Method for preparing copper/ceramic composite substrate on basis of low-melting-point glass powder

Abstract

The invention provides a method for preparing a copper / ceramic composite substrate on the basis of low-melting-point glass powder. The method comprises the following steps: (1) preparing low-melting-point glass powder; (2) preparing an organic carrier; (3) preparing copper electronic paste; and (4) preparing a copper / ceramic composite substrate. According to the method, the BZBS glass powder which is prepared by employing a sol-gel method is used as a glass binder, and the copper powder is used as a functional phase, so that a copper thick film with good properties is obtained. The glass binder is good in wettability and relatively low in beginning wetting temperature, so that the thick film is sintered to be compacted, and good properties can be obtained. Meanwhile, the sintering temperature is kept for a period of time to melt the glass powder and to sufficiently wet the functional phase and the substrate, so that the increment of copper powder particles is facilitated, and the sintering is promoted.

Description

technical field [0001] The invention belongs to the field of electronics industry, and in particular relates to a method for preparing a copper / ceramic composite substrate based on low melting point glass powder. Background technique [0002] Ceramic substrate refers to copper foil directly bonded to alumina (Al 2 o 3 ) or a special process plate on the surface of an aluminum nitride (AlN) ceramic substrate (single-sided or double-sided). The produced ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. ability. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. [0003] A common method for preparing copper / ceramic composite substrates is to deposit a layer of copper thick fi...

AI Technical Summary

Problems solved by technology

[0005] Although SiC single crystal has high thermal conductivity, the thermal conductivity of polycrystalline SiC ceramic substrate is less than 70W / (m K), and SiC has low insulation degree, large dielectric constant, and poor high-frequency characteristics. not many applications

However, it also has its own disadvantages such as high cost of raw materials, long process time, easy shrinkage and deformation, and residual carbon.

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