Texturing preprocessing solution and method of diamond wire cutting polycrystalline silicon wafer, texturing preprocessing silicon wafer and application of texturing preprocessing silicon wafer

Abstract

The invention provides a texturing preprocessing solution of a diamond wire cutting polycrystalline silicon wafer. The texturing preprocessing solution is a mixed solution of nitric acid, hydrofluoric acid, acetic acid and water with the volume ratio being 10-15:1-5:2-6:10-30. The invention further provides a texturing preprocessing method of the diamond wire cutting polycrystalline silicon wafer. The method includes: the texturing preprocessing solution is used to process the surface of the diamond wire cutting polycrystalline silicon wafer to form a multi-hole silicon structure, namely a deeper damage layer so as to obtain a texturing preprocessing silicon wafer. The invention further provides a texturing method of the diamond wire cutting polycrystalline silicon wafer, the method performs conventional texturing processing on the texturing preprocessing silicon wafer, an even and low-reflectance textured surface is formed on the surface of the silicon wafer, and the diamond wire cutting polycrystalline silicon wafer textured product is acquired. The invention further provides the texturing preprocessing silicon wafer and the diamond wire cutting polycrystalline silicon wafer textured product.

Description

technical field [0001] The invention belongs to the technical field of texturing of polycrystalline silicon wafers, and in particular relates to a texturing pretreatment liquid for polycrystalline silicon wafers cut by diamond wires, a method for texturing pretreatment, silicon wafers for texturing pretreatment and applications thereof. Background technique [0002] Silicon wafers are widely used in photovoltaic solar energy, liquid crystal display and semiconductor fields, so the technology of cutting silicon blocks to make silicon wafers has also been developed. At present, the cutting of crystalline silicon wafers used in the photovoltaic industry mainly adopts the mortar multi-wire cutting technology, but this technology has problems such as low cutting process efficiency, high cost, and large discharge pollution of waste mortar after cutting. In contrast, solid abrasive diamond wire saw cutting (referred to as diamond wire cutting) technology has the characteristics of ...

AI Technical Summary

Problems solved by technology

[0006] Aiming at the fact that diamond wire-cut polysilicon wafers cannot be matched with the existing RENA texturing process because the surface damage layer of the silicon wafer is too shallow and the surface is densely traced, the present invention provides a texturing pretreatment liquid for diamond wire-cut polysilicon wafers, a texturing pretreatment Treatment method and texturing pretreatment silicon wafer and its application

Images