Formula of radiating fin material for computer mainboard
A computer motherboard and heat sink technology, applied in the computer field, can solve the problems of ineffective heat energy evacuation, limited heat energy absorption efficiency, high temperature, etc. Effects of heat and stored thermal energy
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Embodiment 1
[0012] A heat sink material formula for a computer motherboard, comprising: 0.035 parts of silver, 5.5 parts of aluminum, 4 parts of copper, 0.015 parts of gold, 0.25 parts of lead, 2 parts of epoxy resin, 2 parts of silicone grease, and polyvinyl alcohol according to the weight ratio 2 parts, 5 parts of polyester, 1 part of polyacrylonitrile, 8 parts of phenolic resin, 3 parts of aminoplast, 10 parts of silicate, 6 parts of graphite powder, 5 parts of carbon fiber, 2 parts of aminopropyltriethoxysilane, 3.8 parts of methyltriethoxysilane, 1.5 parts of fatty alcohol polyoxyethylene ether, 0.6 part of alkylphenol polyoxyethylene ether, 1 part of polyvinyl alcohol, 0.8 parts of hydrophobically modified polyacrylate, 2 parts of fatty amine, polyvinyl alcohol 1 part of amide, 4 parts of dimethyl glutarate, 0.3 part of dimethyl adipate, 12 parts of xanthan gum and 3 parts of magnesium aluminum silicate.
Embodiment 2
[0014] A heat sink material formula for a computer motherboard, comprising: 0.065 parts of silver, 8.5 parts of aluminum, 12 parts of copper, 0.035 parts of gold, 0.58 parts of lead, 4 parts of epoxy resin, 4 parts of silicone grease, and polyvinyl alcohol in proportion by weight 4 parts, 8 parts of polyester, 2 parts of polyacrylonitrile, 16 parts of phenolic resin, 6 parts of aminoplast, 12 parts of silicate, 12 parts of graphite powder, 10 parts of carbon fiber, 5 parts of aminopropyltriethoxysilane, 6.6 parts of methyltriethoxysilane, 4.4 parts of fatty alcohol polyoxyethylene ether, 1.2 parts of alkylphenol polyoxyethylene ether, 3 parts of polyvinyl alcohol, 1.6 parts of hydrophobically modified polyacrylate, 3 parts of fatty amine, polyvinyl alcohol 2 parts of amide, 8 parts of dimethyl glutarate, 1.2 parts of dimethyl adipate, 16 parts of xanthan gum and 5 parts of magnesium aluminum silicate.
Embodiment 3
[0016] A heat sink material formula for a computer motherboard, comprising: 0.045 parts of silver, 6.5 parts of aluminum, 8 parts of copper, 0.025 parts of gold, 0.45 parts of lead, 3 parts of epoxy resin, 3 parts of silicone grease, and polyvinyl alcohol according to the weight ratio 3 parts, 6 parts of polyester, 1.5 parts of polyacrylonitrile, 12 parts of phenolic resin, 5 parts of aminoplast, 11 parts of silicate, 9 parts of graphite powder, 7.5 parts of carbon fiber, 3.5 parts of aminopropyltriethoxysilane, 4.6 parts of methyltriethoxysilane, 2.8 parts of fatty alcohol polyoxyethylene ether, 0.9 parts of alkylphenol polyoxyethylene ether, 2 parts of polyvinyl alcohol, 1.2 parts of hydrophobically modified polyacrylate, 2.5 parts of fatty amine, polyvinyl alcohol 1.5 parts of amides, 6 parts of dimethyl glutarate, 0.75 parts of dimethyl adipate, 14 parts of xanthan gum and 4 parts of magnesium aluminum silicate.
[0017] In the actual operation process, the cooling fins ma...
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