18results about How to "Improve contact quality" patented technology

The invention discloses a vertical 4H-SiC photoconductive switch, which comprises a SiC substrate, a front electrode, a passivation layer and a back electrode, and is characterized in that the front electrode is located on the upper surface of the SiC substrate, and the passivation layer is located on the upper surface of the SiC substrate and is arranged at the edge of the front electrode; the back electrode is located on the lower surface of the SiC substrate; wherein the front electrode comprises an annular electrode and a mesh electrode, and the mesh electrode is arranged in the inner circle of the annular electrode and connected with the annular electrode; a plurality of concentric terminal protection rings are also arranged in the SiC substrate below the outer side of the front electrode, and the circle centers of the longitudinal projections of the plurality of terminal protection rings coincide with the circle centers of the longitudinal projections of the annular electrodes. According to the structural design, the electric field concentration effect near the electrode caused by non-uniform distribution of the electric field on the surface of the photoconductive switch is relieved, premature breakdown of the device is avoided, and the voltage endurance capability of the photoconductive switch is doubled; and meanwhile, the uniformity of current distribution in the photoconductive switch is improved.

The invention discloses a crimping machine capable of butt joint correction for new energy high-voltage line processing, and relates to the technical field of high-voltage line crimping, the crimping machine comprises a crimping machine main body, a hydraulic cylinder is mounted in the crimping machine main body, a crimping table is mounted at the lower end of the hydraulic cylinder, and example high-voltage line main bodies are symmetrically mounted above the crimping machine main body. Compared with the prior art, time is saved, working efficiency is improved, it can be ensured that multiple example high-voltage wire bodies keep consistent positions and speeds during crimping processing through synchronous movement, so that consistency and accuracy of crimping processing are ensured, meanwhile, multiple example high-voltage wire bodies are placed at a time and made to move synchronously, the occupied space of equipment can be reduced, and the equipment cost is reduced. The compactness and the efficiency of the production line are improved, and the number of operators can be reduced by adopting a mode of placing a plurality of high-voltage wires at one time for the operators, so that the labor cost is saved.

The invention relates to a process method for forming high-temperature-resistant 4H-SiC P-type ohmic contact. The process method comprises the following steps: providing a SiC wafer; carrying out ion implantation; performing high-temperature activation annealing on the implanted ions; depositing a gate oxide and polycrystalline silicon in the gate region, and sequentially depositing SiO2 / Si3N4 / SiO2 in other regions as an interlayer medium; carrying out photoetching trepanning on the ohmic contact area; si3N4 is deposited through chemical vapor deposition, then Si3N4 is removed through dry etching, and a Si3N4 side wall is formed in the ohmic contact hole; and depositing a Pd / Al / Pd metal laminated layer as metal for forming ohmic contact, and forming the ohmic contact through rapid thermal annealing. The method disclosed by the invention has the beneficial effects that SiO2 / Si3N4 / SiO2 is sequentially deposited as an interlayer medium after ion activation annealing, and the middle layer of Si3N4 can prevent reaction and penetration of Al to SiO2 in subsequent treatment.

The application discloses a kind of photovoltaic conductive paste, belongs to conductive paste technical field.The paste includes silver powder, metal silicide, nano silicon powder, glass powder, organic auxiliary agent and organic carrier, silver powder is compounded with sintered active silver powder and smooth surface silver powder, metal silicide is selected from two and above combinations in TiSi2 And NiSi2 And / or CoSi2, organic carrier contains rosin resin antioxidant component.The application is compounded by titanium and nickel / cobalt silicide, cooperates with the antioxidation protection of nano silicon powder and rosin resin, effectively reduces the contact resistance of paste and silicon wafer, inhibits interface carrier recombination, widens sintering process window.The obtained paste is suitable for screen printing, and after sintering, it is in good contact with silicon substrate, can significantly improve the photoelectric conversion efficiency of high-efficiency photovoltaic cells such as TOPCon, and the comprehensive performance is better than that of traditional conductive paste, suitable for industrial production.

