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High-dielectric-coefficient polyimide thin film

A technology of polyimide film and high dielectric coefficient, which is applied in the field of high dielectric coefficient polyimide film and its preparation, and can solve the problem of lower dielectric constant, lower mechanical properties of polyimide film, and lower service life and other problems, to achieve high dielectric constant, excellent flexibility, and maintain the effect of high temperature resistance

Active Publication Date: 2016-05-04
JIANGSU YABAO INSULATION MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Introducing graphene and nano-barium carbonate in the process of routinely preparing polyimide, although the dielectric constant has been improved, the mechanical properties of the polyimide film are reduced, and the dielectric constant decreases with the increase of service time. reduced, reduced service life
Patent 201310226961.X discloses a polyimide high-dielectric composite material and its preparation method. Modified graphene and nano-barium carbonate are used, and the mechanical properties of the polyimide film also decrease, and the dielectric constant increases with use. Problems that decrease with time

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A kind of preparation method of high dielectric constant polyimide film is carried out according to the following steps:

[0019] (1) Disperse 1 part of fullerene, 1 part of lapis lazuli powder and 2 parts of nano-montmorillonite in 50 parts of N'N-dimethylacetamide according to parts by weight, and ultrasonically disperse for 7 hours to make a dispersion ;

[0020] (2) Add 30 parts of equimolar amounts of 3,3'-dimethylbenzidine and 1,2,5,6-naphthalene tetracarboxylic dianhydride into the above dispersion liquid at 30-80°C, Mix evenly and react for 18 hours to make a slurry;

[0021] (3) Apply the above slurry on the surface of a smooth board to form a thin film with uniform thickness. After the solvent evaporates completely, imidize at 150° C. for 6 hours to obtain a high dielectric coefficient polyimide film.

[0022] The polyimide film of above-mentioned preparation utilizes the dielectric property of broadband dielectric resistance test sample, at test frequency 1...

Embodiment 2

[0024] A kind of preparation method of high dielectric constant polyimide film is carried out according to the following steps:

[0025] (1) Disperse 2 parts of fullerene, 1 part of lapis lazuli powder and 1 part of nano-montmorillonite in 50 parts of N'N-dimethylacetamide according to parts by weight, and ultrasonically disperse for 6 hours to make a dispersion ;

[0026] (2) Add a total of 35 parts of m-phenylenediamine and 3,3',4,4'-benzophenone tetracarboxylic dianhydride in equimolar amounts into the above dispersion liquid at 30-80°C and mix well , reacted for 18 hours to make a slurry;

[0027] (3) Apply the above slurry on the surface of a smooth board to form a thin film with uniform thickness. After the solvent evaporates completely, imidize at 180° C. for 7 hours to obtain a high dielectric coefficient polyimide film.

[0028] The polyimide film of above-mentioned preparation utilizes the dielectric property of broadband dielectric resistance test sample, at test ...

Embodiment 3

[0030] A kind of preparation method of high dielectric constant polyimide film is carried out according to the following steps:

[0031] (1) According to parts by weight, 2 parts of fullerenes, 2 parts of nano-montmorillonite are dispersed in 50 parts of N'N-dimethylformamide, and ultrasonically dispersed for 6 hours to make a dispersion;

[0032] (2) At 30-80°C, add 28 parts of m-phenylenediamine and 3,3',4,4'-benzophenone tetracarboxylic dianhydride in equimolar amounts into the above dispersion, and mix well , reacted for 15 hours to make a slurry;

[0033] (3) Apply the above slurry on the surface of a smooth board to form a thin film with uniform thickness. After the solvent evaporates completely, imidize at 160° C. for 5 hours to obtain a high dielectric coefficient polyimide film.

[0034] The polyimide film of above-mentioned preparation utilizes the dielectric property of broadband dielectric resistance test sample, at test frequency 10 3 Under Hz conditions, the di...

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Abstract

The invention discloses a high-dielectric-coefficient polyimide thin film and a preparation method thereof. Polyimide obtained through polycondensation of dicarboxylic anhydride monomers and diamine monomers serves as a base body and is doped with, by weight, 1-3% of fullerene, 0-3% of lasurite powder and 0-3% of nanometer montmorillonite. The polyimide thin film has a high dielectric constant of 12 to 18 and is an excellent material for manufacturing a capacitor, the mechanical strength and all physical indexes of the polyimide thin film are the same as those of an ordinary polyimide thin film, high temperature resistance, high strength and high stability are kept, and the advantage of excellent flexibility is achieved; the polyimide thin film is durable in use, keeps the high dielectric constant for a long time, and is simple in preparation method and suitable for large-scale production and application.

Description

technical field [0001] The invention relates to a polyimide film, in particular to a high dielectric coefficient polyimide film and a preparation method thereof. Background technique [0002] At present, with the widespread use of electrical appliances, the use of capacitors is increasing rapidly. The most important part of capacitors is the dielectric insulation layer material, which requires a high dielectric coefficient. Polyimide is a kind of polymer material with high temperature resistance, high strength, high stability, and excellent flexibility. It is often used to prepare dielectric insulating layers and body films. However, the dielectric coefficient of ordinary polyimide film is not high, and with the prolongation of use time, the dielectric coefficient will decrease, resulting in unstable performance of electronic devices, which cannot meet the demand. [0003] Patent 201410459609.5 discloses a polyimide composite material with high dielectric constant and its p...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K3/00C08K3/34C08K3/04C08K3/22C08K3/30C08G73/10C08J5/18
CPCC08G73/1007C08G73/1067C08J5/18C08J2379/08C08K3/04C08K3/34C08K3/346C08K2201/011C08L2201/08C08L2203/16C08L2203/20C08L79/08
Inventor 徐伟伟王勇王世林张克杰李亚平梁永飞
Owner JIANGSU YABAO INSULATION MATERIAL
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