Printed circuit board base plate and preparation method thereof

Abstract

The invention provides a printed circuit board base plate and a preparation method thereof. The base plate comprises the components of bisphenol A benzoxazine, bisphenol A epoxy resin, silicon resin, p-aminophenol triglycidyl epoxy resin, N,N-dimethylformamide, alkali-free glass fiber cloth, triethylamine, silicic acid anhydride, phenol-formaldehyde resin, polyamide polyamine epichlorohydrin, methylbenzene, acetone, propyl gallate and copper foil. The preparation method comprises the following steps: heating to dissolve bisphenol A benzoxazine, N,N-dimethylformamide, triethylamine, methylbenzene, acetone and propyl gallate at first; then adding the other components except for the alkali-free glass fiber cloth and gold foil, and stirring to obtain a steeping glue solution; removing steeped alkali-free glass fiber cloth; and then baking to obtain a prepreg, superimposing the prepreg with the copper foil, and cooling in a press after heat and pressure preservation. The printed circuit board base plate provided by the invention has the advantages of good insulating property, heat resistance and caking property and low cost; moreover, the production process is relatively simple and is suitable for industrial production.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a printed circuit board substrate and a preparation method thereof. Background technique [0002] The printed circuit board is a structural element formed by insulating materials supplemented by conductor wiring, and serves as an electronic component such as [0003] The main support body for volumetric circuits, transistors, diodes, passive components and other various electronic parts when they are installed and plugged in has become an indispensable main component for most electronic products to achieve circuit interconnection. The most important and basic component of the printed circuit board is the substrate, which is a composite material composed of a dielectric layer and a high-purity conductor. With the rapid development of electronics and communication technology in the world today, the requirements for the printed circuit board substrate It is also getting higher...

AI Technical Summary

Problems solved by technology

The most important and basic component of the printed circuit board is the substrate, which is a composite material composed of a dielectric layer and a high-purity conductor. With the rapid development of electronics and communication technology in the world today, the requirements for the printed circuit board substrate It is also getting higher and higher, especially when electronic products represented by computers are developing at a high speed in the direction of high performance, printed circuit board substrates are required to have higher heat resistance, insulation, and comprehensive performance. Costs can also be reduced, and existing printed circuit board substrates can no longer meet these needs