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A kind of pptc chip and its preparation method

A manufacturing method and chip technology, which is applied in the field of polymer thermosensitive elements, can solve the problems of affecting the qualified rate of finished products, the increase of resistance, and the short storage period of chips, so as to achieve stable resistance, improved resistance stability, and long storage time Effect

Active Publication Date: 2017-07-07
上海神沃电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, one problem faced by PPTC thermistors in the processing process is that the storage period of the chip is short, that is to say, when the chip is stored for a long time and then soldered to the pin electrodes, the resistance is likely to increase abnormally, which affects the quality of the final product. Pass rate

Method used

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  • A kind of pptc chip and its preparation method
  • A kind of pptc chip and its preparation method
  • A kind of pptc chip and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0081] The raw material of the chip includes the following components in volume percentage: 35% of high-density polyethylene, 60% of ceramic powder, and 5% of polyamide wax.

[0082] In this embodiment, the manufacturing steps of the chip are:

[0083] Ingredients: According to the volume ratio of high-density polyethylene 35%, ceramic powder 60%, and polyamide wax 5%, the ingredients are mixed, and then poured into the trinity mixer and mixed evenly;

[0084] Twin-screw extrusion: After mixing, it is vacuum-extruded by a twin-screw extruder, and the extrusion temperature of the twin-screw extruder is 180-220°C;

[0085] Open milling: The pulverized material is poured into the open mill according to a fixed mass, the temperature is controlled at 130-150°C, the preheating time is controlled at 5-15 minutes, and the black core material with a thickness of 0.21-0.40mm is pulled out;

[0086] Composite: The black core material is shaped first; after shaping, a nickel-plated coppe...

Embodiment 2

[0090] The raw material of the chip includes the following components in volume percentage: 60% of high-density polyethylene, 35% of ceramic powder, and 5% of micronized polytetrafluoroethylene wax.

[0091] In this embodiment, the manufacturing steps of the chip are:

[0092] Ingredients: 60% high-density polyethylene, 35% ceramic powder, 5% micronized polytetrafluoroethylene wax according to the volume percentage, and then pour it into a trinity mixer and mix evenly;

[0093] Twin-screw extrusion: The mixed material is vacuum-extruded by a twin-screw extruder, and the extrusion temperature of the twin-screw extruder is 180-220°C;

[0094] Open milling: the pulverized material is poured into the open mill according to a fixed mass, the temperature is controlled at 130-150°C, and the black core material with a thickness of 0.2-0.4mm is pulled out;

[0095] Composite: The black core material is shaped first; after shaping, a roughened nickel-plated copper foil is used as the e...

Embodiment 3

[0099] The raw material of the chip includes the following components in volume percentage: 40% of high-density polyethylene, 55.5% of ceramic powder, and 0.5% of polyalpha-olefin modified maleic anhydride wax.

[0100] In this embodiment, the manufacturing steps of the chip are:

[0101] Ingredients: 40% high-density polyethylene, 55.5% ceramic powder, and 0.5% polyα-olefin modified maleic anhydride wax according to the volume percentage, and then pour it into a three-in-one mixer and mix evenly;

[0102] Twin-screw extrusion: The mixed material is vacuum-extruded by a twin-screw extruder, and the extrusion temperature of the twin-screw extruder is 180-220°C;

[0103] Open milling: the pulverized material is poured into the open mill according to a fixed mass, the temperature is controlled at 130-150°C, and the black core material with a thickness of 0.2-0.4mm is pulled out;

[0104] Composite: The black core material is shaped first; after shaping, a roughened nickel-plated...

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Abstract

The invention discloses a PPTC chip and a preparation method thereof. The PPTC chip comprises the following components in percentage by volume: 35-60% of a crystalline high-molecular polymer, 35-60% of a conductive filler and 0.5-5% of a plasticizer; the plasticizer is one or a composition of several of polyamide modified PE wax, PP wax, polyamide wax, poly-alpha-olefin modified maleic anhydride wax and micronizing polytetrafluoroethylene wax. With the adoption of the chip and the preparation method thereof, provided by the invention, the chip obtained by adopting the preparation method is long in storage period at room temperature and high in electrical resistance stability; after being subjected to high-temperature reflow soldering, the chip keeps stable in electrical resistance after soldering, and is stable in hot and cold impact performance, excellent in wet resistance and heat resistance, and has the advantage of small increase rate of electrical resistivity after several times of current shock.

Description

technical field [0001] The invention relates to the field of polymer thermosensitive elements, in particular to a PPTC core material and its preparation method, a PPTC chip and its preparation method. Background technique [0002] At present, positive temperature coefficient conductive composite materials are composed of one or more crystalline polymers and conductive fillers. The polymer is generally a polyolefin polymer, such as polyethylene, polyethylene graft polymer, polyvinylidene fluoride and copolyester, etc. The conductive filler is generally carbon black, metal powder or oxygen-free ceramic powder, and the conductive filler is uniformly dispersed in the polymer. [0003] PPTC (polymer positive temperature coefficient) thermistor, as a self-recovery fuse, is widely used in the field of over-temperature and over-current protection of electronic circuits. [0004] At present, a problem faced by PPTC thermistors in the processing process is that the storage period of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L23/06C08L77/00C08L23/12C08L51/00C08L27/18C08L23/26C08K3/00
CPCC08L23/06C08L2201/08C08L2207/062C08L77/00C08K3/00C08L27/18C08L51/00C08L23/12
Inventor 张爱丽侯李明曾贤瑞
Owner 上海神沃电子有限公司
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