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A kind of solder used on interconnection strips of solar cell modules

A technology of solar cells and interconnection strips, which is applied in the direction of electrical components, welding/cutting media/materials, circuits, etc., can solve problems affecting the efficacy of components, improve solderability, increase peel strength, reduce resistivity and Effect of Alloy Melting Point

Active Publication Date: 2018-01-16
TAICANG JUREN PV MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the design service life of solar modules is mostly about 25 years, and the modules are usually installed outdoors, and they have to withstand temperature changes of tens of degrees Celsius every day, while the substrates of interconnection strips on the market are mostly pure copper, and the expansion coefficient of copper is about silicon. (cell) 6 times, as long as there is a temperature change, both the ribbon and the cell will be stressed, so the quality of the interconnection strip directly affects the efficacy of the module

Method used

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  • A kind of solder used on interconnection strips of solar cell modules

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The solder used on the solar cell module interconnection strip in this embodiment is composed of the following components by weight percentage: tin: 62wt%, bismuth: 1.0wt%, antimony: 2.0wt%, gallium: 0.03wt%, indium: 1.5wt%, germanium: 1wt%, titanium: 0.1wt%, nickel: 0.5wt%, palladium: 0.005wt%, phosphorus: 0.015wt%, silver: 2.0wt%, and the balance is lead.

[0034] The above-mentioned method for preparing the solder on the solar cell module interconnection strip is as follows:

[0035] Pre-treatment: clean the oil and oxides on the surface of the substrate by alkali washing and pickling;

[0036] Hot-dip plating: immerse the substrate in a molten metal solution configured by weight percentage, and the hot-dip plating temperature is 220 degrees Celsius to form a coating;

[0037] Post-processing: surface chemical treatment, tape making, cutting and winding.

Embodiment 2

[0039] The solder used on the solar cell module interconnection strip in this embodiment is composed of the following components by weight percentage: tin: 64wt%, bismuth: 0.01wt%, antimony: 0.01wt%, gallium: 0.015wt%, indium: 0.05wt%, germanium: 0.005wt%, titanium: 0.005wt%, nickel: 0.05wt%, palladium: 0.1wt%, phosphorus: 0.03wt%, silver: 0.5wt%, and the balance is lead.

[0040] The above-mentioned method for preparing the solder on the solar cell module interconnection strip is as follows:

[0041] Pre-treatment: clean the oil and oxides on the surface of the substrate by alkali washing and pickling;

[0042] Hot-dip plating: immerse the substrate in a molten metal solution configured by weight percentage, and the hot-dip plating temperature is 240 degrees Celsius to form a coating;

[0043] Post-processing: surface chemical treatment, tape making, cutting and winding.

Embodiment 3

[0045] The solder used on the solar cell module interconnection strip in this embodiment is composed of the following components by weight percentage: tin: 62.5wt%, bismuth: 0.5wt%, antimony: 1.0wt%, gallium: 0.025wt%, indium : 1.5wt%, germanium: 0.5wt%, titanium: 0.05wt%, nickel: 0.5wt%, palladium: 0.005wt%, phosphorus: 0.15wt%, silver: 1.0wt%, and the balance is lead.

[0046] The above-mentioned method for preparing the solder on the solar cell module interconnection strip is as follows:

[0047] Pre-treatment: clean the oil and oxides on the surface of the substrate by alkali washing and pickling;

[0048] Hot-dip plating: immerse the substrate in a molten metal solution configured by weight percentage, and the hot-dip plating temperature is 220 degrees Celsius to form a coating;

[0049] Post-processing: surface chemical treatment, tape making, cutting and winding.

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Abstract

The invention relates to a solder used for interconnecting strips of solar cell modules, which is composed of the following components by weight percentage: tin: 62-64wt%, bismuth: 0.01-1.0wt%, antimony: 0.01-2.0wt%, gallium : 0.015‑0.03wt%, indium: 0.05‑1.5wt%, germanium: 0.005‑1wt%, titanium: 0.005‑0.1wt%, nickel: 0.05‑0.5wt%, palladium 0.005‑0.1wt%, phosphorus 0.015‑0.03wt% %, silver 0.5‑2.0wt%, and the balance being lead. Through the technical solution of the invention, the weldability, corrosion resistance and welding force of the interconnection strip can be improved, and the resistivity and alloy melting point can be reduced. Simultaneously, the interconnection bar thus prepared not only has a uniform texture and a bright appearance, but also has improved interpenetration with battery sheet silver paste, and increased peel strength.

Description

technical field [0001] The invention relates to a solder, in particular to a solder used on interconnection strips of solar battery modules. Background technique [0002] Solar cell module interconnection strips are used for single-piece welding and series welding of solar cells. The ribbon is the key to current collection and has a great influence on the power of photovoltaic modules. In the manufacturing process of solar cell modules, the quality of the front single welding and back string welding of the cells is very important. At present, the design service life of solar modules is mostly about 25 years, and the modules are usually installed outdoors, and they have to withstand temperature changes of tens of degrees Celsius every day, while the substrates of interconnection strips on the market are mostly pure copper, and the expansion coefficient of copper is about silicon. (cells), as long as there is a temperature change, both the ribbon and the cells will be stress...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/40H01L31/05
CPCY02E10/50
Inventor 徐赞徐锦松李兵
Owner TAICANG JUREN PV MATERIAL
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