A kind of preparation 3c-sic nano disk, preparation method
A nanodisk and nanoparticle technology, applied in nanocarbon, nanotechnology, nanotechnology, etc., can solve the problems of difficult control of luminescence of 3C-SiC nanoparticles, high price of 3C-SiC multi-chips, difficulties in preparation and purchase, and achieve The effect of short preparation cycle, short preparation time and uniform size
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Embodiment 1
[0030] Embodiment 1: The CVD furnace used in the present invention is a hot wire-CVD furnace.
[0031] (1) Silicon wafers were ultrasonically cleaned with methanol, acetone and isopropanone for 15 minutes, N 2 blow dry. Evaporate 10nm Al sequentially by E-Beam Evaporation 2 o 3 , 0.8nm Fe.
[0032] (2) At a furnace temperature of 725°C, the gas flow rates are H 2 :200sccm, C 2 h 2 : 1.8 sccm, H through deionized water 2 Under the conditions of 200 sccm, total air pressure of 25.5Torr, single tungsten wire, and 35W power, place the silicon chip made in (1) 0.5cm in front of the tungsten wire, and set the power of the tungsten wire to 0 after 30s of reaction , the total air pressure was adjusted to 6.4 Torr, and the vertical array growth of single-walled carbon nanotubes was completed after 15 minutes of reaction.
[0033](3) 10nm Si was evaporated on the vertical array of single-walled carbon nanotubes obtained in (2) by an electron beam evaporation system (E-beam Evapo...
Embodiment 2
[0036] Embodiment 2: The CVD furnace used in the present invention is a hot wire-CVD furnace.
[0037] (1) Silicon wafers were ultrasonically cleaned with methanol, acetone and isopropanone for 15 minutes, N 2 blow dry. Evaporate 10nm Al sequentially by E-Beam Evaporation 2 o 3 , 0.8nm Fe.
[0038] (2) At a furnace temperature of 750°C, the gas flow rates are H 2 :200sccm, C 2 h 2 : 2 sccm, H through deionized water 2 Under the conditions of 200sccm, air pressure of 25Torr, single tungsten wire, and 32W power, place the silicon wafer made in (1) 0.5cm in front of the tungsten wire, and set the power of the tungsten wire to 0 after reacting for 30s. It is adjusted to 6.4 Torr, and the vertical array growth of single-walled carbon nanotubes is completed after 15 minutes of reaction.
[0039] (3) The vertical array of single-walled carbon nanotubes obtained in (2) was vapor-deposited with 5nm Si by E-beam Evaporation.
[0040] (4) At a furnace temperature of 850°C, the g...
Embodiment 3
[0043] Embodiment 3: The CVD furnace used in the present invention is a hot wire-CVD furnace.
[0044] (1) Silicon wafers were ultrasonically cleaned with methanol, acetone and isopropanone for 15 minutes, N 2 blow dry. Evaporate 10nm Al sequentially by E-Beam Evaporation 2 o 3 , 0.8nm Fe.
[0045] (2) At a furnace temperature of 800°C, the gas flow rates are H 2 :190sccm, C 2 h 2 : 2.2 sccm, H through deionized water 2 Under the conditions of 200sccm, total air pressure of 25Torr, single tungsten wire, and 30W power, place the silicon wafer made in (1) 0.5cm in front of the tungsten wire, and set the power of the tungsten wire to 0 after 30s of reaction. The total air pressure was adjusted to 6.4 Torr, and the vertical array growth of single-walled carbon nanotubes was completed after 15 minutes of reaction.
[0046] (3) 3nm Si was evaporated on the vertical array of single-walled carbon nanotubes obtained in (2) by an electron beam evaporation system (E-beam Evaporat...
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