Alumina ceramic low temperature brazing connection method
A technology of alumina ceramics and a connection method, which is applied in the field of low-temperature brazing and connection of alumina ceramics, can solve the problems of high welding temperature and low connection strength of joints, and achieves the effects of simple process, good industrial application prospect, and guaranteed reliability.
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specific Embodiment approach 1
[0017] Specific implementation mode 1: In this implementation mode, the low-temperature brazing connection method of alumina ceramics is carried out according to the following steps:
[0018] 1. According to the mass percentage, 60% to 85% of Bi 2 o 3 , 10% to 30% of B 2 o 3 , 2% to 10% of ZnO and 0.1% to 1.0% of SiO 2 Mix to obtain low melting point bismuth salt glass powder;
[0019] 2. Use a cutting machine to cut the alumina ceramics to be welded into shape, first use a diamond sand disc to mechanically polish the alumina ceramics to be welded, then place them in acetone for ultrasonic cleaning for 5 to 15 minutes, and finally use absolute ethanol to ultrasonically clean and dry After obtaining pretreated alumina ceramics;
[0020] 3. Evenly spread a layer of boron trioxide powder on the connection surface of the pretreated alumina ceramic obtained in step 2, then place it in a muffle furnace, and heat it to 800-950°C at a heating rate of 5-20°C / min. ℃, keep warm for...
specific Embodiment approach 2
[0024] Specific embodiment two: the difference between this embodiment and specific embodiment one is that in step one, 75% to 80% of Bi 2 o 3 , 10% to 15% of B 2 o 3 , 6%~9% ZnO, 0.1%~1.0% SiO 2 mix. Other steps and parameters are the same as those in Embodiment 1.
specific Embodiment approach 3
[0025] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that step 2 sequentially uses 500#, 1000#, 1500# and 2000# diamond discs to mechanically grind the alumina ceramics to be welded. Other steps and parameters are the same as those in Embodiment 1 or Embodiment 2.
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