Oxidation-resistant high-heat-conductivity maleic-anhydride-grafted polyphenyl ether modified epoxy resin composite material for LED packaging and preparation method thereof

Abstract

The invention discloses an oxidation-resistant high-heat-conductivity maleic-anhydride-grafted polyphenyl ether modified epoxy resin composite material for LED packaging. According to the composite material, epoxy resin is modified through grafted polyphenyl ether; the polyphenyl ether obtained after maleic anhydride, nano titania and other raw materials are grafted maintains the excellent properties of low dielectric, low loss and high heat resistance, compatibility between the polyphenyl ether and the epoxy resin is improved, and the defects of traditional epoxy resin serving as a packaging material are effectively overcome; added nano copper and aquadag powder are good in adhesiveness, improve the heat conducting capacity, heat dissipating capacity and heat oxidation resisting capacity of the composite material, delay heat ageing of the material and also can shield certain electromagnetic radiation and delay ageing of the material. Serving as an LED packaging material, the prepared modified composite epoxy resin is excellent in overall performance, long in service life, more economical and more durable.

Description

technical field [0001] The invention relates to the technical field of LED packaging materials, in particular to a maleic anhydride grafted polyphenylene ether modified epoxy resin composite material with high thermal conductivity and oxidation resistance for LED packaging and a preparation method thereof. Background technique [0002] LED packaging refers to the packaging of light-emitting chips. LED packaging is different from other integrated circuit packaging. It not only needs to protect the chip, but also has light transmission. Therefore, there are special requirements for the performance of LED packaging materials. Requirements for packaging materials Mainly reflected in the need to extract as much light as possible from the chip, but also to reduce thermal resistance, to achieve the effect of improving heat dissipation and light output efficiency. With the rapid development of the LED industry, the demand for new high-quality packaging materials is increasingly stron...

AI Technical Summary

Problems solved by technology

[0002] LED packaging refers to the packaging of light-emitting chips. LED packaging is different from other integrated circuit packaging. It not only needs to protect the chip, but also has light transmission. Therefore, there are special requirements for the performance of LED packaging materials. Requirements for packaging materials Mainly reflected in the need to extract as much light as possible from the chip, but also to reduce thermal resistance, to achieve the effect of improving heat dissipation and light output efficiency. With the rapid development of the LED industry, the demand for new high-quality packaging materials is increasingly strong At present, the commonly used packaging materials mainly include epoxy resin and silicone resin. The cost of epoxy resin is low, and its UV resistance and aging resistance are poor, while silicone resin has excellent heat aging resistance, UV aging resistance, and light transmission. High pass rate and other advantages, but its production cost is high