The invention provides an epitaxial structure of a gallium nitride thin film and a preparation method, and relates to the technical field of semiconductors, and the epitaxial structure comprises a substrate, a buffer layer, a GaN thin film, an AlGaN barrier layer and an insulating layer which are sequentially laminated; the insulating layer is provided with a plurality of rectangular gate slots, a first source slot and a second source slot. The bottom of the first source slot and the bottom of the second source slot extend to the bottom of the AlGaN barrier layer. The comb-shaped grid is provided with a plurality of rectangular grid roots matched with the rectangular grid root slots; the width of each rectangular gate heel in the longitudinal direction of the epitaxial structure and the distance between the adjacent rectangular gate heels are constrained by the actual intrinsic transconductivity of the epitaxial structure; when a break-over voltage is applied to the comb-shaped grid electrode, the two-dimensional electron gas layer between the multi-contact pin source electrode and the multi-contact pin drain electrode is conducted, a conductive channel is formed, the stability of source electrode access resistance is improved, the non-linear change of the source electrode along with the current or voltage is reduced, and the linearity of the epitaxial structure is further improved.

The present invention provides a photovoltaic cell and a method for making the same, the method comprising: making a hole transport layer on a conductive substrate, the hole transport layer being a metal oxide; setting a preset hydrophilic amino acid solution on the surface of the hole transport layer, and performing a first heating treatment so that the preset hydrophilic amino acid solution forms a modified layer above the hole transport layer; making a perovskite layer above the modified layer so that the amino acid molecules in the modified layer are connected to the perovskite layer through hydrogen bonds; making an electron transport layer and an electrode structure above the perovskite layer. In the present invention, the amino acid molecules in the modified layer can improve the surface wettability of the hole transport layer, reduce the pores and defects in the hole transport layer, reduce light scattering and change the refractive index of the film layer, improve the light transmittance of the photovoltaic cell and the crystallization quality of the perovskite layer, ensure the matching degree of the energy levels between the hole transport layer and the perovskite layer, facilitate the transmission and extraction of holes, and ensure the power generation efficiency of the photovoltaic cell.

The present disclosure relates to a kind of laminated, photovoltaic module and photovoltaic system, the laminated includes: cell string, the upper and lower surfaces of cell string are sealed by transparent first encapsulation adhesive film, the outer periphery ring of first encapsulation adhesive film is equipped with second encapsulation adhesive film, the interface of first encapsulation adhesive film and second encapsulation adhesive film exists at the joint, the width L2 of interface satisfies: 0.5mm < L2.Therefore, the contact quality of the interface of first encapsulation adhesive film and second encapsulation adhesive film can be improved, the risk of bubble defect at the interface of first encapsulation adhesive film and second encapsulation adhesive film is reduced, the sealing property, power generation efficiency and the stability of structure of laminated are improved.

This utility model discloses a self-adjusting distributor for a gas-solid fluidized bed reactor, relating to the field of gas-solid fluidized bed technology. It includes a fluidized bed shell installed in a floor, with an exhaust pipe connected to the top of the shell. This application utilizes a gas dispersion rack in conjunction with a flow divider, allowing air to be dispersed by the gas dispersion rack before passing through the distribution plate for gas-solid fluidization. This solves the problem of large velocity differences in the bed cross-section during operation, which can easily lead to flow deviation, in traditional single distribution plates, thereby improving the contact quality between gas and solids. Furthermore, this application uses an annular groove guide channel in conjunction with the distribution plate, allowing personnel to operate a swing handle to swing the distribution plate, causing the limiting block to contact the guide channel and vibrate. This solves the problem that solid particles inside the gas-solid fluidized bed may clog the distribution plate during operation, preventing normal and uniform gas delivery, thus improving the stability of the gas-solid fluidized bed during operation.

This utility model belongs to the technical field of male and female connectors, specifically relating to a high-strength snap-fit ​​male and female connector, including a male connector and a female connector. The male connector includes a first rubber core and a first metal plate, and the female connector includes a second rubber core and a second metal plate. After the male connector is inserted into the female connector, the first metal plate and the second metal plate engage with each other. The surfaces of the first and second rubber cores are each provided with four grooves, and the first and second metal plates are all disposed in the grooves. The first and second metal plates are both concave in the front and convex in the back. This device increases the contact area between the first metal plate 12 and the second metal plate 22 after engagement, enhancing the engagement and ensuring good contact while also extending the service life of the male connector and the female connector.

