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Polyimide material and preparing method and application thereof

A technology of polyimide and polyimide film, which is applied in the direction of chemical instruments and methods, lamination, layered products, etc., can solve the problems that it is difficult to produce with adhesive-free flexible copper clad laminates, and achieve material saving, Good hot-melt performance, the effect of simplifying the process

Active Publication Date: 2017-03-22
NANJING ZHONGHONG RUNNING ADVANCED MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The dielectric constant of general polyimide is usually 3.0 or above, although there are research reports of polyimide materials with a dielectric constant less than 3.0 (Jin Chengjiu, Wang Xingyuan, Wang Xiaogong and Yaning, "Chemical method to prepare low dielectric constant Research progress of polyimide”, [Polymer Bulletin], 2012, 10, p.1-p.6), but these materials are difficult to be used in the production of adhesive-free flexible copper clad laminates

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] At room temperature, 0.56mol of 3,5-diaminobenzoic acid-4'-biphenyl ester, 0.14mol of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 0.3mol The 4,4'-diaminobiphenyl was dissolved in N-methylpyrrolidone, and after it was completely dissolved, 0.328mol of benzophenone-4,4'-bis(4-thio-1,8-naphthalene was added Diformic anhydride) with 0.492mol of 3,3',4,4'-tetracarboxylic diphenyl ether dianhydride, 0.1mol of pyromellitic dianhydride and 0.1mol of 3,3',4,4'-tetra Formic acid biphenyl dianhydride, the total solid content is controlled at 15%, the temperature is lowered to 10° C., and the stirring is continued for 6 hours to obtain a polyimide precursor solution. The polyamic acid precursor solution was coated on a glass plate with a coating thickness of 0.086mm. Remove the solvent in the temperature range of 80-150°C, and then cure it in the range of 200-350°C in a muffle furnace to obtain a polyimide film; quickly raise the temperature of the obtained polyimide film to 400°C, ...

Embodiment 2

[0049] At room temperature, 0.28mol of 3,5-diaminobenzoic acid-4'-biphenyl ester, 0.14mol of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 0.1mol The 4,4'-diaminodiphenylmethane was dissolved in dimethyl sulfoxide, and after it was completely dissolved, 0.328mol of benzophenone-4,4'-bis(4-thio-1,8-naphthalene was added Diformic anhydride) and 0.984mol of 3,3',4,4'-tetracarboxylic diphenyl ether dianhydride, 0.1mol of 4,4'-bis(3,4-dicarboxyphenoxy)diphenylsulfone anhydride and 0.2mol of 4,4'-bis(3,4-dicarboxyphenoxy)diphenylsulfide dianhydride, the total solids content was controlled at 20%, the temperature was lowered to 5°C, and stirring was continued for 10 hours , to obtain a polyimide precursor solution. The polyamic acid precursor solution was coated on a glass plate with a coating thickness of 0.086mm. Remove the solvent in the temperature range of 80-150°C, and then cure it in the range of 200-350°C in a muffle furnace to obtain a polyimide film; quickly raise the tempera...

Embodiment 3

[0052] At room temperature, 0.42mol of 3,5-diaminobenzoic acid-4'-biphenyl ester, 0.14mol of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 0.2mol The 3,3'-diaminodiphenyl sulfone was dissolved in N,N-dimethylformamide, and after it was completely dissolved, 0.328mol of benzophenone-4,4'-bis(4-thio-1 ,8-naphthalene dicarboxylic anhydride) with 2.952mol of 3,3',4,4'-tetracarboxylic diphenyl ether dianhydride, 0.2mol of 1,4-bis(3,4-dicarboxylic acid phenoxy) Phthalic anhydride and 0.2mol of 3,3',4,4'-tetracarboxylic acid benzophenone dianhydride, the total solid content is controlled at 18%, the temperature is lowered to 15°C, and the stirring is continued for 8 hours to obtain polyimide Amine precursor solution. The polyamic acid precursor solution was coated on a glass plate with a coating thickness of 0.086 mm. Remove the solvent in the temperature range of 80-150°C, and then cure it in the range of 200-350°C in a muffle furnace to obtain a polyimide film; quickly raise the temp...

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PUM

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Abstract

The invention discloses a polyimide material. The preparing method of the material comprises the steps of adding other aromatic diamine monomers, then adding diphenyl ketone-4, 4'-double(4-thio-1, 8-naphthalene anhydride) and 3, 3', 4, 4'-tetracarboxydiphthalic ether dianhydride, as well as other diphenyl ketone-4, 4'-double(4-thio-1, 8-naphthalene anhydride) and other 3, 3', 4, 4'-tetracarboxydiphthalic ether dianhydride, and then adding an organic solvent into the mixture of 3, 5-diaminobenzoic-4'-diphenyl ester and 2, 2'-bis[4-(4-aminophenoxy)phenyl]propane(bapp) to react to obtain polyimide precursor solution; smearing the polyimide precursor solution on a glass plate, removing the solvent, and performing solidification to obtain a polyimide film; heating the polyimide film to 400-420 DEG C, and keeping for 3-10 minutes; afterwards, reducing the temperature of the polyimide film to room temperature to obtain the polyimide material. The invention further discloses the application of the polyimide material.

Description

technical field [0001] The application belongs to the field of printed circuit board insulating substrates, and more specifically, relates to a polyimide material, its preparation method and application Background technique [0002] Flexible copper clad laminate (FCCL) is the basic material of flexible printed circuit board (FPC). In recent years, compared with rigid circuit boards, flexible printed circuit boards have many irreplaceable advantages such as flexibility, low power consumption, low voltage, light weight, and easy space design, and the demand for FCCL has grown rapidly. . According to the presence or absence of adhesive, FCCL can be divided into flexible copper clad laminates with glue (or three-layer board, 3F-FCCL) and flexible copper clad laminates without glue (or two-layer board, 2F-FCCL) Two categories. The existence of adhesives in traditional three-layer boards will not only hinder the improvement of the overall electrical performance, heat resistance...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08J5/18C08G73/10B32B15/08B32B15/20B32B37/06B32B37/10
CPCB32B15/08B32B15/20B32B37/06B32B37/10C08G73/1064C08G73/1071C08J5/18C08J2379/08C08L79/08C08L2203/16
Inventor 徐勇
Owner NANJING ZHONGHONG RUNNING ADVANCED MATERIAL TECH CO LTD
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