High-performance bonded rare earth magnetostrictive material and preparation method thereof
A preparation process and rare earth magnetic technology, which is applied in the manufacture/assembly of magnetostrictive devices, material selection for magnetostrictive devices, device material selection, etc., can solve the problems of high manufacturing cost, high brittleness, low resistance, etc. , to achieve the effects of low production cost, enhanced tensile strength, and increased frequency of use
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0026] A high-performance bonded rare-earth magnetostrictive material formulation consists of the following raw materials in parts by weight:
[0027] 3 parts of terbium metal, 7 parts of dysprosium metal, 15 parts of metal iron, 10 parts of binder, 30 parts of acetone solution, 10 parts of curing agent, and 10 parts of coupling agent.
[0028] The binder selects solid epoxy resin; the mass fraction of the acetone solution is 67%; the curing agent selects polyethylene polyamine; the coupling agent selects KH-550 silane coupling agent.
[0029] Its preparation process comprises the following steps:
[0030] (1) Mix metal terbium, metal dysprosium, and metal iron according to the molar mass ratio of 3:7:15, and place the prepared materials in a vacuum non-consumable electric arc furnace for argon melting to obtain Alloy ingot, furnace vacuum degree is 6×10 -3 Pa, and remelted 3 times at 950°C;
[0031] (2) Under the protection of gasoline, the alloy ingot is pulverized by an ...
Embodiment 2
[0036] A high-performance bonded rare-earth magnetostrictive material formulation consists of the following raw materials in parts by weight:
[0037] 4 parts of metal terbium, 8 parts of metal dysprosium, 17 parts of metal iron, 12 parts of binder, 35 parts of acetone solution, 12 parts of curing agent, and 13 parts of coupling agent.
[0038] The binder is solid epoxy resin; the mass fraction of the acetone solution is 70%; the curing agent is polyethylene polyamine; the coupling agent is KH-550 silane coupling agent.
[0039] Its preparation process comprises the following steps:
[0040] (1) Mix metal terbium, metal dysprosium, and metal iron according to the molar mass ratio of 4:8:17, and place the prepared material in a vacuum non-consumable electric arc furnace for argon melting to obtain Alloy ingot, furnace vacuum degree is 6×10 -3 Pa, and remelted 3 times at 950°C;
[0041] (2) Under the protection of gasoline, the alloy ingot is pulverized by an ingot disc mill ...
Embodiment 3
[0046] A high-performance bonded rare-earth magnetostrictive material formulation consists of the following raw materials in parts by weight:
[0047] 5 parts of metal terbium, 9 parts of metal dysprosium, 19 parts of metal iron, 14 parts of binder, 37 parts of acetone solution, 11 parts of curing agent, and 14 parts of coupling agent.
[0048] The binder selects solid epoxy resin; the mass fraction of the acetone solution is 67%; the curing agent selects polyethylene polyamine; the coupling agent selects KH-550 silane coupling agent.
[0049] Its preparation process comprises the following steps:
[0050] (1) Mix metal terbium, metal dysprosium, and metal iron according to the molar mass ratio of 5:9:19, and place the prepared material in a vacuum non-consumable electric arc furnace for argon-filled melting to obtain Alloy ingot, furnace vacuum degree is 6×10 -3 Pa, and remelted 3 times at 950°C;
[0051] (2) Under the protection of gasoline, the alloy ingot is pulverized ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com