Novel method for modifying GaAs material surface
A gallium arsenide and modification technology, applied in the field of modification of the surface of gallium arsenide material, can solve the problems of contamination, difficult control of process accuracy, easy adhesion, etc., to avoid secondary contamination and good controllability performance and stability, the effect of simplifying process steps
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Embodiment 1
[0027] Step 1. Put the GaAs semiconductor laser bar into the vacuum chamber and pump the vacuum.
[0028] Step 2. Inject 30-100 sccm of Ar gas into the vacuum chamber.
[0029] Step 3. After the air pressure in the vacuum chamber is stabilized at 20-50mtorr, apply a radio frequency power of 10-70W.
[0030] Step 4. After 10-20 minutes, stop applying RF power, stop feeding Ar gas, and vacuum to 2*10^ -4 mtorr.
[0031] Step 5, feed Ar gas and NH into the vacuum chamber 3 Gas (ie corrosive gas) mixed gas, in which Ar gas 20-50sccm, NH 3 Gas 20-70sccm.
[0032] Step 6. After the air pressure in the chamber is stabilized at 20-50mtorr, apply a radio frequency power of 10-50W.
[0033] Step 7. After 5-10 minutes, stop applying RF power, stop feeding Ar gas and NH 3 Gas, vacuum to 2*10^ -4 mtorr.
[0034] Step 8, feed N into the vacuum chamber 2 Gas, the flow rate is 30-100sccm.
[0035] Step 9. After the air pressure in the vacuum chamber is stabilized at 20-50mtorr, appl...
Embodiment 2
[0042] Step 1. Put the GaAs epitaxial wafer into the vacuum chamber and pump the vacuum.
[0043] Step 2. Inject 30-100 sccm of Ar gas into the vacuum chamber.
[0044]Step 3. After the air pressure in the vacuum chamber is stabilized at 20-50mtorr, apply a radio frequency power of 10-70W.
[0045] Step 4. After 10-20 minutes, stop applying RF power, stop feeding Ar gas, and vacuum to 2*10^ -4 mtorr.
[0046] Step 5, feed oxygen and CCl into the vacuum chamber 2 f 2 Gas (that is, corrosive gas) mixed gas, wherein the oxygen flow range is 10-40sccm, and the CCl2F2 gas flow range is 30-100sccm.
[0047] Step 6. After the air pressure in the chamber is stabilized at 20-50mtorr, apply a radio frequency power of 10-50W.
[0048] Step 7. After 5-10 minutes, stop applying radio frequency power, and stop feeding oxygen and CCl2F2 gas.
[0049] Step 8, feed N into the vacuum chamber 2 Gas, the flow rate is 50-100sccm.
[0050] Step 9. After the air pressure in the vacuum chambe...
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