Novel heat dissipation insulating composite material and preparation method therefor

An insulating composite material, a new type of technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of reduced LED life, low thermal conductivity, reduced thermal conductivity, etc., to achieve great market competitiveness, low thermal expansion coefficient, The effect of improving the mechanical strength

Active Publication Date: 2017-03-22
南京劲峰洋光电科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] (1) LED chip materials include gallium nitride (GaN), aluminum oxide (Al 2 o 3 ), sapphire and other materials, the thermal expansion coefficient is about 7ppm/K, so it is required that the matching heat dissipation substrate material should have the same thermal expansion coefficient, while the thermal expansion coefficient of traditional metal materials (such as aluminum, copper, etc.) is 25ppm respectively /K and 17ppm/K, far greater than 7ppm/K, will break at the connection when the temperature rises, resulting in increased thermal resistance and reduced LED life; although ceramic materials have similar thermal expansion coefficients (7.2ppm/K), but The thermal conductivity is not high, and the application is still limited;
[0006] (2) The heat dissipation substrate material of LED requires high thermal conductivity. Although traditional metal materials (such as aluminum with a thermal conductivity of 220W/m K and copper with a thermal conductivity of 390W/m K) have high thermal conductivity performance, but because it does not have insulation, it needs to be u

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  • Novel heat dissipation insulating composite material and preparation method therefor
  • Novel heat dissipation insulating composite material and preparation method therefor
  • Novel heat dissipation insulating composite material and preparation method therefor

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[0047] Example: Preparation and performance test of a novel heat-dissipating and insulating composite material.

[0048] The artificial graphite purchased on the market is pretreated by conventional methods and cut into block graphite preforms of 300mm×240mm×140mm (density 1.8g / cm 3 ; The average interplanar spacing d002 is 0.32nm; the pore diameter is 2μm; the porosity is 15%).

[0049] Cut the above block graphite preform along the 300mm direction into 240mm (length) × 140mm (width) × 1.5mm (thickness) graphite sheets (200 pieces), buy 240mm (length) × 140mm (width) × 0.38 from the market mm (thick) alumina ceramic sheets (100 sheets), and arranged in a sandwich structure in the manner of 2 layers of graphite sheets and 1 layer of alumina ceramic sheets, and an iron plate (thickness of 0.2mm) to isolate multiple sandwich structures , After fixing the whole with a metal frame (such as Figure 5 (Shown) placed in the mold.

[0050] Put the metal aluminum in a crucible furnace and h...

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Abstract

The invention belongs to the technical field of a functional material, and relates to a novel heat dissipation insulating composite material and a preparation method therefor. Specifically, the novel heat dissipation insulating composite material consists of graphite, aluminum and ceramic, and adopts a sandwich structure, wherein a ceramic sheet layer is positioned in the middle, and graphite/aluminum composite sheet layers are positioned on the two sides; and the graphite/aluminum composite sheet layers consist of a graphite sheet layer with pores and aluminum for filling the pores. Integral forming of the graphite, metal aluminum and ceramic is realized by a high-pressure forging method to form the brand new composite material; the composite material has high thermal conduction, high insulativity and enhanced mechanical strength; and raw materials are low in coat, and the preparation method is simple and easy to implement, so that the composite material has high market competitiveness.

Description

technical field [0001] The invention belongs to the technical field of functional materials, and relates to a novel heat-dissipating and insulating composite material and a preparation method thereof. Background technique [0002] For the development of semiconductor integrated circuit chips, LED lighting, IGBT and other fields, the problem of heat dissipation has plagued the industry for many years. As the chip integration becomes higher and higher, how to solve the heat dissipation problem becomes more and more prominent. Due to the constraints of space and chip size, it is destined to only adopt a passive cooling strategy, that is, after the heating body generates heat, the heat is effectively and quickly taken away by using materials with better heat dissipation performance to ensure that the chip can withstand the upper limit of the temperature. work normally within. [0003] As far as the LED lighting industry is concerned, the current development trend is high-power...

Claims

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Application Information

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IPC IPC(8): H01L33/64
CPCH01L33/641H01L2933/0075
Inventor 杨晓峰
Owner 南京劲峰洋光电科技有限公司
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