The utility model provides a sensor structure, which comprises an acceptor substrate, a dielectric layer on the acceptor substrate and a stacking layer on the dielectric layer, and is characterized in that the stacking layer comprises a first doping layer, an intrinsic absorption layer and an intrinsic lead-out layer which are sequentially stacked in a first direction perpendicular to the surface of the acceptor substrate, the lead-out region of the intrinsic lead-out layer is doped by a second doping type to serve as a doping structure, or the intrinsic lead-out layer is doped by the second doping type to serve as a second doping layer. A first lead-out layer is arranged on the side, facing the acceptor substrate, of the stacking layer, and / or a second lead-out layer is arranged on the side, deviating from the acceptor substrate, of the doping structure or the second doping layer, the first lead-out layer is used for being connected with a first electrode, the second lead-out layer is used for being connected with a second electrode, and the doping concentration of the first lead-out layer is larger than that of the first doping layer; and the doping concentration of the second lead-out layer is greater than that of the doping structure or the second doping layer, so that the detection performance of the sensor is improved.

The invention relates to the technical field of semiconductor packaging testing, and discloses a semiconductor packaging testing device and method.The semiconductor packaging testing device comprises a laminating mechanism, the laminating mechanism further comprises a placing table, a pushing plate is arranged at the top of the placing table, and four fixing rods are fixedly connected to the top of the placing table; a worker places a chip in a groove of a placement table, then starts an electric telescopic rod to stretch out to drive a push plate and a probe table to descend, the push plate descends to drive an extrusion rod and an extrusion plate I to descend, and along with continuous descending of the push plate, the extrusion rod firstly makes contact with a spring reset rod I, extrudes the spring reset rod I and moves towards the direction of the chip; when a chip is detected, a current signal of the probe station can be transmitted to the chip through the copper block, so that the contact area of the probe station is increased, and the accuracy of chip detection is improved.

The utility model discloses a winding device of a three-needle type straight strip winding machine, which comprises a bottom plate, the upper surface of the bottom plate is fixedly connected with a pay-off component, the upper surface of the bottom plate is fixedly connected with a box body I, the box body I is provided with a plurality of threading ports, the inner surface of the box body I is fixedly connected with a spray head, and the lower surface of the bottom plate is provided with a water supply component. The upper surface of the first box body is fixedly connected with a supporting frame, the lower surface of the supporting frame is fixedly connected with an electric push rod, the lower end of the electric push rod is fixedly connected with a second motor, the output end of the second motor is fixedly connected with a brush, and the upper surface of the bottom plate is fixedly connected with a second box body. The wire rod can enter the winding device body cleanly to be processed, particles and impurities on the surface of the wire rod are removed, the contact quality between the wire rod and a winding product can be improved, and the conductivity and the insulation performance of a coil are improved.

The utility model discloses a semiconductor structure, which comprises a plurality of active regions arranged on a substrate, a plurality of gate structures extending along a first direction and intersecting with the active regions, and dividing each active region into a middle part and two end parts. The plurality of bit line structures extend across the active region in the second direction and are electrically connected with the middle part of the active region. The bit line structures include a first bit line structure on the outer side and a second bit line structure on the inner side. The first plug structures and the second plug structures are alternately arranged on the outer side of the first bit line structure at intervals in the second direction, the bottoms of the first plug structures are lower than the bottoms of the second plug structures, the contact area between the bottoms of the first plug structures and the ends of the active region is large, and the electric connection quality can be improved.

