaging aluminum-based composite materials

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specific Embodiment approach 1

[0037] Specific implementation mode 1: This implementation mode is a method for plating a nickel layer on the surface of electronic packaging aluminum-based composite materials by electrical discharge machining, which is specifically completed according to the following steps:

[0038] 1. Cleaning: First, immerse the electronic packaging aluminum matrix composite material processed by EDM into an ultrasonic cleaner filled with acetone, and ultrasonically clean it for 15min to 20min under the condition of a power of 250W~300W; then replace the ultrasonic cleaner acetone, ultrasonically cleaned for 10min to 15min at a power of 250W to 300W, and then cleaned with deionized water for 1 to 3 times to obtain the cleaned aluminum matrix composite material for electronic packaging processed by EDM;

[0039] 2. Acid etching: Soak the cleaned aluminum-based composite material for electronic packaging processed by EDM in nitric acid solution for 48s~52s, take it out and wash it with deion...

specific Embodiment approach 2

[0062] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the aluminum-based composite material for electronic packaging described in Step 1 is SiC with a volume fraction of SiC particles of 65%. p / Al composites. Other steps are the same as in the first embodiment.

specific Embodiment approach 3

[0063] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that in Step 1, the electronic packaging aluminum-based composite material processed by EDM is first immersed in an ultrasonic cleaning machine equipped with acetone. Ultrasonic cleaning at 300W for 20 minutes; then replace the acetone in the ultrasonic cleaning machine, ultrasonically clean at 300W for 15 minutes, and then use deionized water to clean 2 to 3 times to obtain the cleaned EDM Aluminum matrix composites for electronic packaging. Other steps are the same as those in Embodiment 1 or 2.

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Abstract

The invention provides a method for plating a nickel coating on the electrosparking surface of an electronic packaging aluminum-base composite material, relating to a method for chemically plating a nickel coating on the electrosparking surface of an aluminum-base composite material. The invention aims to solve the problems that the processing procedure and cost are increased and the binding force between the coating and matrix is weak since the electrosparking surface of the existing electronic packaging aluminum-base composite material needs to be ground and milled after electrosparking. The method comprises the following steps: 1. cleaning; 2. acid etching; 3. oil removal; 4. primary zinc soaking; 5. nitric acid removal; 6. secondary zinc soaking; and 7. plating. The method directly plates the Ni-P coating on the electrosparking surface of the electronic packaging aluminum-base composite material, and has the advantages of low cost, simple coating procedure and stable coating technique; and the thickness of the Ni-P coating is 5-10 mu m. The nickel-plated electronic packaging aluminum-base composite material is applicable to the field of electronic packaging materials.

Description

technical field [0001] The invention relates to a method for electroless nickel plating on the electric discharge machining surface of an aluminum-based composite material. Background technique [0002] With the continuous development of the field of electronic packaging, it also puts forward further requirements for the performance of materials. A single cermet or resin as an electronic packaging material highlights various defects, such as a large thermal expansion coefficient and high density of a metal material, a large dielectric constant of a ceramic material, high brittleness, and high cost. SiC p The / Al composite material is uniformly dispersed in the aluminum-silicon alloy matrix through SiC particles, which can achieve excellent properties such as low expansion, high thermal conductivity, light weight and high strength, and can make up for the shortage of single-system electronic packaging materials and meet the needs of high performance. [0003] Aluminum matri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/18C23C18/36
Inventor 陈国钦宋佳斌武高辉武强
Owner QIQIHAR XIANGKE NEW MATERIAL CO LTD
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