An anti-crosstalk inverted U-type buried layer photodiode and its production method
A photodiode, anti-crosstalk technology, applied in the direction of circuits, electrical components, electric solid-state devices, etc., can solve the problems that are difficult to be widely used, increase the doping concentration of the epitaxial layer, and cannot be diffused, and achieve the suppression of charge crosstalk phenomenon, high long-band Quantum efficiency of light and the effect of preventing lateral diffusion
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Embodiment 1
[0033] Step 1: At a doping concentration of 1×10 15 cm -3 The initial N-type photosensitive region 110 is formed by implanting arsenic ions into the P-type epitaxial layer 130, and the dose of implanting arsenic ions is 5×10 12 cm -2 , the injection energy is 60keV;
[0034] Step 2: Implanting boron ions on the initial N-type photosensitive region 110 to form a P+ clamping layer 100, the implantation dose of boron ions is 8×10 12 cm -2 , the injection energy is 5keV;
[0035] Step 3: Phosphorus ions are implanted around the junction between the initial N-type photosensitive region 110 and the epitaxial layer using an LP photolithography mask 520 to form an LP1 region 320 with an implantation dose of 2.2×10 11 cm -2 ~, the injection energy is 700keV;
[0036] Step 4: Implant nitrogen or phosphorus ions under the LP1 region 320 to form the LP2 region 321. The LP1 region 320 and the LP2 region 321 form a vertical annular P-type lightly doped buried layer and generate a bui...
Embodiment 2
[0039] Step 1: At a doping concentration of 1×10 15 cm -3 The initial N-type photosensitive region 110 is formed by implanting arsenic ions into the P-type epitaxial layer 130, and the dose of implanting arsenic ions is 5×10 12 cm -2 , the injection energy is 60keV;
[0040] Step 2: Implanting boron ions on the initial N-type photosensitive region 110 to form a P+ clamping layer 100, the implantation dose of boron ions is 8×10 12 cm -2 , the injection energy is 5keV;
[0041] Step 3: Phosphorus ions are implanted around the junction between the initial N-type photosensitive region 110 and the epitaxial layer using an LP photolithography mask 520 to form an LP1 region 320 with an implantation dose of 2×10 11 cm -2 , the injection energy is 650keV;
[0042] Step 4: Implant nitrogen or phosphorus ions under the LP1 region 320 to form the LP2 region 321. The LP1 region 320 and the LP2 region 321 form a vertical annular P-type lightly doped buried layer and generate a built-...
Embodiment 3
[0045] Step 1: At a doping concentration of 1×10 15 cm -3 The initial N-type photosensitive region 110 is formed by implanting arsenic ions into the P-type epitaxial layer 130, and the dose of implanting arsenic ions is 7×10 12 cm -2 , the injection energy is 100keV;
[0046] Step 2: Implanting boron ions on the initial N-type photosensitive region 110 to form a P+ clamping layer 100, the implantation dose of boron ions is 1×10 13 cm -2 , the injection energy is 8keV;
[0047] Step 3: Implant nitrogen ions around the junction between the initial N-type photosensitive region 110 and the epitaxial layer using an LP photolithography mask 520 to form an LP1 region 320 with an implantation dose of 3×10 11 cm -2 , the injection energy is 850keV;
[0048] Step 4: Implant nitrogen or phosphorus ions under the LP1 region 320 to form the LP2 region 321. The LP1 region 320 and the LP2 region 321 form a vertical annular P-type lightly doped buried layer and generate a built-in elec...
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