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Copper alloy passivation solution and passivation layer preparation method

A technology of copper alloy and passivation solution, which is applied in anodic oxidation and other directions, can solve the problems of film corrosion resistance and comprehensive application performance gap, and achieve the effects of low cost, convenient operation and improved corrosion resistance

Inactive Publication Date: 2016-01-20
725TH RES INST OF CHINA SHIPBUILDING INDAL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is still a certain gap between the corrosion resistance and comprehensive application performance of the film obtained after the treatment of these passivating agents and the treatment of chromium-containing passivating agents.

Method used

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  • Copper alloy passivation solution and passivation layer preparation method
  • Copper alloy passivation solution and passivation layer preparation method
  • Copper alloy passivation solution and passivation layer preparation method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] 1) Preparation of passivation solution: a solution containing cerium nitrate, sulfuric acid, potassium hydrogen phthalate and citric acid was used as passivation solution, and the concentration of each component was shown in Table 1.

[0025] Table 1 passivation solution composition

[0026]

[0027] When preparing the copper alloy passivation solution, prepare the substances other than methyl orthosilicate with distilled water according to the required amount, then add the required concentration of orthosilicate methyl ester to the prepared solution, and passivate the passivation solution with magnetic force Stirrer at 200r·min -1 Stir at a certain stirring speed for 5 minutes to make it fully hydrolyzed. During the stirring process, the temperature of the passivation solution is kept at 40°C with a constant temperature water bath.

[0028] 2) Preparation and pretreatment of the working electrode: the base material used in the present invention is copper sheet (cop...

Embodiment 2

[0031] 1) Preparation of passivation solution: a solution containing cerium nitrate, sulfuric acid, potassium hydrogen phthalate and citric acid was used as passivation solution, and the concentration of each component was shown in Table 2.

[0032] Table 2 passivation solution composition

[0033]

[0034] When preparing the passivation solution, prepare the substances other than methyl orthosilicate with distilled water according to the required amount, then add the required concentration of orthosilicate methyl ester to the prepared solution, and use a magnetic stirrer to mix the passivation solution At 200r·min -1 Stir at a certain stirring speed for 5 minutes to fully dissolve various substances. During the stirring process, the temperature of the passivation solution is kept at 60°C with a constant temperature water bath.

[0035] 2) Preparation and pretreatment of the working electrode: the base material used in the present invention is a nickel-copper alloy sheet. ...

Embodiment 3

[0038] 1) Preparation of passivation solution: a solution containing cerium nitrate, sulfuric acid, potassium hydrogen phthalate and citric acid was used as passivation solution, and the concentration of each component was shown in Table 3.

[0039] Table 3 passivation solution composition

[0040]

[0041] When preparing the passivation solution, prepare the substances other than methyl orthosilicate with distilled water according to the required amount, then add the required concentration of orthosilicate methyl ester to the prepared solution, and use a magnetic stirrer to mix the passivation solution At 200r·min -1 Stir at a certain stirring speed for 5 minutes to fully dissolve various substances. During the stirring process, the temperature of the passivation solution is kept at 50°C with a constant temperature water bath.

[0042] 2) Preparation and pretreatment of the working electrode: the base material used in the present invention is a tin-copper alloy sheet. Th...

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Abstract

The invention provides a copper alloy passivation solution and a passivation layer preparation method, and belongs to the field of metal material surface treatment. Each liter of the copper alloy passivation solution comprises 0.03-0.06mol of cerium nitrate, 0.005-0.007mol of ethyl orthosilicate, 1-3g of sulfuric acid, 3-6g of potassium biphthalate and 2-4g of citric acid; and a solvent is water. A passivation layer preparation method comprises the following steps: taking a copper alloy as a working electrode in a three-electrode system; putting the working electrode into the passivation solution; enabling the working electrode, a reference electrode and a counter electrode to form the conducing tri-electrode system; and carrying out anode oxidization on the working electrode under constant-current density to form the passivation layer. The passivation layer preparation method is simple and low in cost; and the prepared passivation layer can be applied to surface treatment of copper and a copper alloy product, so that the corrosion resistance of the copper alloy can be obviously improved, and the service life of the copper alloy is prolonged.

Description

technical field [0001] The invention relates to the field of surface treatment of metal materials, in particular to a copper alloy passivation solution and a method for preparing a passivation layer. Background technique [0002] Copper alloy is one of the main materials used to make various valves on ships in our country. This is because copper alloys have advantages such as high strength and good wear resistance. However, in practical applications, it is often found that the sealing surface of the copper valve is severely corroded, resulting in a large number of corrosion pits, which affects the sealing effect of the valve disc, and there are certain safety hazards. [0003] The standard electrode potential of copper is higher than that of hydrogen and lower than that of oxygen. Therefore, electrochemical corrosion in acidic solution generally does not occur hydrogen evolution reaction but oxygen depolarization reaction. Therefore, in non-oxidizing acid and air-free aci...

Claims

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Application Information

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IPC IPC(8): C25D11/34
Inventor 林志峰李相波刘峰许立坤
Owner 725TH RES INST OF CHINA SHIPBUILDING INDAL CORP
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