The invention provides transcranial electrical stimulation equipment, and particularly relates to the technical field of brain-computer interfaces, and the equipment comprises an electrical stimulation electrode array which is used for carrying out transcranial electrical stimulation and electroencephalogram signal collection on a target stimulation object; the electrical stimulation electrode array comprises a plurality of electrodes, and each electrode is provided with an electrode contact; each electrode contact is covered with an interface modification layer, the interface modification layer comprises a first hydrogel layer and a second hydrogel layer which are stacked in sequence, the first hydrogel layer is attached to the electrode contact, and the second hydrogel layer is used for making contact with the target stimulation object; the modulus of the first hydrogel layer is higher than that of the second hydrogel layer; the electrical stimulation control element is connected with the electrical stimulation electrode array and used for controlling current output of the electrical stimulation electrode array according to the electroencephalogram signals collected by the electrical stimulation electrode array. The quality and reliability of the electroencephalogram signals are improved.

The utility model provides a negative-pressure heat dissipation structure of a working vehicle. The negative-pressure heat dissipation structure comprises an engine; the cooling fan is arranged at the front end of the engine, and the cooling fan comprises a wind scooper; the transmission case is arranged at the rear end of the engine, the transmission case is provided with an air inlet pipe and an air outlet pipe, the air outlet pipe is communicated with the transmission case and the wind scooper, and the air inlet pipe extends from the transmission case and is communicated with the outside of the transmission case; the clutch assembly comprises a clutch shell and a first pressing disc, a dust discharging opening is formed in the radial outer end of the clutch shell, and a blade part protruding in the axial direction is arranged on the end face of the first pressing disc. Ventilation and heat dissipation of the clutch are effectively improved, the temperature of air in the clutch cavity is reduced, dust in the clutch cavity is discharged in time, the contact quality of a friction plate and a pressure plate is improved, and the service life of the clutch is prolonged.

The present application discloses a conductive spring and a battery module equipped with the conductive spring, wherein the conductive spring is made of metal and comprises a horizontally arranged substrate, the substrate having four outer edges in the shape of concave arcs, and the four outer edges are symmetrically arranged in a regular quadrilateral, and each of the outer edges is integrally connected with a plurality of side claws extending downward and spaced from each other, and the side claws are bent structures. When the battery module of the present application is assembled, the conductive spring will not be crushed by the battery, and there is no need to configure and network it.

This invention discloses a downhole insertion-type long-lasting isolating production combination tool, relating to the field of long-lasting isolator technology. It includes a central tube, with a fixing block fixed at an equal angle on the outer side of the upper end of the central tube. The fixing block is fixed to a connector, and a sealing mechanism for sealing the production pipe is slidably connected to the inner side of the connector. This downhole insertion-type long-lasting isolating production combination tool employs a cleaning mechanism that converts axial gravity into rotational torque through a combination of spirally distributed rollers. When the tool is lowered, the arc-shaped panel adheres tightly to the pipe wall under the thrust of the airbag. The friction between the spiral rollers (30°-60° rise angle) and the pipe wall generates a tangential component force that causes the entire rotating assembly (ring, arc-shaped panel, scraper) to rotate around the central tube. The scraper rotates accordingly, scraping away the circumferential attachments. This process continues throughout the entire lowering stroke, achieving a pretreatment effect on the well wall of the sealing section, significantly improving the contact quality and working life of the subsequent sealing sleeve and metal slips.

The invention discloses a combined television shell convenient to hang, and relates to the technical field of television shells, the combined television shell comprises a shell body and a mounting plate, the mounting plate is located on one side of the outer wall of the shell body, the outer wall of the side, close to the shell body, of the mounting plate is fixedly connected with a hanging frame, and the outer wall of the side, located on the mounting plate, of the shell body is symmetrically and fixedly connected with two L-shaped plates; a plurality of L-shaped grooves are formed in the inner walls of the two L-shaped plates, the two L-shaped plates are clamped and matched with the suspension bracket through the L-shaped grooves, and the locking blocks move upwards to be in contact with the bottom of the suspension bracket, so that the L-shaped plates can be matched to be firmly combined with the suspension bracket, the shell body cannot transversely slide after being fixed, the use stability of the shell body is improved, and the service life of the shell body is prolonged. And compared with a mode of fixing by adopting a plurality of bolts, the use frequency of professional tools is reduced, the installation time is shortened, the use of consumables is reduced, and the hanging work is more convenient.