Method for performing palladium-free activation electroless copper plating on basalt fiber

A basalt fiber and chemical copper plating technology is applied in the field of palladium-free activated chemical copper plating on basalt fibers, which can solve the problem of high cost of raw materials, and achieve the effects of high production efficiency, easy mass production and simple process.

Inactive Publication Date: 2015-06-03
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The necessary condition for electroless plating is that the surface of the substrate to be plated has catalytic activity. Since the textile fiber itself is an inert material, activation pretreatment is required before plating to make the surface adsorb a layer of catalyst that can initiate electroless plating. The precious metal palladium is usually used as the catalyst. Activator, although this method can obtain metal coating, but the required raw material cost is high

Method used

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  • Method for performing palladium-free activation electroless copper plating on basalt fiber
  • Method for performing palladium-free activation electroless copper plating on basalt fiber
  • Method for performing palladium-free activation electroless copper plating on basalt fiber

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Experimental program
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Effect test

Embodiment 1

[0033] The microstructure and performance of the conductive basalt fabric are as follows:

[0034] 1. Surface morphology of conductive copper-plated basalt fabric:

[0035] SEM photos of electroless copper-plated basalt fabrics at different magnifications are shown in figure 1 and 2 . It can be seen from the figure that the surface of the basalt fiber is completely covered by copper particles, and the copper particles are uniformly plated on the surface of the fabric. Judging from the SEM with a magnification of 30000, the copper particles have clustered, and the particle size after clustering is that the copper nanoparticles are spherical, the particle size is about 60-100nm, and the particle size distribution is uniform.

[0036] 2. Crystal structure of conductive copper-coated basalt fabric:

[0037] Crystal structure of electroless copper plating on basalt fabric see image 3 . According to the X-ray diffraction standard card PDF, it can be determined from the diffr...

Embodiment 2

[0043] The microstructure and performance of the conductive basalt fabric are as follows:

[0044] 1. Contact angle of basalt fabric after NaOH pretreatment:

[0045] The contact angles of basalt fabrics before and after NaOH etching treatment are shown in Figure 4 and 5 , it can be seen from the figure that the contact angle of the original basalt fabric is 95.62°, and the contact angle of the basalt fabric after etching is 39.86°. Facilitates the deposition of nickel on the surface of the fabric.

[0046] 2. Surface morphology of conductive copper-plated basalt fiber fabric:

[0047] The scanning electron micrographs at different magnifications of the electroless copper-plated basalt fabric etched by 40g / l NaOH are shown in Figure 6 and 7 . It can be seen from the figure that the surface of the basalt fabric is completely covered by copper particles, and the copper particles are evenly plated on the surface of the fabric. From the SEM with a magnification of 30000, ...

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Abstract

The invention relates to a method for performing palladium-free activation electroless copper plating on a basalt fiber. The method comprises the following steps: removing the impurities on the surface of the basalt fiber by an organic solvent, etching by using the sodium hydroxide, performing palladium-free activation on the basalt fiber, plating a metallic copper on the surface of the basalt fiber through an electroless copper plating method by taking the glyoxylic acid as a reducing agent to obtain the copperized basalt fiber. The method of the copperized basalt fiber is simple in process, low in cost, high in production efficiency, good in plating binding force and facilitates batch production and control on the shape and the size of the pattern of the conductive plating; and the basalt fiber prepared by the method is good in conductive effect, and the binding fastness of the metal coating and the basalt fiber is good.

Description

technical field [0001] The invention belongs to the field of functional coating of basalt fibers, and more specifically relates to a palladium-free activated electroless copper plating method for basalt fibers. Background technique [0002] As a high-performance fiber, basalt fiber has good mechanical properties such as high tensile strength and elastic modulus, as well as excellent physical and chemical properties, such as good adhesion, heat resistance, non-combustible properties and corrosion resistance, etc., and the preparation of basalt fiber is pollution-free, and the soil parent material has excellent properties after degradation. It is widely used in military and civilian fields such as aerospace, construction, chemical industry, medicine, electronics, and agriculture. Because basalt fiber is non-conductive and has no protection against electromagnetic waves, its application is limited. If a layer of metal can be plated on its surface to improve its surface prope...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/18C23C18/40
Inventor 郭荣辉石坤兰建武
Owner SICHUAN UNIV
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