High-temperature-resistant high-toughness photo-cured resin for photo-curing 3D printing

A photocurable resin, 3D printing technology, applied in the field of laser rapid prototyping photocurable resin materials, can solve the problems of incompatibility, high temperature resistance, etc., and achieve the effects of low viscosity, good heat resistance, and low shrinkage

Inactive Publication Date: 2017-02-08
SHAANXI HENGTONG INTELLIGENT MACHINE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Light-curing 3D printing technology (also known as laser rapid prototyping technology), which controls the laser beam by a computer, uses the data provided by the CAD system, uses the laser beam to solidify the liquid resin layer by layer, and creates three-dimensional objects by layer-by-layer bonding. , and has been widely used in the manufacturing field due to its high precision, high efficiency, the ability to manufacture complex and fine parts, and the utilization rate of raw materials is close to 100%. The light-curing resin materials put forward new requirements, and domestic and foreign countries are also developing light-curing resins suitable for different fields to meet the application requirements. In recent years, light-curing 3D printing technology has gradually entered the mold industry, such as for hot pressing film, injection molding The core of the mold, etc., all of which require the resin to have excellent heat resistance and strength. However, the glass transition temperature of the existing photocurable 3D printing resins is mostly 40-60°C. The link density is closely related. Generally, the higher the degree of crosslinking, the better the heat resistance and the greater the hardness and brittleness of the resin. Therefore, high temperature resistance and high toughness are usually not compatible.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A high-temperature-resistant and high-toughness photocurable resin for photocurable 3D printing. The mass fraction of its raw materials consists of: 38% epoxy prepolymer, 16% unsaturated prepolymer, 14% reactive diluent, 13% % high temperature resistant crosslinking agent, 15% silicone rubber acrylate, 4% photoinitiator; epoxy prepolymer is 3,4-epoxycyclohexyl-3,4-epoxycyclohexyl carboxylate, The unsaturated prepolymer is polyester acrylate, the reactive diluent is a mixture of 8% 1,6-hexanediol diacrylate and 6% trimethylolpropane triacrylate, and the high temperature resistant crosslinking agent is three (Glycidyl)isocyanurate acrylate, photoinitiator is 1.2% free radical photoinitiator 2-hydroxy-2-methyl-1-phenylacetone and 2.8% cationic photoinitiator triarylhexafluoro Mixture of sulfonium antimonates.

[0022] Mix and stir the above components to completely dissolve the photoinitiator and stir evenly to obtain a light yellow transparent liquid, that is, to obtain ...

Embodiment 2

[0025] A high-temperature-resistant and high-toughness photocurable resin for photocurable 3D printing. The mass fraction of raw materials consists of: 30% epoxy prepolymer, 21% unsaturated prepolymer, 12% reactive diluent, 15% % high temperature resistant crosslinking agent, 18% silicone rubber acrylate, 4% photoinitiator, epoxy prepolymer is 3,4-epoxycyclohexyl-3,4-epoxycyclohexyl carboxylate, The unsaturated prepolymer is polyester acrylate, the reactive diluent is a mixture of 6% 1,6-hexanediol diacrylate and 6% trimethylolpropane triacrylate, and the high temperature resistant crosslinking agent is three (Glycidyl)isocyanurate acrylate, photoinitiator is 2.5% free radical photoinitiator 2-hydroxy-2-methyl-1-phenylacetone and 1.5% cationic photoinitiator triarylhexafluoro Mixture of sulfonium antimonates.

[0026] Mix and stir the above components to completely dissolve the photoinitiator and stir evenly to obtain a light yellow transparent liquid, that is, to obtain a hi...

Embodiment 3

[0029] A high-temperature-resistant and high-toughness photocurable resin for photocurable 3D printing. The mass fraction of its raw materials consists of: 42% epoxy prepolymer, 14.5% unsaturated prepolymer, 12% reactive diluent, 12% % high temperature resistant crosslinking agent, 16% silicone rubber acrylate, 3.5% photoinitiator, epoxy prepolymer is 3,4-epoxycyclohexyl-3,4-epoxycyclohexyl carboxylate, The unsaturated prepolymer is aliphatic urethane acrylate, the reactive diluent is a mixture of 7% dipropylene glycol diacrylate and 5% 3-ethyl-3-oxetanemethanol, and the high temperature resistant crosslinking agent is three (Epoxypropyl) isocyanuric acid acrylate, the photoinitiator is the mixture of 1% free radical photoinitiator benzoin dimethyl ether and 2.5% cationic photoinitiator triaryl hexafluoroantimonate sulfonium salt.

[0030] Mix and stir the above components to completely dissolve the initiator and stir evenly to obtain a light yellow transparent liquid, that is...

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Abstract

The invention discloses high-temperature-resistant high-toughness photo-cured resin for photo-curing 3D printing. The high-temperature-resistant high-toughness photo-cured resin is prepared from the following raw materials in percentage by mass: 20-50% of an epoxy prepolymer, 10-30% of an unsaturated prepolymer, 10-40% of an active dilution agent, 5-25% of a high-temperature-resistant cross-linking agent, 10-30% of silicone rubber acrylic ester and 2-6% of a photoinitiator. The substances are uniformly mixed and stirred to completely dissolve the photoinitiator, and thus a light yellow transparent liquid is prepared, that is, the high-temperature-resistant high-toughness photo-cured resin. The high-temperature-resistant high-toughness photo-cured resin disclosed by the invention has the characteristics of being high in temperature and high in toughness, and in addition, has the characteristics of being low in viscosity, low in shrinkage rate, high in curing speed and the like which meet photo-curing 3D printing molding processes.

Description

technical field [0001] The invention relates to the technical field of laser rapid prototyping photocurable resin materials, in particular to a high-temperature-resistant and high-toughness photocurable resin for photocurable 3D printing. Background technique [0002] Light-curing 3D printing technology (also known as laser rapid prototyping technology), which controls the laser beam by a computer, uses the data provided by the CAD system, uses the laser beam to solidify the liquid resin layer by layer, and creates three-dimensional objects by layer-by-layer bonding. , and has been widely used in the manufacturing field due to its high precision, high efficiency, the ability to manufacture complex and fine parts, and the utilization rate of raw materials is close to 100%. The light-curing resin materials put forward new requirements, and domestic and foreign countries are also developing light-curing resins suitable for different fields to meet the application requirements. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F291/06C08F222/14C08F222/20C08F2/48C08G59/24
CPCC08F2/48C08F283/008C08F283/01C08F283/124C08G59/24C08F222/103C08F222/102
Inventor 张莹莹段玉岗曹毅康小青同治强石长全
Owner SHAANXI HENGTONG INTELLIGENT MACHINE
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