Low dielectric constant polyamide aerogel thermal insulation material and preparation method thereof

Abstract

The invention discloses a low dielectric constant polyamide aerogel thermal insulation material and a preparation method thereof. According to the low dielectric constant polyamide aerogel thermal insulation material, aromatic oxalyl chloride and aromatic diamine are taken as raw materials, polyamine or polybasic acyl chloride are taken as a cross-linking agent, a sol-to-gel process is adopted to prepare and obtain polyamide gel with a three-dimensional net structure, and the low dielectric constant polyamide aerogel thermal insulation material is obtained by carrying out CO2 supercritical drying on the polyamide gel. The aromatic oxalyl chloride is TPC or IPC or a mixture of the TPC and the IPC; the aromatic diamine is ODA or pPDA; the polyamine is TAB or OAPS; the polybasic acyl chloride is BTC. The thermal insulation material provided by the invention is relatively low in dielectric constant, low in density, low in heat conductivity and good in heat-insulating property; the preparation method provided by the invention has the advantages that a preparation process is simple, the raw materials are easy to obtain, the cost is relatively low, the requirement on environment is relatively low, a whole technological process is short in consumed time, and the material is suitable for industrial production.

Description

technical field [0001] The invention relates to a heat insulating material and a preparation method thereof, in particular to a low dielectric constant polyamide airgel heat insulating material and a preparation method thereof. Background technique [0002] In recent years, as the size of VLSI continues to shrink, the resistance and capacitance delays of metal interconnections increase approximately quadratically [Functional Materials, 2000, 31(5): 452-455], resulting in signal transmission delays and crosstalk , which directly affects the performance of the device. In order to reduce the increase in power consumption caused by signal transmission delay, crosstalk and dielectric loss, meet the high-speed signal transmission, and further improve the function of electronic circuits, there is an urgent need for materials with lower dielectric constants. [0003] Airgel is a kind of nanoporous network structure formed by the mutual aggregation of nanoscale colloidal particles, ...

AI Technical Summary

Problems solved by technology

[0004] General materials cannot meet the requirements of light weight and low dielectric constant. For example, the dielectric constant of polyimide is about 3.4, which is far from meeting the dielectric constant value required by submicron devices.

Inorganic airgel materials (such as SiO 2 Airgel) has a low dielectric constant and good thermal insulation performance, but its disadvantage is that it is brittle and fragile, and it will drop powder and slag during use, and the dust pollution is serious, which cannot meet the requirements of electronic devices without dust pollution. requirements

Polyimide airgel has good mechanical properties, light weight, and the dielectric constant can be as low as about 1.2, but its cost is expensive, and industrial production has certain limitations

[0005] The dielectric constant of the polyimide airgel obtained by MaryA.B. et al. by introducing a fluorine-containing structure is 1.24 [ACSAppl.Mater.InterfacesA-G]. conducive to industrial production

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