Laser cladding process on the surface of copper substrate

Abstract

The laser cladding process of the copper substrate surface of the invention relates to a metal surface treatment process. Its purpose is to provide a cladding process, which uses specific cladding materials and specific laser parameters, so that the cladding layer formed on the surface of the copper substrate has a dense structure, no cracks, no pores, and is similar to copper A good metallurgical bond is formed on the substrate surface. The copper substrate surface laser cladding process of the present invention includes four steps of polishing, decontamination, laser cladding and cooling, wherein the wear-resistant and high-temperature resistant alloy material used in the laser cladding step is: Ni: 20% to 29%; Fe : 18% to 28%; C: 6 to 10%; Co: 10 to 23%; B: 2.5 to 4.5%; Si: 3.0 to 5.0%; the process parameters of the pulsed Nd:YAG laser are: the focal length of the focusing mirror f =200~250mm; cladding power P=800~1000W; light spot diameter D=2.5~4.0mm; cladding scanning speed V=20~45mm / s; lap rate 50%.

Description

technical field [0001] The invention relates to a metal treatment material and a treatment process. Background technique [0002] Laser cladding technology is one of the main methods for modifying the surface of materials. It uses high-energy-density laser beams to rapidly melt alloys with different compositions and properties on the surface of the substrate, forming an alloy on the surface of the substrate that has completely different composition and properties from the substrate. Properties of alloy layers during rapid solidification. [0003] Copper alloy laser cladding technology has the following difficulties: ① Copper alloy has good thermal conductivity, small specific heat capacity, poor wetting performance, hard oxide film on the surface, and high reflectivity to the spot, which makes the heat generated by the laser in its The surface is not easy to stay, it is not easy to form a high power density, and a molten pool cannot be formed; ②The performance difference be...

AI Technical Summary

Problems solved by technology

[0005] like figure 1 As shown, the cladding layer obtained by carbon dioxide laser cladding technology has a high dilution rate with the substrate, and the heat-affected zone is large, resulting in a decrease in the physical properties of the cladding layer, a high heat deformation rate of the substrate, and micro-trachoma and pores.

[0006] like figure 2 As shown, although the cladding layer and substrate dilution rate obtained by semiconductor laser cladding technology is lower than that of carbon dioxide laser cladding layer, the heat-affected zone is still large, resulting in a large thermal deformation of the substrate.

[0007] In short, there are still many problems in the current technology for cladding the surface of copper substrates, which cannot meet the needs of industrial production well.

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