High-dielectric-coefficient polyimide thin film
A technology of polyimide film and high dielectric coefficient, which is applied in the field of high dielectric coefficient polyimide film and its preparation, and can solve the problem of lower dielectric constant, lower mechanical properties of polyimide film, and lower service life and other problems, to achieve high dielectric constant, excellent flexibility, and maintain the effect of high temperature resistance
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[0017] Example 1
[0018] A preparation method of a high dielectric constant polyimide film is carried out according to the following steps:
[0019] (1) 1 part of fullerene, 1 part of lapis lazuli powder and 2 parts of nano-montmorillonite were dispersed in 50 parts of N'N-dimethylacetamide according to parts by weight, and ultrasonically dispersed for 7 hours to make a dispersion liquid ;
[0020] (2) under the condition of 30-80 ℃, add 30 parts of equimolar amounts of 3,3'-dimethylbenzidine and 1,2,5,6-naphthalenetetracarboxylic dianhydride to the above dispersion liquid, Mix evenly, react for 18 hours, and make slurry;
[0021] (3) Coat the above-mentioned slurry on the surface of the smooth plate with a uniform thickness film, and after the solvent is completely evaporated, imidize at 150° C. for 6 hours to obtain a high-dielectric-coefficient polyimide film.
[0022] The polyimide film prepared above was tested for the dielectric properties of the sample using a broa...
Example Embodiment
[0023] Example 2
[0024] A preparation method of a high dielectric constant polyimide film is carried out according to the following steps:
[0025] (1) 2 parts of fullerenes, 1 part of lapis lazuli powder and 1 part of nano-montmorillonite were dispersed in 50 parts of N'N-dimethylacetamide according to parts by weight, and ultrasonically dispersed for 6 hours to make a dispersion liquid ;
[0026] (2) Under the condition of 30-80°C, add 35 parts of m-phenylenediamine and 3,3',4,4'-benzophenone tetracarboxylic dianhydride in equimolar amount to the above dispersion liquid, and mix them uniformly , and reacted for 18 hours to make slurry;
[0027] (3) Coat the above-mentioned slurry on the surface of the smooth plate to form a film with a uniform thickness, and after the solvent is completely evaporated, imidize at 180° C. for 7 hours to obtain a high-dielectric coefficient polyimide film.
[0028] The polyimide film prepared above was tested for the dielectric propertie...
Example Embodiment
[0029] Example 3
[0030] A preparation method of a high dielectric constant polyimide film is carried out according to the following steps:
[0031] (1) 2 parts of fullerenes and 2 parts of nano-montmorillonite are dispersed in 50 parts of N'N-dimethylformamide according to parts by weight, and ultrasonically dispersed for 6 hours to make dispersion;
[0032] (2) Under the condition of 30-80°C, add 28 parts of m-phenylenediamine and 3,3',4,4'-benzophenone tetracarboxylic dianhydride in equimolar amounts to the above dispersion liquid, and mix uniformly , reacted for 15 hours to make slurry;
[0033] (3) Coat the above-mentioned slurry on the surface of the smooth plate to form a film with a uniform thickness, and after the solvent is completely evaporated, imidize at 160° C. for 5 hours to obtain a high-dielectric-coefficient polyimide film.
[0034] The polyimide film prepared above was tested for the dielectric properties of the sample using a broadband dielectric imped...
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