Method for preparing copper/ceramic composite substrate on basis of low-melting-point glass powder

A low-melting glass and ceramic composite technology, applied in glass manufacturing equipment, glass molding, manufacturing tools, etc., can solve the problems of low SiC insulation, high raw material cost, residual carbon and other problems

A low-melting glass and ceramic composite technology, applied in glass manufacturing equipment, glass molding, manufacturing tools, etc., can solve the problems of low SiC insulation, high raw material cost, residual carbon and other problems

CN105439643AInactive Publication Date: 2016-03-30SINOTENG SILICA MATERIALS TECH (JIANGSU) CO LTD
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  • Method for preparing copper/ceramic composite substrate on basis of low-melting-point glass powder
  • Method for preparing copper/ceramic composite substrate on basis of low-melting-point glass powder
  • Method for preparing copper/ceramic composite substrate on basis of low-melting-point glass powder

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Embodiment Construction

[0051] refer to figure 1 , a method for preparing a copper / ceramic composite substrate based on low-melting glass powder according to the present invention, comprising the following steps:

[0052] 1) Preparation of low melting point glass powder

[0053] a. Preparation of ethyl orthosilicate prehydrolyzate: take acetic acid, ethanol, ethyl orthosilicate and water, mix under stirring for 30 to 40 minutes to obtain a clear ethyl orthosilicate prehydrolyzate;

[0054] b. Preparation of sol: take zinc acetate, barium acetate, and boric acid and place them in beakers respectively, add distilled water respectively in the beakers where zinc acetate and barium acetate are located, and stir until zinc acetate and barium acetate are completely dissolved to obtain clear zinc acetate solution and Barium acetate solution, add water or alcohol to the beaker where the boric acid is located to form a boric acid solution, then mix the boric acid solution, zinc acetate solution, barium acetat...

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Abstract

The invention provides a method for preparing a copper / ceramic composite substrate on the basis of low-melting-point glass powder. The method comprises the following steps: (1) preparing low-melting-point glass powder; (2) preparing an organic carrier; (3) preparing copper electronic paste; and (4) preparing a copper / ceramic composite substrate. According to the method, the BZBS glass powder which is prepared by employing a sol-gel method is used as a glass binder, and the copper powder is used as a functional phase, so that a copper thick film with good properties is obtained. The glass binder is good in wettability and relatively low in beginning wetting temperature, so that the thick film is sintered to be compacted, and good properties can be obtained. Meanwhile, the sintering temperature is kept for a period of time to melt the glass powder and to sufficiently wet the functional phase and the substrate, so that the increment of copper powder particles is facilitated, and the sintering is promoted.

Description

technical field [0001] The invention belongs to the field of electronics industry, and in particular relates to a method for preparing a copper / ceramic composite substrate based on low melting point glass powder. Background technique [0002] Ceramic substrate refers to copper foil directly bonded to alumina (Al 2 o 3 ) or a special process plate on the surface of an aluminum nitride (AlN) ceramic substrate (single-sided or double-sided). The produced ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. ability. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. [0003] A common method for preparing copper / ceramic composite substrates is to deposit a layer of copper thick fi...

Claims

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Application Information

Patent Timeline
30 Mar 2016
Publication
CN105439643A
IPC
C04B41/88; C03C12/00; C03B19/12
CPC
C04B41/5127; C03B19/12; C03C12/00; C04B41/009; C04B41/88
Inventors
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