Maleic anhydride-grafted polyphenyl ether modified epoxy resin composite used for LED packaging and preparation method thereof
An LED encapsulation and maleic anhydride technology, which is applied in the field of maleic anhydride grafted polyphenylene ether modified epoxy resin composite materials for LED encapsulation and its preparation, can solve the problem of high production cost, low cost, UV resistance and aging resistance. Poor capacity and other problems, to achieve the effect of long service life, large contact surface and good adsorption
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[0012] The composite material of this embodiment is prepared from the following raw materials in parts by weight: bisphenol A type epoxy resin 60, polyphenylene ether powder 18, hydroxyl silicone oil 0.1, nano titanium dioxide 4, nano zirconia 2, talc powder 1, the concentration is Appropriate amount of 40% hydrofluoric acid solution, 0.1 benzoyl peroxide, 0.4 maleic anhydride, 0.1 silane coupling agent, appropriate amount of chloroform, 0.01 antioxidant, and DDS20 curing agent.
[0013] Described a kind of preparation method of maleic anhydride grafted polyphenylene ether modified epoxy resin composite material for LED encapsulation, described preparation method is:
[0014] (1) Put the talcum powder into the hydrofluoric acid solution, filter after soaking for 40 minutes, wash with water until neutral, and dry completely to obtain the talcum powder with roughened surface for subsequent use;
[0015] (2) Pre-irradiate the polyphenylene ether powder first, and the irradiation ...
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