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A kind of copper-based solder for tungsten/copper welding and preparation method thereof

A technology of copper-based solder and copper welding, which is applied in the direction of welding equipment, welding/cutting medium/material, welding medium, etc., can solve the service requirements that affect the heat transfer capacity of ITER devices to components, and the thermal conductivity of brazing alloys deteriorates , reduce the thermal conductivity of weldments and other issues, to achieve good mechanical properties and thermal fatigue resistance, good wettability, and good melting properties

Active Publication Date: 2019-02-01
SOUTHWESTERN INST OF PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the low thermal conductivity component Mn in the PM-72 type solder (its thermal conductivity λ=0.0782W / (cm K), while the matrix element Cu reaches 4.01W / (cm K), and W reaches 1.74W / (cm K)) content is high, the atomic percentage is as high as 40%, the thermal conductivity of the brazing alloy becomes poor, the overall thermal conductivity of the weldment is reduced, and the service requirements of the ITER device for the heat transfer capability of the components are affected.
At the same time, the high Mn content of the alloy is also easy to cause composition segregation, resulting in the precipitation of a certain Mn-containing brittle phase along the interface between the weld and the base material, which deteriorates the brazing quality sharply

Method used

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  • A kind of copper-based solder for tungsten/copper welding and preparation method thereof
  • A kind of copper-based solder for tungsten/copper welding and preparation method thereof
  • A kind of copper-based solder for tungsten/copper welding and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Cu 74 mn 25 Cr 0.5 Si 0.5 Composition microcrystalline solder, non-consumable arc melting and water-cooled copper roll melt rapid quenching method to prepare copper-based solder, the specific steps are as follows:

[0038] (1) Ingredients: Cu 71 mn 28 Cr 0.5 Si 0.5 Atomic percentage components are converted into weight percentage components; high-purity components are used, and the ingredients are weighed according to the mass percentage of the alloy;

[0039] (2) Melting: Mix the weighed metal raw materials in a water-cooled copper crucible of a non-consumable arc melting furnace, melt under the protection of high-purity argon, then turn the alloy ingot up and down, and repeat the melting 5 times , to obtain an alloy ingot with uniform composition;

[0040] (3) After crushing the alloy ingot, put it into the quartz tube, the size of the nozzle of the quartz tube is: length 12mm, width 1mm. Put the charged quartz tube in the induction heating coil, use the vacu...

Embodiment 2

[0043] Cu 71 mn 28 Cr 0.25 Si 0.75 Composition microcrystalline solder, non-consumable arc melting and water-cooled copper roll melt rapid quenching method to prepare copper-based solder, the specific steps are as follows:

[0044] (1) Add Cu 71 mn 28 Cr 0.25 Si 0.75 Atomic percentage components are converted into weight percentage components; high-purity components are used, and the ingredients are weighed according to the mass percentage of the alloy;

[0045] (2) Melting: Mix the weighed metal raw materials in a water-cooled copper crucible of a non-consumable arc melting furnace, melt under the protection of high-purity argon, then turn the alloy ingot up and down, and repeat the melting 5 times , to obtain an alloy ingot with uniform composition;

[0046] (3) After crushing the alloy ingot, put it into the quartz tube, the size of the nozzle of the quartz tube is: length 12mm, width 1mm. Put the charged quartz tube in the induction heating coil, use the vacuum co...

Embodiment 3

[0049] Cu 74 mn 25 Cr 0.5 Si 0.5 Component brazing filler metal is prepared by vacuum suction casting and cold rolling methods, and the specific steps are as follows:

[0050] (1) Ingredients: Cu 74 mn 25 Cr 0.5 Si 0.5 Atomic percentage components are converted into weight percentage components; high-purity components are used, and the ingredients are weighed according to the mass percentage of the alloy;

[0051] (2) Melting: Mix the weighed metal raw materials in a water-cooled copper crucible of a non-consumable arc melting furnace, melt under the protection of high-purity argon, then turn the alloy ingot up and down, and repeat the melting 5 times , to obtain an alloy ingot with uniform composition;

[0052] (3) Vacuum suction casting: Put the smelted alloy ingot into the water-cooled copper mold of the non-consumable arc melting furnace, and remelt it under the protective atmosphere of pure argon. 30mm×3mm×(30-50)mm alloy plate is prepared by casting and rapid co...

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Abstract

The invention belongs to a Cu-based filler alloy suitable for tungsten / copper brazed connection and a preparing method of the Cu-based filler alloy, and particularly relates to copper-based brazing filler metal for tungsten / copper welding and a preparing method of the brazing filler metal. According to the copper-based brazing filler metal for tungsten / copper welding, the chemical composition of the filler alloy is Cu100-x-y-zMnxSiyCrz, wherein according to the atom percentages of x, y and z, x is larger than or equal to 25% and smaller than or equal to 33%, y is larger than 0% and smaller than or equal to 1%, and z is larger than 0% and smaller than or equal to 1%. The copper-based brazing filler metal has the beneficial effects that novel Cu-enriched (larger than 70%) single-phase solid solution brazing filler is developed, the composition uniformity is good, no segregation exists, the texture is small and fine, the preparing technology is simple and reliable, and reproducibility is good; new foil strip brazing filler has the good melting characteristic, and the wettability of the new foil strip brazing filler and a tungsten and copper base material is good; and a soldered joint has the high heat conductivity, good mechanical property and good anti-thermal-fatigue property.

Description

technical field [0001] The invention belongs to a Cu-based solder alloy suitable for tungsten / copper brazing connection and a preparation method thereof, in particular to a copper-based solder alloy for tungsten / copper welding and a preparation method thereof. Background technique [0002] The main technologies for tungsten / copper connection are: electron beam welding, hot isostatic pressing, plasma spraying, sintering infiltration, active metal casting and brazing, etc. Among them, brazing is a welding process that connects the base metal through liquid solder; generally, only the solder melts during the brazing process; because of its small influence on the base metal, low requirements on the size and shape of the weldment, and Low cost and other characteristics, the technology has been widely used. [0003] As an essential material for brazing, brazing filler metal is a key factor affecting the brazing process and brazing quality. SEKI first tried to use Ni-based amorph...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K35/40
Inventor 练友运刘翔封范
Owner SOUTHWESTERN INST OF PHYSICS