Formula of radiating fin material for computer mainboard

A computer motherboard and heat sink technology, applied in the computer field, can solve the problems of ineffective heat energy evacuation, limited heat energy absorption efficiency, high temperature, etc. Effects of heat and stored thermal energy

Inactive Publication Date: 2017-05-10
JISHOU UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the workload of the computer involves various fields, especially some fields that require the computer to be turned on for a long time. The fan cools down and keeps the circuit board running normally. The function of the heat sink used on the circuit board of the current computer is to absorb the heat energy generated by the electronic components on the circuit board to the heat sink, and then the temperature on the heat sink is cooled by the cooling fan. Discharge, most of the current heat sinks are made of aluminum or aluminum alloy, the efficiency of absorbing heat energy is limited, it is easy to cause a large amount of heat energy not to be effectively evacuated, resulting in the phenomenon of circuit board burning

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] A heat sink material formula for a computer motherboard, comprising: 0.035 parts of silver, 5.5 parts of aluminum, 4 parts of copper, 0.015 parts of gold, 0.25 parts of lead, 2 parts of epoxy resin, 2 parts of silicone grease, and polyvinyl alcohol according to the weight ratio 2 parts, 5 parts of polyester, 1 part of polyacrylonitrile, 8 parts of phenolic resin, 3 parts of aminoplast, 10 parts of silicate, 6 parts of graphite powder, 5 parts of carbon fiber, 2 parts of aminopropyltriethoxysilane, 3.8 parts of methyltriethoxysilane, 1.5 parts of fatty alcohol polyoxyethylene ether, 0.6 part of alkylphenol polyoxyethylene ether, 1 part of polyvinyl alcohol, 0.8 parts of hydrophobically modified polyacrylate, 2 parts of fatty amine, polyvinyl alcohol 1 part of amide, 4 parts of dimethyl glutarate, 0.3 part of dimethyl adipate, 12 parts of xanthan gum and 3 parts of magnesium aluminum silicate.

Embodiment 2

[0014] A heat sink material formula for a computer motherboard, comprising: 0.065 parts of silver, 8.5 parts of aluminum, 12 parts of copper, 0.035 parts of gold, 0.58 parts of lead, 4 parts of epoxy resin, 4 parts of silicone grease, and polyvinyl alcohol in proportion by weight 4 parts, 8 parts of polyester, 2 parts of polyacrylonitrile, 16 parts of phenolic resin, 6 parts of aminoplast, 12 parts of silicate, 12 parts of graphite powder, 10 parts of carbon fiber, 5 parts of aminopropyltriethoxysilane, 6.6 parts of methyltriethoxysilane, 4.4 parts of fatty alcohol polyoxyethylene ether, 1.2 parts of alkylphenol polyoxyethylene ether, 3 parts of polyvinyl alcohol, 1.6 parts of hydrophobically modified polyacrylate, 3 parts of fatty amine, polyvinyl alcohol 2 parts of amide, 8 parts of dimethyl glutarate, 1.2 parts of dimethyl adipate, 16 parts of xanthan gum and 5 parts of magnesium aluminum silicate.

Embodiment 3

[0016] A heat sink material formula for a computer motherboard, comprising: 0.045 parts of silver, 6.5 parts of aluminum, 8 parts of copper, 0.025 parts of gold, 0.45 parts of lead, 3 parts of epoxy resin, 3 parts of silicone grease, and polyvinyl alcohol according to the weight ratio 3 parts, 6 parts of polyester, 1.5 parts of polyacrylonitrile, 12 parts of phenolic resin, 5 parts of aminoplast, 11 parts of silicate, 9 parts of graphite powder, 7.5 parts of carbon fiber, 3.5 parts of aminopropyltriethoxysilane, 4.6 parts of methyltriethoxysilane, 2.8 parts of fatty alcohol polyoxyethylene ether, 0.9 parts of alkylphenol polyoxyethylene ether, 2 parts of polyvinyl alcohol, 1.2 parts of hydrophobically modified polyacrylate, 2.5 parts of fatty amine, polyvinyl alcohol 1.5 parts of amides, 6 parts of dimethyl glutarate, 0.75 parts of dimethyl adipate, 14 parts of xanthan gum and 4 parts of magnesium aluminum silicate.

[0017] In the actual operation process, the cooling fins ma...

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PUM

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Abstract

The invention relates to a formula of a radiating fin material for a computer mainboard. The formula comprises silver, aluminum, copper, gold, lead, epoxy resin, silicone grease, polyvinyl alcohol, polyester, polyacrylonitrile, phenolic resin, amino plastics, silicate, graphite powder, carbon fibers, aminopropyltriethoxysilane, methyl triethoxy silane, fatty alcohol polyoxyethylene ether, alkyl phenol polyoxyethylene ether, polyvinyl alcohol, hydrophobically modified polyacrylate, fatty amine, polyamide, dimethyl glutarate, dimethyl adipate, xanthan gum and aluminium-magnesium silicate in parts by weight. A radiating fin manufactured by the radiating fin material formula provided by the invention can greatly enhance the effects of heat absorption, storage and evacuation of the radiating fin, so as to avoid the burning phenomenon of a circuit board.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a heat sink material formula for a computer motherboard. Background technique [0002] Computer (computer), commonly known as computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations, logical calculations, and also has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed. Composed of hardware systems and software systems, computers without any software installed are called bare metal. It can be divided into five categories: supercomputers, industrial control computers, network computers, personal computers, and embedded computers. More advanced computers include biological computers, photonic computers, and quantum computers. [0003] In the prior art, the workload of the computer involves various f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L5/00C08L63/00C08L29/04C08L67/00C08L61/06C08K13/04C08K7/06C08K3/04C08K3/08C08K3/34
CPCC08L5/00C08K2201/014C08L61/06C08L2205/025C08L2205/035C08L63/00C08L29/04C08L67/00C08K13/04C08K7/06C08K3/04C08K2003/0806C08K2003/0812C08K2003/085C08K2003/0831C08K3/08C08K3/34
Inventor 钟键
Owner JISHOU UNIVERSITY
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