Low dielectric constant polyamide aerogel thermal insulation material and preparation method thereof

A low-dielectric-constant, polyamide gel technology is applied in the field of low-dielectric-constant polyamide aerogel insulation materials and their preparation, and can solve the problems of low-dielectric-constant, low-dielectric-constant, serious dust pollution, etc. , to achieve the effect of reducing the dielectric constant, good barrier effect and good heat insulation performance

Inactive Publication Date: 2015-12-02
NAT UNIV OF DEFENSE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] General materials cannot meet the requirements of light weight and low dielectric constant. For example, the dielectric constant of polyimide is about 3.4, which is far from meeting the dielectric constant value required by submicron devices.
Inorganic airgel materials (such as SiO 2 Airgel) has a low dielectric constant and good thermal insulation performance, but its disadvantage is that it is brittle and fragile, and it will drop powder and slag during use, and the dust pollution is se

Method used

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  • Low dielectric constant polyamide aerogel thermal insulation material and preparation method thereof
  • Low dielectric constant polyamide aerogel thermal insulation material and preparation method thereof
  • Low dielectric constant polyamide aerogel thermal insulation material and preparation method thereof

Examples

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Embodiment 1

[0032] In the first step, 4,4'-diaminodiphenyl ether (ODA) was dissolved in anhydrous N-methylpyrrolidone (NMP) under nitrogen protection, and terephthaloyl chloride (TPC) was added to the above solution , stirring under a nitrogen atmosphere to form a clear and transparent polyamide sol, wherein the molar ratio of TPC to ODA is 0.95:1.00;

[0033] In the second step, the cross-linking agent 1,3,5-benzenetricarboxylic acid chloride (BTC) is added to the sol obtained in the first step to obtain a cross-linked polyamide sol, which is stirred and reacted for 20 minutes under a nitrogen atmosphere, and the sol is poured Put it into the mold and let it stand for 30 minutes to treat the polyamide gel obtained by its gel. The obtained polyamide gel was aged in anhydrous NMP for 24 hours and then subjected to solvent replacement to obtain a polyamide gel after solvent replacement. Wherein the molar ratio of BTC to ODA is 0.022:1.000, and the solvent is replaced with a mixed solution ...

Embodiment 2

[0036] In the first step, 4,4'-diaminodiphenyl ether (ODA) was dissolved in anhydrous N,N-dimethylformamide (DMF) under nitrogen protection, and terephthaloyl chloride (TPC) was added into the above solution, stirred under a nitrogen atmosphere to form a clear and transparent polyamide sol, wherein the molar ratio of TPC to ODA is 0.95:1.00;

[0037] In the second step, the cross-linking agent 1,3,5-benzenetricarboxylic acid chloride (BTC) is added to the sol obtained in the first step to obtain a cross-linked polyamide sol, which is stirred and reacted for 20 minutes under a nitrogen atmosphere, and the sol is poured Put it into the mold and let it stand for 30 minutes to treat the polyamide gel obtained by its gel. The obtained polyamide gel was aged in anhydrous DMF for 24 hours and then subjected to solvent replacement to obtain a polyamide gel after solvent replacement. Wherein the molar ratio of BTC to ODA is 0.022:1.000, and the solvent is replaced with a mixed solutio...

Embodiment 3

[0040] In the first step, 4,4'-diaminodiphenyl ether (ODA) was dissolved in anhydrous N,N-dimethylacetamide (DMAc) under nitrogen protection, and terephthaloyl chloride (TPC) was added into the above solution, stirred under a nitrogen atmosphere to form a clear and transparent polyamide sol, wherein the molar ratio of TPC to ODA is 0.95:1.00;

[0041] In the second step, the cross-linking agent 1,3,5-benzenetricarboxylic acid chloride (BTC) is added to the sol obtained in the first step to obtain a cross-linked polyamide sol, which is stirred and reacted for 20 minutes under a nitrogen atmosphere, and the sol is poured Put it into the mold and let it stand for 30 minutes to treat the polyamide gel obtained by its gel. The obtained polyamide gel was aged in anhydrous DMAc for 24 hours and then subjected to solvent replacement to obtain a solvent-substituted polyamide gel. Wherein the molar ratio of BTC to ODA is 0.022:1.000, and the solvent is replaced with a mixed solution of...

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Abstract

The invention discloses a low dielectric constant polyamide aerogel thermal insulation material and a preparation method thereof. According to the low dielectric constant polyamide aerogel thermal insulation material, aromatic oxalyl chloride and aromatic diamine are taken as raw materials, polyamine or polybasic acyl chloride are taken as a cross-linking agent, a sol-to-gel process is adopted to prepare and obtain polyamide gel with a three-dimensional net structure, and the low dielectric constant polyamide aerogel thermal insulation material is obtained by carrying out CO2 supercritical drying on the polyamide gel. The aromatic oxalyl chloride is TPC or IPC or a mixture of the TPC and the IPC; the aromatic diamine is ODA or pPDA; the polyamine is TAB or OAPS; the polybasic acyl chloride is BTC. The thermal insulation material provided by the invention is relatively low in dielectric constant, low in density, low in heat conductivity and good in heat-insulating property; the preparation method provided by the invention has the advantages that a preparation process is simple, the raw materials are easy to obtain, the cost is relatively low, the requirement on environment is relatively low, a whole technological process is short in consumed time, and the material is suitable for industrial production.

Description

technical field [0001] The invention relates to a heat insulating material and a preparation method thereof, in particular to a low dielectric constant polyamide airgel heat insulating material and a preparation method thereof. Background technique [0002] In recent years, as the size of VLSI continues to shrink, the resistance and capacitance delays of metal interconnections increase approximately quadratically [Functional Materials, 2000, 31(5): 452-455], resulting in signal transmission delays and crosstalk , which directly affects the performance of the device. In order to reduce the increase in power consumption caused by signal transmission delay, crosstalk and dielectric loss, meet the high-speed signal transmission, and further improve the function of electronic circuits, there is an urgent need for materials with lower dielectric constants. [0003] Airgel is a kind of nanoporous network structure formed by the mutual aggregation of nanoscale colloidal particles, ...

Claims

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Application Information

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IPC IPC(8): C08G69/32C08J9/30C08J3/24C08L77/10C08K5/18C08K5/549C08K5/04
Inventor 冯军宗冯坚姜勇刚王鑫杜东轩
Owner NAT UNIV OF DEFENSE TECH
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