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HDI laminated plate blind buried hole copper plating bath

A technology of copper plating bath and blind buried vias, which is applied in the field of copper plating baths for blind buried vias of HDI laminates, can solve the problems of high production cost, increased coating brittleness, fracture failure, etc., and achieve high yield and lower production threshold Effect

Active Publication Date: 2016-09-21
INST OF ANALYSIS GUANGDONG ACAD OF SCI (CHINA NAT ANALYTICAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the expensive reverse pulse horizontal electroplating equipment is commonly used, which not only has high production costs, but also because the supporting electrolyte for pulse horizontal electroplating production mainly relies on ferrous sulfate to improve the depth capability to achieve hole filling, and due to the existence of iron elements, the plating layer Brittle, often fracture failure

Method used

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  • HDI laminated plate blind buried hole copper plating bath
  • HDI laminated plate blind buried hole copper plating bath
  • HDI laminated plate blind buried hole copper plating bath

Examples

Experimental program
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Effect test

Embodiment 1

[0025] In this embodiment, the water-soluble copper salt takes copper sulfate pentahydrate as an example, the brightener takes sodium dipropylene sulfide as an example, and the wetting agent takes five-block polyoxyethylene / polyoxypropylene ether as an example, and all components are Analytical pure.

[0026] Penta-block polyoxyethylene / polyoxypropylene ether is a penta-block copolymer CH with butanol as the starting material and ethylene oxide (referred to as EO) and propylene oxide (referred to as PO) as homopolymers. 3 CH 2 CH 2 CH 2 (EO) 8 (PO) 15 (EO) 10 (PO) 15 (EO) 8 .

[0027] The chemical name of the leveler is N-(3-diethylene glycol-2 hydroxy)propyl N,N-dimethylallyl ammonium chloride, and the synthesis method is as follows: diethylene glycol (1.0 mole) React with epichlorohydrin (1.02 mol) at 50-60°C to obtain the product, and then react with N,N-dimethyl N-allylamine (1.02 mol) at 70-80°C for quaternization reaction to obtain the product, The yield was 95...

Embodiment 2

[0043] With reference to Example 1, the difference is that the copper plating bath is made up of the following mass proportioning raw materials: copper sulfate pentahydrate 200g / L, mass fraction is 98% sulfuric acid 40g / L, sodium chloride 0.05g / L, two Sodium dipropylenesulfonate sulfide 1.5㎎ / L, block polyether 300㎎ / L, N-(3-diethylene glycol-2 hydroxy)propyl N,N-dimethylallyl ammonium chloride 350 ㎎ / L, isophthalic acid 1.0㎎ / L, and the balance is water. After 60 minutes of hole filling and electroplating copper, the hole filling rate is 88%. For the effect of blind and buried hole filling, see figure 1 .

Embodiment 3

[0045] With reference to Example 1, the difference is that the copper plating bath is made up of the following mass ratio raw materials: copper sulfate pentahydrate 240g / L, mass fraction is 98% sulfuric acid 60g / L, sodium chloride 0.12g / L, two Sodium dipropylenesulfonate sulfide 4.0㎎ / L, block polyether 450㎎ / L, N-(3-diethylene glycol-2 hydroxy)propyl N,N-dimethylallyl ammonium chloride 550 ㎎ / L, isophthalic acid 3.0㎎ / L, and the balance is water. After 60 minutes of hole filling and electroplating copper, the hole filling rate is 100%. For the effect of blind and buried hole filling, see figure 1 .

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Abstract

The invention discloses a leveling agent for a HDI laminated plate blind buried hole copper plating bath expressed by a formula 1 and the HDI laminated plate blind buried hole copper plating bath. The HDI laminated plate blind buried hole copper plating bath uses water soluble copper salt, sulfuric acid and chlorine ions as main components, and is added with the leveling agent for the HDI laminated plate blind buried hole copper plating bath expressed by the formula 1. The HDI laminated plate blind buried hole copper plating bath further comprises a brightening agent and a wetting agent, is high in hole filling rate and fast in hole filling speed, has no need to use expensive reverse pulse horizontal electroplating equipment, largely reduces the HDI circuit board production threshold, and solves the rupture problem caused by increment of brittleness of a plating layer due to existence of iron elements in realization of hole filling by electrolyte matched with the pulse horizontal electroplating production through improvement of the depth capacity by dint of ferrous sulfate.

Description

Technical field: [0001] The invention relates to the technical field of electroplating, in particular to a copper plating bath for blind buried holes of HDI laminates. Background technique: [0002] HDI circuit boards are also called High Density Interconnectors. The laminated board is a circuit board that uses a step-by-step stacking method for interlayer interconnection. The communication holes between the layers of the laminate do not penetrate other layers, and high-density interconnection can be realized because it does not occupy the wiring area of ​​other layers. High-density interconnect (HDI) manufacturing is currently the most cutting-edge multilayer board manufacturing technology and is the fastest growing field in the printed circuit board industry. In order to solve the high-density wiring and high-frequency transmission brought about by the development of high-speed transmission, multi-function, and high integration of electronic products, it is required that...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/18
CPCC25D3/38C25D5/18
Inventor 张卫东
Owner INST OF ANALYSIS GUANGDONG ACAD OF SCI (CHINA NAT ANALYTICAL
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