Modified graphene/polyimide heat-conducting composite material and preparation method thereof

Abstract

The invention provides a modified graphene / polyimide heat-conducting composite material and a preparation method thereof. The preparation method comprises the following steps: by taking 1,3-bis(4-aminophenoxy)benzene and 4,4'-oxydiphthalic dianhydride as raw materials and taking modified graphene prepared from monoamino-polyhedral oligomeric silsesquioxane surface functionalization modified graphene oxide as a heat-conducting filler, preparing a CMG (chemically modified graphene) / polyamic acid heat-conducting composite fiber felt through an in-situ polymerization and electrostatic spinning method, preparing a CMG / polyimide heat-conducting composite material through a hot imidization and die pressing forming process, and realizing high heat conductivity of a PI (polyimide) resin matrix at a low filling amount of the CMG heat-conducting filler.

Description

technical field

[0001] The invention relates to a polymer-based heat-conducting composite material. Background technique

[0002] Polyimide (PI) is a polymer material with excellent comprehensive performance. It has many advantages such as excellent high and low temperature resistance, good chemical corrosion resistance, outstanding electrical insulation and high dimensional stability, and has been widely used It is used in the fields of aviation, spaceflight and microelectronics. However, the thermal conductivity of the PI body is poor (the thermal conductivity λ is 0.20W / mK). , Improving the thermal conductivity of the PI resin matrix is ​​the key.

[0003] There are relatively few studies on PI thermally conductive composite materials at home and abroad, and most of them use thermally conductive fillers to improve the thermal conductivity of the PI resin matrix. However, the filled PI thermally conductive composite materials prepared by traditional methods are mostly p...