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Alumina thermal conductive composite material and preparation method thereof

A heat-conducting composite material and alumina technology, applied in the field of heat-conducting materials, can solve the problems of high surface energy, small particle size of nano-alumina, easy to aggregate into agglomerates, etc., and achieve the effects of improving stability, good heat conduction and improving dispersibility.

Inactive Publication Date: 2017-04-19
邹小凤
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the small particle size and high surface energy of nano-alumina particles, they are in a thermodynamically unstable state and are easily aggregated into clusters, which affects the practical application effect of nano-alumina particles.

Method used

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Comparison scheme
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Embodiment Construction

[0020] A kind of aluminum oxide heat-conducting composite material, it is made up of the raw material of following parts by weight:

[0021] Dimethylimidazole 0.3, nano-alumina 10, 3,5 diaminobenzoic acid 1, pyridine 0.3, triphenyl phosphite 2, lithium chloride 0.1, silane coupling agent kh5600.6, neodymium acetylacetonate 0.7, methyl Hexahydrophthalic anhydride 1.6, epoxy resin 610180, hydroxyethylidene diphosphonic acid 0.6, ammonium metaborate 2, microcrystalline paraffin 5, glyceryl stearate 0.3, ethylene bisstearamide 0.4, polyvinyl alcohol 2. Calcium propionate 1.

[0022] A preparation method of the described aluminum oxide thermally conductive composite material, comprising the following steps:

[0023] (1) Insulate and stir the above-mentioned polyvinyl alcohol at 90°C for 6 minutes, add the above-mentioned dimethylimidazole, continue to insulate and stir for 3 minutes, add the above-mentioned nano-alumina, and stir to room temperature to obtain pretreated alumina; ...

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PUM

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Abstract

The invention discloses an alumina thermal conductive composite material, which is composed of the following raw materials (by weight): 0.3-0.5 part of dimethyl imidazole, 10-13 parts of nano-alumina, 1-2 parts of 3,5-diaminobenzoic acid, 0.3-0.7 part of pyridine, 2-3 parts of triphenyl phosphate, 0.1-0.2 part of lithium chloride, 0.6-1 part of a silane coupling agent kh560, 0.7-1 part of neodymium acetylacetonate, 1.6-2 parts of methyl hexahydrophthalic anhydride, 80-90 parts of epoxy resin 6101, 0.6-1 part of 1-hydroxyethylidene-1,1-diphosphonic acid, 2-3 parts of ammonium metaborate, 5-7 parts of microcrystalline wax, 0.3-1 part of glyceryl stearate, 0.4-1 part of ethylene bis-stearamide, 2-4 parts of polyvinyl alcohol and 1-2 parts of calcium propionate. By addition of microcrystalline wax, polyvinyl alcohol, etc. in the composite material, dispersity of the filling material in epoxy resin can be effectively raised and stability of the finished product can be enhanced.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to an alumina heat-conducting composite material and a preparation method thereof. Background technique [0002] Epoxy resin has excellent mechanical properties, electrical properties, bonding properties and thermal stability, and has been widely used in aerospace, electronic and electrical fields. There are many kinds of epoxy resins, and the alicyclic epoxy resin is selected in this work. Since the epoxy group in the molecular structure of the alicyclic epoxy resin does not come from propylene oxide, the epoxy group is directly connected to the alicyclic ring, so Compared with bisphenol A epoxy resin, cycloaliphatic epoxy resin has many advantages such as good thermal stability, excellent electrical insulation performance and weather resistance, and high safety. However, the thermal conductivity of epoxy resin is low (0.23 W / m K), and the heat dissipation perfor...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L91/06C08L29/04C08K13/06C08K9/04C08K9/06C08K9/02C08K3/22C09K5/14
CPCC08K2201/011C08L63/00C08L2205/03C09K5/14C08L91/06C08L29/04C08K13/06C08K9/08C08K9/06C08K9/04C08K9/02C08K2003/2227
Inventor 邹小凤
Owner 邹小凤
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