Cyanide-free gold electroplating solution and electroplating process using same

A technology of electroplating gold and plating solution, applied in the field of gold electroplating, can solve problems such as the limitation of popularization and application, and achieve the effects of flat crystallization, high stability and wide current density range of the coating layer.

Inactive Publication Date: 2014-12-24
朱忠良
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing cyanide-free electroplating technology has some disa...

Method used

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Embodiment 1

[0026] The electroplating process of electroplating gold in this embodiment is: constant current electroplating mode, and the current density is 0.5A / dm 2 , the distance between the cathode and the anode is 5cm, the temperature is 55°C, and the plating time is 10min. Electroplating gold bath composition: 1,3-dimethylol-5,5-dimethylhydantoin 45g / L, hypoxanthine 2g / L, potassium bicarbonate 20g / L, potassium gold chloride 0.5g / L, combined additive 0.5mL / L, described combined additive consists of: antimony potassium tartrate 10g / L, polyethylene glycol 5g / L, guanine 5g / L, succinimide 5g / L. Adjust the pH of the plating solution to 10. During the preparation of the plating solution, control the temperature at 60° C. and stir for 20 hours. In the electroplating process, an inert metal electrode is used as the anode. A gold-plated layer with macroscopic golden yellow and full brightness, uniform and flat appearance, uniform and dense microscopic crystals observed by SEM, and no crack...

Embodiment 2

[0028] The electroplating gold plating solution of this embodiment consists of: 1,3-dibromo-5,5-dimethylhydantoin 35g / L, potassium citrate 15g / L, potassium bicarbonate 23g / L, gold potassium chloride 0.7 g / L, combined additive 1mL / L, described combined additive consists of: potassium selenite 5g / L, saccharin 10g / L, 1,4-butynediol 5g / L, sodium lauryl sulfate 1g / L L. Adjust the pH of the plating solution to 10. During the preparation of the plating solution, control the temperature at 65° C. and stir for 15 hours. After electrolytic degreasing, pickling with 1:1 HCl aqueous solution, electroplating nickel intermediate layer and water washing, the copper sheet is used as the cathode, and the inert metal electrode is used as the anode. Density 2.0A / dm 2 , stirred properly, and the electroplating time was 3 minutes, to obtain a gold-plated layer with a macroscopic golden color, a uniform appearance, and a uniform and dense microscopic crystallization observed by SEM, without crack...

Embodiment 3

[0030] The electroplating gold plating bath composition of present embodiment: 1,3-dimethylol-5,5-dimethylhydantoin 15g / L, 5,5-dimethylhydantoin 20g / L, sulfurous acid Sodium hydrogen 15g / L, sodium thiosulfate 5g / L, potassium bicarbonate 30g / L, potassium gold chloride 0.7g / L, combined additive 3mL / L, described combined additive consists of: adenine 10g / L, vanilla Aldehyde 2g / L, hypoxanthine 2g / L, sodium dodecylbenzenesulfonate 1g / L. Adjust the pH of the plating solution to 9. During the preparation of the plating solution, control the temperature at 30° C. and stir for 20 hours. After electrolytic degreasing, pickling with 1:1 HCl aqueous solution, electroplating nickel intermediate layer and water washing, the copper sheet is used as the cathode, and the inert metal electrode is used as the anode, the distance between the cathode and the anode is 4cm, the temperature of the plating solution is 30°C, Density 1.0A / dm 2 , stirred properly, and the electroplating time was 3 minu...

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Abstract

The invention relates to a cyanide-free gold electroplating solution and an electroplating process using the same. The solution contains 180-200 g/L of a main coordination agent, 5-8 g/L of an auxiliary coordination agent, 20-30 g/L of potassium bicarbonate, 0.5-0.8 g/L of potassium gold chloride and 0.5-5 mL/L of a combined additive. The cyanide-free gold electroplating system solution is good in stability, dispersing capacity and covering capacity and high in current efficiency, a plating layer is flat and compact in crystallization and golden yellow and bright in appearance, the applied current density range is wide, the temperature requirement range is wide, the system can meet the requirement of long-term thick gold electroplating, and problems that the plating layer turns red, floating dust exists and the like are solved with the increase of the thickness of the plating layer during electroplating.

Description

technical field [0001] The invention belongs to the technical field of electroplating gold, and relates to a cyanide-free electroplating gold plating solution and an electroplating process using the same. Background technique [0002] Gold is widely used in electronics, instruments, instruments, aviation, aerospace and other industrial fields because of its good electrical conductivity, good weldability, low contact resistance, high temperature resistance, and wear resistance. Gold also has high chemical stability, good corrosion resistance and discoloration resistance, so decorative gold plating is widely used in various aspects, such as jewelry, handicrafts, medals, commemorative coins, high-end tableware, etc. [0003] Traditional gold electroplating uses cyanide gold plating solution, but as we all know, CN- is highly toxic and will cause great harm to electroplating workers and the environment. Therefore, in order to implement sustainable development, realize environme...

Claims

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Application Information

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IPC IPC(8): C25D3/48C25D5/12
Inventor 朱忠良
Owner 朱忠良
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