Novel high quality LED packaging material

A technology of LED encapsulation and hybrid materials, applied in the direction of adhesive types, non-polymer adhesive additives, epoxy resin adhesives, etc., can solve the problems of damage to gold wires and solder joints, high prices, dead lights, etc.

Inactive Publication Date: 2014-12-24
大连芯拓光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main material of high-refractive silicone rubber or silicone resin is high-phenyl organopolysiloxane. Although it has excellent heat resistance and aging resistance, it still has problems such as low bonding strength, poor resistance

Method used

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  • Novel high quality LED packaging material
  • Novel high quality LED packaging material
  • Novel high quality LED packaging material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030]

[0031] Properties before curing

[0032]

[0033] Process conditions

[0034]

[0035] The components A and B are mixed and stirred according to the same weight ratio to cure evenly. The curing is carried out in stages. The short bake is cured at 135°C for 1 hour, and the long bake is cured at 150°C for 4 to 6 hours.

[0036] Properties after curing

[0037] project name condition unit Index value Refractive index Abbe ≥1.52 Transmittance 1mm % ≥96 glass transition temperature DSC ℃ ≥145 Linear expansion coefficient (1~100℃) TMA ppm / ℃ ≤75 Hardness (Shore D) 25 ℃ ≥85 water absorption 100℃／1h % ≤0.30 Kang sulfur pollution performance Sulfur fumigation at 80°C for 100 hours, light transmittance at 400nm wavelength % ≥85

Embodiment 2

[0043]

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PUM

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Abstract

The invention discloses a LED organosilicon hybrid resin doping cycloaliphatic epoxy resin packaging glue used for increasing large power. A compound is composed of a part A and a part B. The part A is composed of organosilicon hybrid resin, liquid cycloaliphatic epoxy resin, solid epoxy resin and hydrogenated bisphenol A, and is cooperated with an antifoaming agent, a complementary color agent and a diffusion agent; nonsaturated chemical bond is not contained in a system, and anti-yellowing performance is excellent. The part B is composed of methylhexahydrophthalic anhydride and hexahydrophthalic anhydride, and is cooperated with promoters or cation catalysts such as quaternary phosphonium salt, quaternary ammonium salt, DBU salt and imidazoles, and phenols and phosphite anti-oxidant and an ultraviolet absorbent and a light stabilizer are added for increasing the anti-yellowing capability. The organosilicon hybrid resin doping cycloaliphatic epoxy resin packaging glue has the advantages of excellent ultraviolet resistance and yellowing-resistance performance, good manufacturability, high light transmittance, little light decay, and sulfuration pollution resistance. Compared with the organosilicon, the packaging glue has price advantage, also can overcome the disadvantages of brittleness and high hygroscopicity of a pure cycloaliphatic epoxy system, and is more suitable for packaging high-end LED, large power LED or ultraviolet-based white light or blue light LED.

Description

technical field [0001] The invention relates to a compound of organosilicon hybrid resin and epoxy resin, in particular to an LED packaging material with good ultraviolet resistance, good vulcanization resistance and strong adhesiveness. Background technique [0002] At present, most high-power LED packages are made of silicone rubber or silicone resin. The main material of high-refractive silicone rubber or silicone resin is high-phenyl organopolysiloxane. Although it has excellent heat resistance and aging resistance, it still has problems such as low bonding strength, poor resistance to vulcanization and pollution, and high price. However, if the alicyclic epoxy resin is only used, the material is too brittle, causing damage to the gold wire and solder joints during the use of the LED, resulting in the problem of dead light. [0003] The performance of anti-ultraviolet aging and anti-sulfurization pollution of high-power LED packaging materials can be improved by structu...

Claims

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Application Information

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IPC IPC(8): C09J183/04C09J183/06C09J163/00C09J163/02C09J11/06H01L33/56
Inventor 王清元李拓刘柳
Owner 大连芯拓光电有限公司
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