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Graphene reinforced organic silicon heat-conductive material and preparation method thereof

A heat-conducting material and organosilicon technology, applied in the field of organosilicon polymer materials and their preparation, graphene-enhanced organosilicon heat-conducting materials and their preparation, to achieve the effects of low surface tension, high gas permeability, and high compressibility

Inactive Publication Date: 2015-04-22
HUIZHOU KINGBALI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The prior art has reported the preparation and performance of organosilicon thermally conductive materials, but adding a certain proportion of graphene materials, using organosilicon resin as the matrix and high thermal conductivity agent, and preparing graphene-enhanced thermally conductive and insulating composite materials by calendering are in the Domestically, there are very few

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Example 1 The following formula is used: 20 parts of silicone resin, 45 parts of alumina, 1 part of graphene (thickness 1-3nm, size 2-10μm), 0.2 parts of platinum catalyst, hydrogen-containing 0.4% 0.3 parts of silicone oil, 5 parts of silane coupling agent, 2 parts of flame retardant, and 1 part of mold release agent are prepared according to the following steps:

[0022] (1) Blow the heat-conducting agent powder into the closed reaction chamber, and the powder particles are suspended in the reaction chamber and flow with the air through the air blast. After the coupling agent is heated, the atomized silane coupling agent is sprayed into the reaction chamber, and stays 1min, after the temperature of the material in the reaction chamber is cooled to room temperature, take it out to obtain the surface-treated heat-conducting agent;

[0023] (2) Put the surface-treated heat-conducting agent, graphene, silicone resin, flame retardant, and mold release agent into the intern...

Embodiment 2

[0025] Example 2 The graphene-enhanced organic silicon heat-conducting material of the present invention was prepared by using the following weight ratio raw materials: 20 parts of silicone resin, 45 parts of aluminum oxide, 2 parts of graphene (thickness 1-3 nm, size 2-10 μm), 0.2 parts of platinum catalyst, 0.3 parts of hydrogen-containing silicone oil with a hydrogen content of 0.4%, 5 parts of silane coupling agent, 2 parts of flame retardant, and 1 part of release agent. The preparation method is the same as in Example 1.

Embodiment 3

[0026] Example 3 The graphene-enhanced organic silicon heat-conducting material of the present invention was prepared by using the following weight ratio raw materials: 20 parts of silicone resin, 45 parts of aluminum oxide, 3 parts of graphene (thickness 1-3 nm, size 2-10 μm), 0.2 parts of platinum catalyst, 0.3 parts of hydrogen-containing silicone oil with a hydrogen content of 0.4%, 5 parts of silane coupling agent, 2 parts of flame retardant, and 1 part of release agent. The preparation method is the same as in Example 1.

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Abstract

The invention discloses a graphene reinforced organic silicon heat-conductive material. The material is prepared from 15-35 parts of organic silicon resin, 25-55 parts of a heat-conductive agent, 1-7 parts of graphene, 0.1-2 parts of a platinum catalyst, 0.1-2 parts of hydrogen-containing silicone oil, 3-11 parts of a coupling agent, 0.5 parts of a flame retardant and 0-3 parts of a release agent. According to the invention, the graphene, the heat-conductive agent and the organic silicon resin are combined in a certain proportion, and the coupling agent, the hydrogen-containing silicone oil curing agent or other auxiliaries are added to form a formula, so that the heat conducting performance of the organic silicon material can be improved, the mechanical performance of the organic silicon material is improved, and the heat conducting performance of the product is further improved due to addition of the graphene, surfaces of the heat-conductive agent particles can be completely covered by the coupling agent due to the surface treatment mode of the heat-conductive agent in the preparation process, the compatibility of the heat-conductive agent and the organic silicon resin can be improved, and a high-quality high-performance product can be obtained.

Description

technical field [0001] The invention relates to an organosilicon polymer material and a preparation method thereof, in particular to a graphene-enhanced organosilicon heat-conducting material and a preparation method thereof, belonging to the technical field of polymer materials. Background technique [0002] Silicone products are based on silicon-oxygen (Si-O) bonds as the main chain structure, so silicone products have the characteristics of high thermal stability, high weather resistance, electrical insulation performance, low surface tension and low surface energy, and physiological inertia. , due to the above-mentioned excellent properties of silicone, its application range is very wide. It is not only used as a special material in aviation, cutting-edge technology, and military technology departments, but also in various sectors of the national economy. Its application range has expanded to: construction, electronics, textiles, automobiles, machinery, leather and paper...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L83/05C08K13/06C08K9/06C08K3/22C08K3/28C08K3/04
Inventor 杨永佳张彦兵杨小义
Owner HUIZHOU KINGBALI TECH
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