LED filament preparation method

A technology of LED filaments and LED chips, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of complex manufacturing process, inconvenience of large-angle light emission, and unsightly appearance, and achieve long service life, easy promotion and application, Good bonding strength

Inactive Publication Date: 2016-05-04
CHONGQING XINDE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to meet different needs, especially the application of plant growth lamps is becoming more and more extensive. However, due to the limitations of traditional ordinary LED combinations, complex manufacturing processes, high power consumption, and unsightly appearance, and LED traditional packaging products are not It is convenient to realize large-angle light emission, which is not conducive to large-scale and extensive use in plant growth lighting. In the prior art, when packaging LED chips, a mixture of phosphor powder and adhesive agent is often used as the packaging outer coating layer.

Method used

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Embodiment 1

[0020] The embodiment is basically as attached figure 1 , 2 As shown: the preparation method of the LED filament in this embodiment includes a strip-shaped transparent substrate 2, a metal bracket 1 fixed on both ends of the transparent substrate, a plurality of blue LED chips 3 are fixed on the transparent substrate, and the plurality of blue LED chips form at least one row through For the LED strings on the transparent substrate, the blue LED chips of each LED string are connected in series by wires; the blue LED chips located at both ends 4 of the transparent substrate are respectively connected to the support by wires 5;

[0021] The outside of the transparent substrate is also wrapped with a red phosphor layer 6 , and the red phosphor layer is formed by mixing red phosphor and a binder.

[0022] When in use, connect the metal brackets at both ends of the transparent substrate to the positive and negative poles of the power supply, and the two metal brackets are electrica...

Embodiment 2

[0033]The bonding agent also includes the following raw materials prepared in parts by weight: 72 parts of epoxy resin, 18-22 parts of polyphenylene ether powder, 4 parts of methylphenyl silicone oil, 0.2-0.4 of nano-zinc sulfide, with a mass concentration of 30 -40% nano ceramic powder transparent liquid 6-8, nano titanium dioxide 4-5, benzoyl peroxide 0.1-0.2, maleic anhydride 0.4-0.5, silane coupling agent 0.1-0.2, chloroform antioxidant 0.01-0.02 parts, curing agent 20-25 parts.

[0034] The preparation method is:

[0035] (1) Pre-irradiate the polyphenylene ether powder. The irradiation conditions are: use an electron accelerator as the irradiation source, and use β-rays to irradiate under normal temperature, normal pressure, and air atmosphere. The pre-irradiation dose range 20kGy, to obtain pre-irradiated polyphenylene ether material;

[0036] (2) Put the pre-irradiated polyphenylene ether material, maleic anhydride, silane coupling agent, nano-titanium dioxide, benzo...

Embodiment 3

[0043] The preparation method of described methyl phenyl silicone oil is as follows:

[0044] The components weighed in parts by weight are: 30 parts of methylphenyl mixed rings, 30 parts of octamethylcyclotetrasiloxane, 20 parts of tetramethylcyclotetrasiloxane, tetramethyldivinyl disiloxane 10 parts of oxane, 5 parts of potassium hydroxide silicon alkoxide, 5 parts of organic silicon phosphate.

[0045] Then, prepare methylphenyl silicone oil: (1) add methylphenyl mixed ring body, octamethylcyclotetrasiloxane, tetramethylcyclotetrasiloxane, tetramethyldivinyldisiloxane In the reactor, dehydrate for 2 hours at a temperature of 60°C and a pressure of -0.1MPa; (2) raise the temperature of the dehydrated mixture to 180°C, add potassium hydroxide silicon alkoxide catalyst, and dehydrate at a temperature of 185°C Equilibrium reaction for 8 hours; (3) After the reaction is completed, add organosilicon phosphate in proportion to the reactor for neutralization for 2.5 hours, then ra...

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Abstract

The invention discloses a filament preparation method and particularly relates to an LED filament preparation method. The LED filament preparation method comprises steps of making a substrate, fixing blue LED chips, preparing a packaging material and the like. The packaging material is formed by mixing red fluorescence powder and an adhesive agent. The adhesive agent is prepared by the following raw materials by weight: 72 parts of epoxy resin, 18 to 22 parts of polystyrene ether powder, 4 parts of methyl phenyl silicone oil, 0.2 to 0.4 parts of nano zinc sulfide, 6 to 8 parts of nano ceramic powder transparent liquid with a mass concentration of 30 to 40%, 4 to 5 parts of nano titanium dioxide, 0.1 to 0.2 parts of benzoyl peroxide, 0.4 to 0.5 parts of maleic anhydride, 0.1 to 0.2 parts of a silane coupling agent, 0.01 to 0.02 parts of a chloroform antioxidant and 20 to 25 parts of a curing agent. The LED filament produced by the method of the invention overcomes technical defects of small emergence angle and low light out-coupling efficiency in the prior art, and the produced LED filament can realize all-angle light emission.

Description

technical field [0001] The invention relates to an LED filament, in particular to a preparation method of the LED filament. Background technique [0002] The light environment is one of the important physical environmental factors that are indispensable for the growth and development of plants. Through the adjustment of light quality, controlling the formation of plants is an important technology in the field of facility cultivation; plant growth lights are more environmentally friendly and energy-saving. LED plant lights give plants Provide photosynthesis, promote plant growth, shorten the time for plants to flower and bear fruit, and increase production. In modern construction, plant growth lights are an indispensable product for crops. [0003] In order to meet different needs, especially the application of plant growth lamps is becoming more and more extensive. However, due to the limitations of traditional ordinary LED combinations, complex manufacturing processes, hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/56H01L25/075
CPCH01L33/48H01L25/0753H01L33/486H01L33/502H01L33/56H01L2933/0033H01L2933/005
Inventor 鲁永忠
Owner CHONGQING XINDE ELECTRONICS
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