Novel high quality LED packaging material
A technology of LED encapsulation and hybrid materials, applied in the direction of adhesive types, non-polymer adhesive additives, epoxy resin adhesives, etc., can solve the problems of damage to gold wires and solder joints, high prices, dead lights, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0030]
[0031] Properties before curing
[0032]
[0033] Process conditions
[0034]
[0035] The components A and B are mixed and stirred according to the same weight ratio to cure evenly. The curing is carried out in stages. The short bake is cured at 135°C for 1 hour, and the long bake is cured at 150°C for 4 to 6 hours.
[0036] Properties after curing
[0037] project name condition unit Index value Refractive index Abbe ≥1.52 Transmittance 1mm % ≥96 glass transition temperature DSC ℃ ≥145 Linear expansion coefficient (1~100℃) TMA ppm / ℃ ≤75 Hardness (Shore D) 25 ℃ ≥85 water absorption 100℃/1h % ≤0.30 Kang sulfur pollution performance Sulfur fumigation at 80°C for 100 hours, light transmittance at 400nm wavelength % ≥85
Embodiment 2
[0043]
PUM
Property | Measurement | Unit |
---|---|---|
Transmittance | aaaaa | aaaaa |
Water absorption | aaaaa | aaaaa |
Transmittance | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com